Inventor · disambiguated record
Bunji Yasumura
Also filed as: YASUMURA BUNJI
17 granted patents·3 pending applications·51 citations·filing 2009–2019
92Inventor score
Top patents by PatentIndex Score
20 records- 0192US10566255B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2019·Granted Feb 18, 2020·2 cites·11 claims
- 0292US8101433B2Semiconductor device and manufacturing method of the sameAKIBA TOSHIHIKO·Filed 2009·Granted Jan 24, 2012·15 cites·13 claims
- 0388US9053954B2Method for manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Jun 9, 2015·8 cites·20 claims
- 0487US9646901B2Semiconductor device with bond pad wiring lead-out arrangement avoiding bond pad probe mark areaRENESAS ELECTRONICS CORP·Filed 2016·Granted May 9, 2017·3 cites·16 claims
- 0586US8946705B2Semiconductor deviceYASUMURA BUNJI·Filed 2010·Granted Feb 3, 2015·10 cites·23 claims
- 0682US9490218B2Method for manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Nov 8, 2016·3 cites·16 claims
- 0778US9824944B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Nov 21, 2017·2 cites·21 claims
- 0878US8912540B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Dec 16, 2014·2 cites·15 claims
- 0977US9911673B2Semiconductor device with bond pad wiring lead-out arrangement avoiding bond pad probe mark areaRENESAS ELECTRONICS CORP·Filed 2017·Granted Mar 6, 2018·1 cites·16 claims
- 1070US9825017B2Method for manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Nov 21, 2017·1 cites·19 claims
- 1170US9230938B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Jan 5, 2016·2 cites·10 claims
- 1268US8945953B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Feb 3, 2015·2 cites·17 claims
- 1364US2019057913A1Manufacturing method of semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 1463US10134648B2Manufacturing method of semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Nov 20, 2018·0 cites·13 claims
- 1561US9165845B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Oct 20, 2015·0 cites·8 claims
- 1658US2016035636A1Manufacturing Method of Semiconductor DeviceRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 1756US10163740B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Dec 25, 2018·0 cites·9 claims
- 1856US10141295B2Method for manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Nov 27, 2018·0 cites·11 claims
- 1955US8415199B2Manufacturing method of semiconductor deviceAKIBA TOSHIHIKO·Filed 2011·Granted Apr 9, 2013·0 cites·2 claims
- 2050US2015137125A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
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