Inventor · disambiguated record
Kyu Won Lee
Also filed as: LEE KYU · LEE KYU H · LEE KYU HO · LEE KYU W
32 granted patents·15 pending applications·480 citations·filing 2000–2021
96Inventor score
Top patents by PatentIndex Score
47 records- 0197US7902660B1Substrate for semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2006·Granted Mar 8, 2011·188 cites·15 claims
- 0295US7317245B1Method for manufacturing a semiconductor device substrateAMKOR TECHNOLOGY INC·Filed 2006·Granted Jan 8, 2008·73 cites·20 claims
- 0392US8564141B2Chip unit and stack package having the sameLEE KYU WON·Filed 2011·Granted Oct 22, 2013·32 cites·16 claims
- 0492US6548767B1Multi-layer printed circuit board having via holes formed from both sides thereofLG ELECTRONICS INC·Filed 2000·Granted Apr 15, 2003·69 cites·5 claims
- 0588US9799621B2Semiconductor device and method of forming duplex plated bump-on-lead pad over substrate for finer pitch between adjacent tracesSTATS CHIPPAC LTD·Filed 2014·Granted Oct 24, 2017·11 cites·10 claims
- 0686US9781835B2Printed circuit boardLG INNOTEK CO LTD·Filed 2013·Granted Oct 3, 2017·9 cites·13 claims
- 0785US9515052B1Semiconductor package including a step type substrateSK HYNIX INC·Filed 2015·Granted Dec 6, 2016·9 cites·20 claims
- 0882US8093050B2mTOR inhibtors and mTOR signaling pathway inhibitors induce differentiation of human embryonic stem cells into the osteoblastic lineageCHO YEE SOOK·Filed 2007·Granted Jan 10, 2012·6 cites·12 claims
- 0982US6853060B1Semiconductor package using a printed circuit board and a method of manufacturing the sameAMKOR TECHNOLOGY INC·Filed 2003·Granted Feb 8, 2005·43 cites·20 claims
- 1080US9093441B2Semiconductor packages including semiconductor chips having protrusions and methods of fabricating the sameSK HYNIX INC·Filed 2013·Granted Jul 28, 2015·6 cites·19 claims
- 1180US8674485B1Semiconductor device including leadframe with downsetsKIM GI JEONG·Filed 2010·Granted Mar 18, 2014·6 cites·20 claims
- 1274US8334590B1Semiconductor device having insulating and interconnection layersJUNG YOON HA·Filed 2008·Granted Dec 18, 2012·11 cites·16 claims
- 1373US8109119B2Steam generating device and washing machine having the sameAHN IN GEUN·Filed 2007·Granted Feb 7, 2012·5 cites·18 claims
- 1469US9661759B2Printed circuit board and method of manufacturing the sameLG INNOTEK CO LTD·Filed 2013·Granted May 23, 2017·2 cites·9 claims
- 1566US7930909B2Steam generator and washing/drying machine having the sameLG ELECTRONICS INC·Filed 2008·Granted Apr 26, 2011·1 cites·3 claims
- 1664US8375495B2Control method of laundry machineLG ELECTRONICS INC·Filed 2009·Granted Feb 19, 2013·1 cites·10 claims
- 1763US9082634B2Stack package and method for manufacturing the sameSHIN HEE-MIN·Filed 2010·Granted Jul 14, 2015·2 cites·11 claims
- 1856US9445298B2Method, apparatus, and system for controlling terminal deviceMARKANY INC·Filed 2013·Granted Sep 13, 2016·1 cites·29 claims
- 1956US7954344B2Steam generator and washing machine therewithLG ELECTRONICS INC·Filed 2007·Granted Jun 7, 2011·1 cites·13 claims
- 2055US8615166B2Steam generator and washing machine therewithKIM JAE MUN·Filed 2007·Granted Dec 24, 2013·2 cites·28 claims
- 2155US2010095465A1Method for controlling washing machineLG ELECTRONICS INC·Filed 2009·Application pending·0 cites
- 2253US2008006300A1Laundry machine and method of controlling steam generator thereofLG ELECTRONICS INC·Filed 2007·Application pending·0 cites
- 2352US8298155B2Pure tone audiometer with automated maskingLEE DONG HOON·Filed 2007·Granted Oct 30, 2012·1 cites·20 claims
- 2452US7950257B2Steam generator and washing machine therewithLG ELECTRONICS INC·Filed 2007·Granted May 31, 2011·0 cites·15 claims
- 2551US12105503B2System for monitoring industrial equipment through IoT sensors and augmented reality implementationHYOSUNG P&M CO LTD·Filed 2021·Granted Oct 1, 2024·0 cites·19 claims
- 2648US9888569B2Printed circuit board having buried circuit pattern and method for manufacturing the sameLG INNOTEK CO LTD·Filed 2013·Granted Feb 6, 2018·0 cites·5 claims
- 2748US8528159B2Steam cleaner with seal flapLEE KYU·Filed 2011·Granted Sep 10, 2013·0 cites·8 claims
- 2848US8461696B2Substrate for semiconductor package, semiconductor package including the same, and stack package using the semiconductor packageLEE KYU WON·Filed 2009·Granted Jun 11, 2013·0 cites·18 claims
- 2948US2013256887A1Stacked semiconductor package and method for manufacturing the sameSK HYNIX INC·Filed 2013·Application pending·0 cites
- 3047US8951810B2Methods for forming interconnection line using screen printing techniqueSK HYNIX INC·Filed 2012·Granted Feb 10, 2015·0 cites·20 claims
- 3147US2006081014A1Washing apparatusLG ELECTRONICS INC·Filed 2005·Application pending·0 cites
- 3247US2008006224A1Steam generating device and washing machine having the sameLG ELECTRONICS INC·Filed 2007·Application pending·0 cites
- 3347US2010092718A1Wafer mount tape, wafer processing apparatus and method of using the same for use in thinning wafersSHIN HEE MIN·Filed 2008·Application pending·0 cites
- 3446US9569590B2Apparatus for measuring biological information and method for communicating data from apparatus for measuring biological informationINFOPIA CO LTD·Filed 2013·Granted Feb 14, 2017·0 cites·13 claims
- 3546US9305912B2Stack package and method for manufacturing the sameSK HYNIX INC·Filed 2015·Granted Apr 5, 2016·0 cites·6 claims
- 3646US2010324374A1Laryngeal stroboscope using voice signalUMEDICAL CO LTD·Filed 2008·Application pending·0 cites
- 3745US2011189928A1Wafer mount tape, wafer processing apparatus and method of using the same for use in thinning wafersHYNIX SEMICONDUCTOR INC·Filed 2011·Application pending·0 cites
- 3845US2015038276A1Transmission system for tranfer caseHYUNDAI WIA CORP·Filed 2014·Application pending·0 cites
- 3944US8476751B2Stacked semiconductor package and method for manufacturing the sameLEE KYU WON·Filed 2011·Granted Jul 2, 2013·0 cites·13 claims
- 4044US8109120B2Steam generating device and washing machine having the sameAHN IN GEUN·Filed 2007·Granted Feb 7, 2012·0 cites·21 claims
- 4140US2002146133A1Portable multimedia reproducing apparatusFiled 2002·Application pending·0 cites
- 4239US2012207971A1Buffer substrate, buffer sheet and manufacturing method thereofLEE KYU WON·Filed 2012·Application pending·0 cites
- 4338US2013249076A1Semiconductor Device and Method of Forming Duplex Plated Bump-On-Lead Pad Over Substrate for Finer Pitch Between Adjacent TracesLEE SOO WON·Filed 2012·Application pending·0 cites
- 4436US2016234219A1User adaptive method and system for controlling mobile deviceMARKANY INC·Filed 2016·Application pending·0 cites
- 4535US2016343593A1Semiconductor package including premold and method of manufacturing the sameAMKOR TECHNOLOGY INC·Filed 2016·Application pending·0 cites
- 4630USD678214SFlap seal for vacuum intakeLEE KYU·Filed 2011·Granted Mar 19, 2013·1 cites·1 claims
- 4730US2019326756A1Microgrid gateway and control method thereofNEXCHAL CO LTD·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →