Inventor · disambiguated record
Noritaka Anzai
Also filed as: ANZAI NORITAKA
22 granted patents·2 pending applications·516 citations·filing 1997–2010
96Inventor score
Top patents by PatentIndex Score
24 records- 0198US7239028B2Semiconductor device with signal line having decreased characteristic impedanceOKI ELECTRIC IND CO LTD·Filed 2005·Granted Jul 3, 2007·144 cites·13 claims
- 0296US6608375B2Semiconductor apparatus with decoupling capacitorOKI ELECTRIC IND CO LTD·Filed 2001·Granted Aug 19, 2003·63 cites·15 claims
- 0396US6259163B1Bond pad for stress releif between a substrate and an external substrateOKI ELECTRIC IND CO LTD·Filed 1998·Granted Jul 10, 2001·107 cites·9 claims
- 0491US7459765B2Semiconductor apparatus with decoupling capacitorOKI ELECTRIC IND CO LTD·Filed 2007·Granted Dec 2, 2008·13 cites·5 claims
- 0586US7616167B2Semiconductor device and method of producing the sameOKI SEMICONDUCTOR CO LTD·Filed 2006·Granted Nov 10, 2009·14 cites·10 claims
- 0685US5999413AResin sealing type semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 1997·Granted Dec 7, 1999·57 cites·24 claims
- 0779US8018055B2Semiconductor apparatus with decoupling capacitorOKI ELECTRIC IND CO LTD·Filed 2010·Granted Sep 13, 2011·2 cites·3 claims
- 0879US7545036B2Semiconductor device that suppresses variations in high frequency characteristics of circuit elementsOKI SEMICONDUCTOR CO LTD·Filed 2006·Granted Jun 9, 2009·6 cites·9 claims
- 0975US6707146B2Semiconductor apparatus with decoupling capacitorOKI ELECTRIC IND CO LTD·Filed 2002·Granted Mar 16, 2004·11 cites·22 claims
- 1071US6982494B2Semiconductor device with signal line having decreased characteristic impedanceOKI ELECTRIC IND CO LTD·Filed 2003·Granted Jan 3, 2006·14 cites·26 claims
- 1170US6251704B1Method of manufacturing semiconductor devices having solder bumps with reduced cracksOKI ELECTRIC IND CO LTD·Filed 1999·Granted Jun 26, 2001·25 cites·20 claims
- 1268US6806564B2Semiconductor apparatus with decoupling capacitorOKI ELECTRIC IND CO LTD·Filed 2004·Granted Oct 19, 2004·7 cites·5 claims
- 1367US7511351B2Semiconductor device and method for fabricating the sameOKI ELECTRIC IND CO LTD·Filed 2005·Granted Mar 31, 2009·3 cites·3 claims
- 1467US6323551B1Resin sealed-type semiconductor device and method of manufacturing the sameOKI ELECTRIC IND CO LTD·Filed 1998·Granted Nov 27, 2001·27 cites·16 claims
- 1566US7714434B2Semiconductor apparatus with decoupling capacitorOKI ELECTRIC IND CO LTD·Filed 2008·Granted May 11, 2010·1 cites·1 claims
- 1660US7538417B2Semiconductor device with signal line having decreased characteristic impedanceOKI SEMICONDUCTOR CO LTD·Filed 2007·Granted May 26, 2009·1 cites·12 claims
- 1746US7173335B2Semiconductor apparatus with decoupling capacitorOKI ELECTRIC IND CO LTD·Filed 2004·Granted Feb 6, 2007·0 cites·2 claims
- 1845US6274938B1Resin-sealed semiconductor device and method of manufacturing the deviceOKI ELECTRIC IND CO LTD·Filed 1998·Granted Aug 14, 2001·10 cites·13 claims
- 1944US6833607B2Resin-molded semiconductor device that includes at least one additional electronic partOKI ELECTRIC IND CO LTD·Filed 2002·Granted Dec 21, 2004·1 cites·17 claims
- 2042US7026699B2Semiconductor device and method for fabricating the sameOKI ELECTRIC IND CO LTD·Filed 2004·Granted Apr 11, 2006·0 cites·19 claims
- 2142US6204563B1Semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 1998·Granted Mar 20, 2001·10 cites·27 claims
- 2241US2003205808A1Semiconductor deviceFiled 2003·Application pending·0 cites
- 2339US6541306B2Resin-sealed semiconductor device and method of manufacturing the deviceOKI ELECTRIC IND CO LTD·Filed 2001·Granted Apr 1, 2003·0 cites·7 claims
- 2438US2006038257A1Semiconductor device which includes an inductor therein and a manufacturing method thereofANZAI NORITAKA·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →