Inventor · disambiguated record
You Yang Ong
Also filed as: ONG YOU YANG
14 granted patents·2 pending applications·114 citations·filing 2005–2012
92Inventor score
Top patents by PatentIndex Score
16 records- 0194US7535086B2Integrated circuit package-on-package stacking systemSTATS CHIPPAC LTD·Filed 2006·Granted May 19, 2009·34 cites·8 claims
- 0280US7859098B2Embedded integrated circuit package systemSTATS CHIPPAC LTD·Filed 2006·Granted Dec 28, 2010·8 cites·17 claims
- 0379US8163604B2Integrated circuit package system using etched leadframeONG YOU YANG·Filed 2005·Granted Apr 24, 2012·15 cites·20 claims
- 0477US8546929B2Embedded integrated circuit package-on-package systemONG YOU YANG·Filed 2006·Granted Oct 1, 2013·8 cites·20 claims
- 0577US7598600B2Stackable power semiconductor package systemSTATS CHIPPAC LTD·Filed 2006·Granted Oct 6, 2009·12 cites·4 claims
- 0676US7718472B2Integrated circuit package-on-package stacking system and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2009·Granted May 18, 2010·5 cites·10 claims
- 0775US7868434B2Integrated circuit package-on-package stacking systemSTATS CHIPPAC LTD·Filed 2010·Granted Jan 11, 2011·3 cites·10 claims
- 0874US8164182B2Hyper thermally enhanced semiconductor package system comprising heat slugs on opposite surfaces of a semiconductor chipONG YOU YANG·Filed 2005·Granted Apr 24, 2012·9 cites·10 claims
- 0973US8803299B2Stacked integrated circuit package systemONG YOU YANG·Filed 2006·Granted Aug 12, 2014·6 cites·20 claims
- 1072US7557432B2Thermally enhanced power semiconductor package systemSTATS CHIPPAC LTD·Filed 2006·Granted Jul 7, 2009·8 cites·20 claims
- 1164US8093694B2Method of manufacturing non-leaded integrated circuit package system having etched differential height lead structuresONG YOU YANG·Filed 2005·Granted Jan 10, 2012·3 cites·20 claims
- 1258US7443018B2Integrated circuit package system including ribbon bond interconnectSTATS CHIPPAC LTD·Filed 2005·Granted Oct 28, 2008·3 cites·20 claims
- 1349US8067832B2Embedded integrated circuit package system and method of manufacture thereofONG YOU YANG·Filed 2010·Granted Nov 29, 2011·0 cites·17 claims
- 1444US8415786B2Thermally enhanced semiconductor package systemONG YOU YANG·Filed 2012·Granted Apr 9, 2013·0 cites·5 claims
- 1541US2007071583A1Substrate indexing systemSTATS CHIPPAC LTD·Filed 2005·Application pending·0 cites
- 1639US2006103008A1Hyper thermally enhanced semiconductor package systemSTATS CHIPPAC LTD·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →