Inventor · disambiguated record
Mike Connell
Also filed as: CONNELL MIKE
12 granted patents·2 pending applications·244 citations·filing 2000–2006
92Inventor score
Top patents by PatentIndex Score
14 records- 0195US7510017B2Sealing and communicating in wellsHALLIBURTON ENERGY SERV INC·Filed 2006·Granted Mar 31, 2009·83 cites·25 claims
- 0292US6949834B2Stacked semiconductor package with circuit side polymer layerMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 27, 2005·49 cites·10 claims
- 0389US6791168B1Semiconductor package with circuit side polymer layer and wafer level fabrication methodMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 14, 2004·40 cites·25 claims
- 0486US7537966B2Method for fabricating board on chip (BOC) semiconductor package with circuit side polymer layerMICRON TECHNOLOGY INC·Filed 2006·Granted May 26, 2009·10 cites·20 claims
- 0586US6995041B2Semiconductor package with circuit side polymer layer and wafer level fabrication methodMICRON TECHNOLOGY INC·Filed 2003·Granted Feb 7, 2006·30 cites·14 claims
- 0671US6812064B2Ozone treatment of a ground semiconductor die to improve adhesive bonding to a substrateMICRON TECHNOLOGY INC·Filed 2001·Granted Nov 2, 2004·13 cites·72 claims
- 0769US7078267B2Methods of fabricating integrated circuitryMICRON TECHNOLOGY INC·Filed 2005·Granted Jul 18, 2006·2 cites·18 claims
- 0867US7479413B2Method for fabricating semiconductor package with circuit side polymer layerMICRON TECHNOLOGY INC·Filed 2005·Granted Jan 20, 2009·2 cites·8 claims
- 0956USD442749SSpray arch for vehicle washing machineCAPITAL FORMATION INC·Filed 2000·Granted May 22, 2001·10 cites·1 claims
- 1053US6881606B2Method for forming a protective layer for use in packaging a semiconductor dieMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 19, 2005·4 cites·28 claims
- 1151US8461685B2Substrate comprising a plurality of integrated circuitry die, and a substrateJIANG TONGBI·Filed 2005·Granted Jun 11, 2013·0 cites·16 claims
- 1247US7170184B2Treatment of a ground semiconductor die to improve adhesive bonding to a substrateMICRON TECHNOLOGY INC·Filed 2003·Granted Jan 30, 2007·1 cites·17 claims
- 1345US2005158910A1Protective layer for use in packaging a semiconductor die and method for forming sameMICRON TECHNOLOGY INC·Filed 2005·Application pending·0 cites
- 1441US2004102022A1Methods of fabricating integrated circuitryFiled 2002·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →