Inventor · disambiguated record
Yung-Chi Lee
Also filed as: LEE YUNG-CHI
21 granted patents·11 pending applications·173 citations·filing 2002–2016
95Inventor score
Top patents by PatentIndex Score
32 records- 0177US6861346B2Solder ball fabricating processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Mar 1, 2005·21 cites·20 claims
- 0275US6673711B2Solder ball fabricating processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jan 6, 2004·19 cites·21 claims
- 0372US6692581B2Solder paste for fabricating bumpADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Feb 17, 2004·18 cites·12 claims
- 0472US6617237B1Lead-free bump fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Sep 9, 2003·19 cites·25 claims
- 0571US6827252B2Bump manufacturing methodADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Dec 7, 2004·18 cites·39 claims
- 0669US6846719B2Process for fabricating wafer bumpsADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jan 25, 2005·16 cites·18 claims
- 0761US6989326B2Bump manufacturing methodADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Jan 24, 2006·10 cites·24 claims
- 0860US6732912B2Solder ball attaching processADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted May 11, 2004·8 cites·29 claims
- 0956US6723630B2Solder ball fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Apr 20, 2004·7 cites·19 claims
- 1056US6720244B2Bump fabrication methodADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Apr 13, 2004·7 cites·18 claims
- 1155US7064428B2Wafer-level package structureADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Jun 20, 2006·6 cites·6 claims
- 1253US6927964B2Structure for preventing burnt fuse pad from further electrical connectionADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Aug 9, 2005·4 cites·9 claims
- 1350US6875683B2Method of forming bumpADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Apr 5, 2005·4 cites·29 claims
- 1450US6716739B2Bump manufacturing methodADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Apr 6, 2004·4 cites·112 claims
- 1548US6967153B2Bump fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Nov 22, 2005·2 cites·27 claims
- 1648US6828664B2Packaging substrate with electrostatic discharge protectionADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Dec 7, 2004·3 cites·7 claims
- 1748US6743707B2Bump fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Jun 1, 2004·3 cites·10 claims
- 1847US6756256B2Method for preventing burnt fuse pad from further electrical connectionADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jun 29, 2004·2 cites·8 claims
- 1946US6877653B2Method of modifying tin to lead ratio in tin-lead bumpADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Apr 12, 2005·1 cites·15 claims
- 2045US6713320B2Bumping processADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Mar 30, 2004·1 cites·20 claims
- 2140US2005161812A1Wafer-level package structureFiled 2005·Application pending·0 cites
- 2239US2003161123A1Bonding structure for bonding substrates by metal studsFiled 2003·Application pending·0 cites
- 2338US2018250232A1Process for preparing spray dried solid dispersions of (s)-n-(3-(6-isopropoxypyridin-3-yl)-1h-indazol-5-yl)-1-(2-(4-(4-(1-methyl-1h-1,2,4-triazol-3-yl)phenyl)-3,6-dihydropyridin-1(2h)-yl)-2-oxoethyl)-3-(methylthio)pyrrolidine-3-carboxamide for pharmaceutical preparationsLEE YUNG CHI·Filed 2016·Application pending·0 cites
- 2438US2003146191A1Etching method for nickel-vanadium alloyFiled 2003·Application pending·0 cites
- 2538US2018221282A1Methods for making pharmaceutical solid dosage forms of spray-dried dispersionsLEE YUNG CHI·Filed 2016·Application pending·0 cites
- 2637US2003157791A1Process of fabricating bumpsFiled 2003·Application pending·0 cites
- 2737US2003157438A1Bump forming processFiled 2003·Application pending·0 cites
- 2837US2003160335A1Flip chip interconnection structure and fabrication process thereofFiled 2003·Application pending·0 cites
- 2936US2003164552A1Under-ball metallic layerFiled 2002·Application pending·0 cites
- 3033US10058544B2(S)-N-(3-(6-isopropoxypyridin-3-yl)-1H-indazol-5-yl)-1-(2-(4-(4-(1-methyl-1H-1,2,4-triazol-3-yl)phenyl)-3,6-dihydropyridin-1(2H)-yl)-2-oxoethyl)-3-(methylthio)pyrrolidine-3-carboxamide compositions for pharmaceutical preparationsMERCK SHARP & DOHME·Filed 2015·Granted Aug 28, 2018·0 cites·5 claims
- 3132US2018228826A1Fixed-dose combinations of antiviral compoundsMERCK SHARP & DOHME·Filed 2016·Application pending·0 cites
- 3231US2018228827A1Fixed-dose combinations of antiviral compoundsMERCK SHARP & DOHME·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →