Inventor · disambiguated record
Chun-Chi Lee
Also filed as: LEE CHUN C · LEE CHUN-CHI
45 granted patents·30 pending applications·953 citations·filing 1999–2021
98Inventor score
Files withADVANCED SEMICONDUCTOR ENG40FORHOUSE CORP3GEM LINE TECHNOLOGY CO LTD2HON HAI PREC IND CO LTD2ICARE DIAGNOSTICS INT CO LTD2
Top patents by PatentIndex Score
75 records- 0196US6291271B1Method of making semiconductor chip packageADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Sep 18, 2001·220 cites·18 claims
- 0295US6420244B2Method of making wafer level chip scale packageADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Jul 16, 2002·93 cites·12 claims
- 0394US7285434B2Semiconductor package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Oct 23, 2007·29 cites·18 claims
- 0490US11530133B2Method for recovering lithiumIND TECH RES INST·Filed 2020·Granted Dec 20, 2022·2 cites·20 claims
- 0589US6561411B2Wire bonding process and wire bond structureADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted May 13, 2003·47 cites·8 claims
- 0689US6191360B1Thermally enhanced BGA packageADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Feb 20, 2001·109 cites·6 claims
- 0781US6864168B2Bump and fabricating process thereofADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Mar 8, 2005·25 cites·9 claims
- 0881US6664128B2Bump fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Dec 16, 2003·25 cites·15 claims
- 0980US6819002B2Under-ball-metallurgy layerADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Nov 16, 2004·28 cites·19 claims
- 1077US6861346B2Solder ball fabricating processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Mar 1, 2005·21 cites·20 claims
- 1175US6673711B2Solder ball fabricating processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jan 6, 2004·19 cites·21 claims
- 1275US6201299B1Substrate structure of BGA semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Mar 13, 2001·47 cites·8 claims
- 1373US6863208B2Wire bonding process and wire bond structureADVANCED SEMICONDUCTOR ENIGNEE·Filed 2002·Granted Mar 8, 2005·20 cites·3 claims
- 1472US6692581B2Solder paste for fabricating bumpADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Feb 17, 2004·18 cites·12 claims
- 1572US6617237B1Lead-free bump fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Sep 9, 2003·19 cites·25 claims
- 1671US6827252B2Bump manufacturing methodADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Dec 7, 2004·18 cites·39 claims
- 1769US6946729B2Wafer level package structure with a heat slugADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Sep 20, 2005·15 cites·9 claims
- 1869US6846719B2Process for fabricating wafer bumpsADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jan 25, 2005·16 cites·18 claims
- 1967US6271057B1Method of making semiconductor chip packageADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Aug 7, 2001·33 cites·7 claims
- 2064US6777309B1Method for fabricating thin film transistor display deviceGEM LINE TECHNOLOGY CO LTD·Filed 2003·Granted Aug 17, 2004·13 cites·24 claims
- 2164US6163076AStacked structure of semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Dec 19, 2000·35 cites·5 claims
- 2263US6724075B2Semiconductor chip package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Apr 20, 2004·8 cites·8 claims
- 2361US6989326B2Bump manufacturing methodADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Jan 24, 2006·10 cites·24 claims
- 2460US6732912B2Solder ball attaching processADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted May 11, 2004·8 cites·29 claims
- 2557US8654675B2Interface detection device and detection method employing the sameLEE CHUN-CHI·Filed 2011·Granted Feb 18, 2014·1 cites·17 claims
- 2657US6989299B2Method of fabricating on-chip spacers for a TFT panelFORHOUSE CORP·Filed 2003·Granted Jan 24, 2006·8 cites·19 claims
- 2756US8300539B2Switching device and loopback detecting methodLEE CHUN-CHI·Filed 2010·Granted Oct 30, 2012·1 cites·7 claims
- 2856US6723630B2Solder ball fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Apr 20, 2004·7 cites·19 claims
- 2956US6720244B2Bump fabrication methodADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Apr 13, 2004·7 cites·18 claims
- 3055US7186110B2Apparatus of making wedged platesPAN FRANCIS CHUNG HWA·Filed 2004·Granted Mar 6, 2007·2 cites·14 claims
- 3155US7064428B2Wafer-level package structureADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Jun 20, 2006·6 cites·6 claims
- 3255US6891274B2Under-bump-metallurgy layer for improving adhesionADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted May 10, 2005·6 cites·25 claims
- 3354US6469399B2Semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Oct 22, 2002·6 cites·10 claims
- 3453US6927964B2Structure for preventing burnt fuse pad from further electrical connectionADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Aug 9, 2005·4 cites·9 claims
- 3551US2006078744A1Substrate having insulating layers to prevent it from warping and the method of making the sameFORHOUSE CORP·Filed 2005·Application pending·0 cites
- 3650US6875683B2Method of forming bumpADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Apr 5, 2005·4 cites·29 claims
- 3750US6716739B2Bump manufacturing methodADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Apr 6, 2004·4 cites·112 claims
- 3850US6714421B2Flip chip package substrateADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Mar 30, 2004·3 cites·5 claims
- 3950US2022099618A1Method of monitoring droplet movement in dielectric device applying electrowettingICARE DIAGNOSTICS INT CO LTD·Filed 2021·Application pending·0 cites
- 4050US2022097052A1Detection chip, nucleic acid detection kit, and nucleic acid detection deviceICARE DIAGNOSTICS INT CO LTD·Filed 2021·Application pending·0 cites
- 4150US2006186570A1Apparatus of making substrate with surface profile and the method thereofFORHOUSE CORP·Filed 2005·Application pending·0 cites
- 4249US2005196615A1Substrate having insulating layers to prevent it from warpingFiled 2004·Application pending·0 cites
- 4348US10522585B2Method for manufacturing CMOS image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 31, 2019·0 cites·20 claims
- 4448US6967153B2Bump fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Nov 22, 2005·2 cites·27 claims
- 4548US6743707B2Bump fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Jun 1, 2004·3 cites·10 claims
- 4647US6756256B2Method for preventing burnt fuse pad from further electrical connectionADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jun 29, 2004·2 cites·8 claims
- 4747US2008048312A1Semiconductor package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 4846US6877653B2Method of modifying tin to lead ratio in tin-lead bumpADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Apr 12, 2005·1 cites·15 claims
- 4945US6713320B2Bumping processADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Mar 30, 2004·1 cites·20 claims
- 5045US2005200014A1Bump and fabricating process thereofFiled 2005·Application pending·0 cites
Showing the top 50 of 75 patent records by PatentIndex Score.
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