Inventor · disambiguated record
Hajime Inazumi
Also filed as: INAZUMI HAJIME
1 granted patent·8 pending applications·1 citations·filing 2008–2012
16Inventor score
Files withSAKAGUCHI KAZUHIKO3INAZUMI HAJIME2JX NIPPON MINING & METALS CORP1MAKINO NOBUHITO1NIPPON MINING CO1
Top patents by PatentIndex Score
9 records- 0151US8487191B2Flexible laminate and flexible electronic circuit board formed by using the sameMAKINO NOBUHITO·Filed 2009·Granted Jul 16, 2013·1 cites·8 claims
- 0241US2011003169A1Non-Adhesive Flexible LaminateNIPPON MINING CO·Filed 2008·Application pending·0 cites
- 0341US2014011047A1Two-Layered Copper-Clad Laminate Material, and Method for Producing SameINAZUMI HAJIME·Filed 2012·Application pending·0 cites
- 0439US2014017513A1Two-Layered Copper-Clad Laminate Material, and Method for Producing SameINAZUMI HAJIME·Filed 2012·Application pending·0 cites
- 0537US2013252019A1Copper-Clad Laminate and Method for Manufacturing SameSAKAGUCHI KAZUHIKO·Filed 2011·Application pending·0 cites
- 0635US2013001186A1Method of forming circuit on flexible laminate substrateJX NIPPON MINING & METALS CORP·Filed 2011·Application pending·0 cites
- 0733US2013256006A1Method for Forming Circuit on Flexible Laminate SubstrateSAKAGUCHI KAZUHIKO·Filed 2011·Application pending·0 cites
- 0833US2014023881A1Liquid Crystal Polymer Film Based Copper-Clad Laminate and Method for Producing SameSAKAGUCHI KAZUHIKO·Filed 2012·Application pending·0 cites
- 0932US2012034475A1Metal-Coated Polyimide Resin Substrate with Excellent Thermal Aging Resistance PropertiesYOSHIDA TAKU·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →