Two-Layered Copper-Clad Laminate Material, and Method for Producing Same

Abstract

A two-layered copper-clad laminate material in which a copper layer having a thickness of 1 to 5 μ m is formed by means of sputtering or electroplating on one surface or both surfaces of a polyimide film having a thickness of 12.5 to 50 μ m after a plasma treatment is performed in a nitrogen gas atmosphere, the two-layered copper-clad laminate material being characterized in that the dissolution of the aforementioned polyimide film with an etching liquid is delayed compared with a polyimide film that is not subjected to the plasma treatment, the aforementioned dissolution being delayed as a consequence of modifying the surface of the polyimide film by incorporating nitrogen into the polyimide film by means of the plasma treatment in the nitrogen gas atmosphere.

1 . A two-layered copper-clad laminate material in which a copper layer having a thickness of 1 to 5 μm is foamed by means of sputtering or electroplating after plasma-treating one surface or both surfaces of a polyimide film having a thickness of 12.5 to 50 μm in a nitrogen gas atmosphere, characterized by having an as-received peel strength of 0.9 kN/m or more and a thermal peel strength of 0.70 kN/m or more, incorporating nitrogen into the polyimide film by a plasma treatment in the nitrogen gas atmosphere to modify the surface of the polyimide film, and thereby delaying the dissolution of the polyimide film with an etching solution compared with a polyimide film that is not subjected to the plasma treatment. 
     
     
         2 . A two-layered copper-clad laminate material in which a copper layer having a thickness of 1 to 5 μm is formed by means of sputtering or electroplating after plasma-treating one surface or both surfaces of a polyimide film having a thickness of 12.5 to 50 μm in a nitrogen gas atmosphere, characterized by having an as-received peel strength of 0.9 kN/m or more and a thermal peel strength of 0.70 kN/m or more, and incorporating an increased amount of nitrogen in the surface of the polyimide film subjected to a plasma treatment compared with the through-thickness center region, where the plasma treatment does not affect, of the polyimide film. 
     
     
         3 . The two-layered copper-clad laminate material according to  claim 1 , characterized by modifying the surface of the polyimide film to inhibit hydrolysis. 
     
     
         4 . The two-layered copper-clad laminate material according to  claim 1 , characterized by forming a tie-coat layer comprising Ni, Cr, Ni—Cu alloy or Ni—Cr alloy on the polyimide film by means of sputtering, prior to forming a copper layer on one surface or both surfaces of the polyimide film 
     
     
         5 . The two-layered copper-clad laminate material according to  claim 1 , characterized by having a nitrogen content in the polyimide film of 16.6 at % or more. 
     
     
         6 . A production method for a two-layered copper-clad laminate material in which a copper layer having a thickness of 1 to 5 μm is formed by means of sputtering or electroplating after plasma-treating one surface or both surfaces of a polyimide film having a thickness of 12.5 to 50 μm in a nitrogen gas atmosphere, characterized by providing an as-received peel strength of 0.9 kN/m or more and a thermal peel strength of 0.70 kN/m or more, incorporating nitrogen in the polyimide film by means of a plasma treatment in a nitrogen gas atmosphere to modify the surface of the polyimide film, and thereby delaying the dissolution of the polyimide film with an etching solution compared with a polyimide film not subjected to the plasma treatment. 
     
     
         7 . A production method for a two-layered copper-clad laminate material in which a copper layer having a thickness of 1 to 5 μm is formed by means of sputtering or electroplating after plasma-treating one surface or both surfaces of a polyimide film having a thickness of 12.5 to 50 μm in a nitrogen gas atmosphere, characterized by providing an as-received peel strength of 0.9 kN/m or more and a thermal peel strength of 0.70 kN/m or more, and incorporating an increased amount of nitrogen in the surface of the polyimide film subjected to a plasma treatment compared with the through-thickness center region, where the plasma treatment does not affect, of the polyimide film. 
     
     
         8 . The production method for the two-layered copper-clad laminate material according to  claim 6 , characterized by modifying the surface of the polyimide film to inhibit hydrolysis. 
     
     
         9 . The production method for the two-layered copper-clad laminate material according to  claim 6 , characterized by forming a tie-coat layer comprising Ni, Cr, Ni—Cu alloy or Ni—Cr alloy on the polyimide film by means of sputtering, prior to forming a copper layer on one surface or both surfaces of the polyimide film. 
     
     
         10 . The production method for the two-layered copper-clad laminate material according to  claim 6 , characterized by incorporating 16.6 at % or more of nitrogen in the polyimide film. 
     
     
         11 . The production method for the two-layered copper-clad laminate material according to  claim 7 , characterized by modifying the surface of the polyimide film to inhibit hydrolysis. 
     
     
         12 . The production method for the two-layered copper-clad laminate material according to  claim 7 , characterized by forming a tie-coat layer comprising Ni, Cr, Ni—Cu alloy or Ni—Cr alloy on the polyimide film by means of sputtering, prior to forming a copper layer on one surface or both surfaces of the polyimide film. 
     
     
         13 . The production method for the two-layered copper-clad laminate material according to  claim 7 , characterized by incorporating 16.6 at % or more of nitrogen in the polyimide film. 
     
     
         14 . The two-layered copper-clad laminate material according to  claim 2 , characterized by modifying the surface of the polyimide film to inhibit hydrolysis. 
     
     
         15 . The two-layered copper-clad laminate material according to  claim 2 , characterized by forming a tie-coat layer comprising Ni, Cr, Ni—Cu alloy or Ni—Cr alloy on the polyimide film by means of sputtering, prior to forming a copper layer on one surface or both surfaces of the polyimide film. 
     
     
         16 . The two-layered copper-clad laminate material according to  claim 2 , characterized by having a nitrogen content in the polyimide film of 16.6 at % or more. 
     
     
         17 . A two-layered copper-clad laminate material in which a copper layer having a thickness of 1 to 5 μm is formed by means of sputtering or electroplating after plasma-treating one surface or both surfaces of a polyimide film having a thickness of 12.5 to 50 μm in a nitrogen gas atmosphere, characterized by having a nitrogen content in the polyimide film of 16.6 at % or more. 
     
     
         18 . The two-layered copper-clad laminate material according to  claim 17 , wherein the nitrogen content is incorporated into the polyimide film by a plasma treatment in the nitrogen gas atmosphere to modify the surface of the polyimide film, thereby delaying the dissolution of the polyimide film with an etching solution compared with a polyimide film that is not subjected to the plasma treatment. 
     
     
         19 . The two-layered copper-clad laminate material according to  claim 17 , wherein an increased amount of nitrogen is incorporated in the surface of the polyimide film subjected to a plasma treatment as compared with a through-thickness center region of the polyimide film where the plasma treatment does not affect.