Inventor · disambiguated record

Tu Tam Vu

Also filed as: VU TU TAM

7 granted patents·21 citations·filing 2015–2017

80Inventor score

Technology areasH10W

Files withINVENSAS CORP7

Top patents by PatentIndex Score

7 records

0192US9508691B1Flipped die stacks with multiple rows of leadframe interconnectsINVENSAS CORP·Filed 2015·Granted Nov 29, 2016·10 cites·22 claims
0285US10008469B2Wafer-level packaging using wire bond wires in place of a redistribution layerINVENSAS CORP·Filed 2016·Granted Jun 26, 2018·4 cites·13 claims
0381US9847238B2Fan-out wafer-level packaging using metal foil laminationINVENSAS CORP·Filed 2017·Granted Dec 19, 2017·3 cites·12 claims
0476US9543277B1Wafer level packages with mechanically decoupled fan-in and fan-out areasINVENSAS CORP·Filed 2015·Granted Jan 10, 2017·3 cites·20 claims
0564US9646946B2Fan-out wafer-level packaging using metal foil laminationINVENSAS CORP·Filed 2015·Granted May 9, 2017·1 cites·6 claims
0648US9859257B2Flipped die stacks with multiple rows of leadframe interconnectsINVENSAS CORP·Filed 2016·Granted Jan 2, 2018·0 cites·20 claims
0747US9502372B1Wafer-level packaging using wire bond wires in place of a redistribution layerINVENSAS CORP·Filed 2015·Granted Nov 22, 2016·0 cites·20 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →