Inventor · disambiguated record
Hisashi Maeshima
Also filed as: MAESHIMA HISASHI
2 granted patents·3 pending applications·3 citations·filing 2003–2008
45Inventor score
Technology areasC08G
Top patents by PatentIndex Score
5 records- 0171US7781543B2Curable alicyclic diepoxy resin compositionDAICEL CHEM·Filed 2008·Granted Aug 24, 2010·2 cites·17 claims
- 0266US7989523B2Alicyclic diepoxy compound, epoxy resin composition comprising the same, and cured article therefromDAICEL CHEM·Filed 2007·Granted Aug 2, 2011·1 cites·9 claims
- 0338US2006009547A1Process for preparation of alicyclic diepoxy compound, curable epoxy resin compositions, epoxy resin compositions for the encapsulation of electronic components, stabilizers for electrical insulating oils, and casting epoxy resin compositions for electrical insulationMAESHIMA HISASHI·Filed 2003·Application pending·0 cites
- 0435US2006194933A1Thermosetting epoxy resin composition and transparent materialTAKAI HIDEYUKI·Filed 2004·Application pending·0 cites
- 0526US2006270828A1Curable resin composition and products of curing thereofMAESHIMA HISASHI·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →