Assignee
MAESHIMA HISASHI
0 granted patents·2 pending applications·0 citations·filing 2003–2003
Top patents by PatentIndex Score
2 records- 0138US2006009547A1Process for preparation of alicyclic diepoxy compound, curable epoxy resin compositions, epoxy resin compositions for the encapsulation of electronic components, stabilizers for electrical insulating oils, and casting epoxy resin compositions for electrical insulationMAESHIMA HISASHI·Filed 2003·Application pending·0 cites
- 0226US2006270828A1Curable resin composition and products of curing thereofMAESHIMA HISASHI·Filed 2003·Application pending·0 cites
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