Inventor · disambiguated record
Chan Hoon Ko
Also filed as: KO CHAN HOON
11 granted patents·2 pending applications·55 citations·filing 2008–2023
86Inventor score
Top patents by PatentIndex Score
13 records- 0194US7923290B2Integrated circuit packaging system having dual sided connection and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2009·Granted Apr 12, 2011·35 cites·13 claims
- 0284US8535981B2Integrated circuit package-on-package system with underfilling structures and method of manufacture thereofKO CHAN HOON·Filed 2011·Granted Sep 17, 2013·9 cites·10 claims
- 0381US11729910B2Printed circuit board and electronic component packageSAMSUNG ELECTRO MECH·Filed 2021·Granted Aug 15, 2023·1 cites·23 claims
- 0479US11722756B2Camera module with droplet removing deviceSAMSUNG ELECTRO MECH·Filed 2022·Granted Aug 8, 2023·1 cites·14 claims
- 0575US12224235B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2023·Granted Feb 11, 2025·0 cites·18 claims
- 0669US8004073B2Integrated circuit packaging system with interposer and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2009·Granted Aug 23, 2011·4 cites·18 claims
- 0766US7968995B2Integrated circuit packaging system with package-on-package and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2009·Granted Jun 28, 2011·3 cites·20 claims
- 0860US8906740B2Integrated circuit packaging system having dual sided connection and method of manufacture thereofKO CHAN HOON·Filed 2011·Granted Dec 9, 2014·1 cites·20 claims
- 0959US12256492B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2022·Granted Mar 18, 2025·0 cites·25 claims
- 1059US2022181245A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2021·Application pending·0 cites
- 1156US8067828B2System for solder ball inner stacking module connectionKO CHAN HOON·Filed 2008·Granted Nov 29, 2011·1 cites·20 claims
- 1254US11735510B2Printed circuit board and electronic component packageSAMSUNG ELECTRO MECH·Filed 2021·Granted Aug 22, 2023·0 cites·20 claims
- 1346US2023199974A1Printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →