Inventor · disambiguated record
Kazuaki Kozasa
Also filed as: KOZASA KAZUAKI
13 granted patents·2 pending applications·34 citations·filing 2006–2020
87Inventor score
Top patents by PatentIndex Score
15 records- 0183US7540800B2Rough polishing method of semiconductor wafer and polishing apparatus of semiconductor waferSUMCO TECHXIV CORP·Filed 2007·Granted Jun 2, 2009·10 cites·3 claims
- 0281US9991110B2Method for manufacturing semiconductor waferSUMCO CORP·Filed 2014·Granted Jun 5, 2018·7 cites·4 claims
- 0375US9956663B2Method for polishing silicon waferSUMCO CORP·Filed 2015·Granted May 1, 2018·3 cites·4 claims
- 0473US7303691B2Polishing method for semiconductor waferSUMCO TECHXIV CORP·Filed 2006·Granted Dec 4, 2007·6 cites·12 claims
- 0572US9305850B2Etching method and etching apparatus of semiconductor waferKOZASA KAZUAKI·Filed 2012·Granted Apr 5, 2016·3 cites·7 claims
- 0665US8303373B2Slurry supplying apparatus and method of polishing semiconductor wafer utilizing sameKOZASA KAZUAKI·Filed 2009·Granted Nov 6, 2012·3 cites·5 claims
- 0762US8273260B2Etching method and etching apparatus of semiconductor waferKOZASA KAZUAKI·Filed 2009·Granted Sep 25, 2012·2 cites·9 claims
- 0853US11554458B2Polishing head, wafer polishing apparatus using the same, and wafer polishing method using the sameSUMCO CORP·Filed 2019·Granted Jan 17, 2023·0 cites·16 claims
- 0951US7666063B2Rough polishing method of semiconductor wafer and polishing apparatus of semiconductor waferSUMCO TECHXIV CORP·Filed 2008·Granted Feb 23, 2010·0 cites·3 claims
- 1044US8992791B2Method of cleaning semiconductor wafer and semiconductor waferKOZASA KAZUAKI·Filed 2009·Granted Mar 31, 2015·0 cites·6 claims
- 1143US8696809B2Manufacturing method of epitaxial silicon wafer and substrate cleaning apparatusKOZASA KAZUAKI·Filed 2008·Granted Apr 15, 2014·0 cites·1 claims
- 1243US2022415666A1Wafer polishing method and silicon waferSUMCO CORP·Filed 2020·Application pending·0 cites
- 1343US2009053981A1Method of recycling abrasive slurrySUMCO TECHXIV CORP·Filed 2008·Application pending·0 cites
- 1437US11628534B2Silicon wafer single-side polishing methodSUMCO CORP·Filed 2016·Granted Apr 18, 2023·0 cites·4 claims
- 1535US11211285B2Method of producing bonded wafer and bonded waferSUMCO CORP·Filed 2019·Granted Dec 28, 2021·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →