Inventor · disambiguated record
Alok Kumar Lohia
Also filed as: LOHIA ALOK · LOHIA ALOK K · LOHIA ALOK KUMAR
20 granted patents·8 pending applications·65 citations·filing 2007–2024
92Inventor score
Top patents by PatentIndex Score
28 records- 0194US7477517B2Integrated heat spreader and exchangerIBM·Filed 2007·Granted Jan 13, 2009·30 cites·5 claims
- 0289US10993325B2Interposer printed circuit boards for power modulesABB POWER ELECTRONICS INC·Filed 2019·Granted Apr 27, 2021·7 cites·17 claims
- 0388US9842797B2Stacked die power converterTEXAS INSTRUMENTS INC·Filed 2013·Granted Dec 12, 2017·10 cites·10 claims
- 0488US9768098B2Packaged semiconductor device having stacked attached chips overhanging the assembly padTEXAS INSTRUMENTS INC·Filed 2016·Granted Sep 19, 2017·6 cites·8 claims
- 0585US9373569B1Flat no-lead packages with electroplated edgesTEXAS INSTRUMENTS INC·Filed 2015·Granted Jun 21, 2016·4 cites·9 claims
- 0681US11439013B2Interposer printed circuit boards for power modulesABB POWER ELECTRONICS INC·Filed 2021·Granted Sep 6, 2022·1 cites·15 claims
- 0778US12309910B2Point of load module and heatsink thereforACLEAP POWER INC·Filed 2024·Granted May 20, 2025·0 cites·20 claims
- 0877US10353503B2Integrated force sensing elementTEXAS INSTRUMENTS INC·Filed 2015·Granted Jul 16, 2019·2 cites·19 claims
- 0973US2023377124A1Exposed pad integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1072US11769247B2Exposed pad integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2021·Granted Sep 26, 2023·0 cites·21 claims
- 1172US9219019B2Packaged semiconductor devices having solderable lead surfaces exposed by grooves in package compoundTEXAS INSTRUMENTS INC·Filed 2014·Granted Dec 22, 2015·3 cites·5 claims
- 1271US11910517B2Point of load module and heatsink thereforACLEAP POWER INC·Filed 2021·Granted Feb 20, 2024·0 cites·20 claims
- 1369US9576886B1Flat no-lead packages with electroplated edgesTEXAS INSTRUMENTS INC·Filed 2016·Granted Feb 21, 2017·1 cites·7 claims
- 1465US11490517B2Interposer printed circuit boards for power modulesABB POWER ELECTRONICS INC·Filed 2019·Granted Nov 1, 2022·1 cites·20 claims
- 1563US10580723B2Flat no-lead packages with electroplated edgesTEXAS INSTRUMENTS INC·Filed 2019·Granted Mar 3, 2020·0 cites·20 claims
- 1661US11487381B2Piezoelectric sensor apparatusTEXAS INSTRUMENTS INC·Filed 2019·Granted Nov 1, 2022·0 cites·20 claims
- 1758US11792928B2Printed circuit boards with plated blind slots for improved vertical electrical and/or thermal connectionsABB SCHWEIZ AG·Filed 2021·Granted Oct 17, 2023·0 cites·20 claims
- 1857US2023260690A1Inductor Mountable on a Circuit BoardABB SCHWEIZ AG·Filed 2022·Application pending·0 cites
- 1956US11770900B2Printed circuit board layoutABB SCHWEIZ AG·Filed 2021·Granted Sep 26, 2023·0 cites·20 claims
- 2054US10366947B2Flat no-lead packages with electroplated edgesTEXAS INSTRUMENTS INC·Filed 2017·Granted Jul 30, 2019·0 cites·8 claims
- 2152US2016181180A1Packaged semiconductor device having attached chips overhanging the assembly padTEXAS INSTRUMENTS INC·Filed 2014·Application pending·0 cites
- 2251US11195269B2Exposed pad integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2015·Granted Dec 7, 2021·0 cites·15 claims
- 2351US2015262918A1Structure and method of packaged semiconductor devices with bent-lead qfn leadframesTEXAS INSTRUMENTS INC·Filed 2014·Application pending·0 cites
- 2445US2016005712A1Structure and method of packaged semiconductor devices with bent-lead qfn leadframesTEXAS INSTRUMENTS INC·Filed 2015·Application pending·0 cites
- 2543US2015262919A1Structure and method of packaged semiconductor devices with qfn leadframes having stress-absorbing protrusionsTEXAS INSTRUMENTS INC·Filed 2014·Application pending·0 cites
- 2639US2009072373A1Packaged integrated circuits and methods to form a stacked integrated circuit packageJAVIER REYNALDO CORPUZ·Filed 2007·Application pending·0 cites
- 2736US9721859B2Semi-hermetic semiconductor packageTEXAS INSTRUMENTS INC·Filed 2015·Granted Aug 1, 2017·0 cites·20 claims
- 2833US2016071788A1Packaged semiconductor devices having solderable lead surfaces exposed by grooves in package compoundTEXAS INSTRUMENTS INC·Filed 2015·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Alok Kumar Lohia files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →