Inventor · disambiguated record
Gerard Moloney
Also filed as: MOLONEY GERARD · MOLONEY GERARD S · MOLONEY GERARD STEPHEN
14 granted patents·6 pending applications·488 citations·filing 1999–2006
94Inventor score
Files withMULTI PLANAR TECHNOLOGIES INC7EBARA TECH INC4MITSUBISHI MATERIALS CORP3EBARA TECHNOLOGIES1KAJIWARA JIRO1
Top patents by PatentIndex Score
20 records- 0196US6558232B1System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal controlMULTI PLANAR TECHNOLOGIES INC·Filed 2000·Granted May 6, 2003·92 cites·27 claims
- 0296US6506105B1System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure controlMULTI PLANAR TECHNOLOGIES INC·Filed 2000·Granted Jan 14, 2003·105 cites·70 claims
- 0392US6623343B2System and method for CMP head having multi-pressure annular zone subcarrier material removal controlMULTI PLANAR TECHNOLOGIES INC·Filed 2001·Granted Sep 23, 2003·51 cites·38 claims
- 0490US6893327B2Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surfaceMULTI PLANAR TECHNOLOGIES INC·Filed 2001·Granted May 17, 2005·42 cites·43 claims
- 0590US6887132B2Slurry distributor for chemical mechanical polishing apparatus and method of using the sameMULTI PLANAR TECHNOLOGIES INC·Filed 2002·Granted May 3, 2005·44 cites·44 claims
- 0682US6966822B2System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal controlMULTI PLANAR TECHNOLOGIES INC·Filed 2003·Granted Nov 22, 2005·18 cites·13 claims
- 0782US6309290B1Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure controlMITSUBISHI MATERIALS CORP·Filed 1999·Granted Oct 30, 2001·46 cites·28 claims
- 0879US7125326B2Apparatus and method for removing a CMP polishing pad from a platenEBARA TECH INC·Filed 2005·Granted Oct 24, 2006·10 cites·15 claims
- 0979US6527625B1Chemical mechanical polishing apparatus and method having a soft backed polishing headMULTI PLANAR TECHNOLOGIES INC·Filed 2000·Granted Mar 4, 2003·21 cites·34 claims
- 1076US7326103B2Vertically adjustable chemical mechanical polishing head and method for use thereofEBARA TECH INC·Filed 2003·Granted Feb 5, 2008·20 cites·24 claims
- 1170US6916226B2Chemical mechanical polishing apparatus having a stepped retaining ring and method for use thereofEBARA TECH INC·Filed 2002·Granted Jul 12, 2005·13 cites·21 claims
- 1266US7118456B2Polishing head, retaining ring for use therewith and method fo polishing a substrateMULTIPLANAR TECHNOLOGIES INC·Filed 2003·Granted Oct 10, 2006·13 cites·14 claims
- 1361US7004822B2Chemical mechanical polishing and pad dressing methodEBARA TECH INC·Filed 2003·Granted Feb 28, 2006·9 cites·14 claims
- 1447US2006105685A1System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal controlKAJIWARA JIRO·Filed 2005·Application pending·0 cites
- 1544US6641461B2Chemical mechanical polishing apparatus having edge, center and annular zone control of material removalMULTI PLANAR TECHNOLOGYIES INC·Filed 2001·Granted Nov 4, 2003·4 cites·27 claims
- 1642US2005130566A1Slurry distributor for chemical mechanical polishing apparatus and method of using the sameFiled 2005·Application pending·0 cites
- 1739US2008051011A1Ethylene terephthalate polymer retaining ring for a chemical mechanical polishing headMOLONEY GERARD STEPHEN·Filed 2006·Application pending·0 cites
- 1838US2002173242A1Chemical mechanical polishing head assembly having floating wafer carrier and retaining ringMITSUBISHI MATERIALS CORP·Filed 2001·Application pending·0 cites
- 1937US2001007810A1Chemical mechanical polishing head assembly having floating wafer carrier and retaining ringMITSUBISHI MATERIALS CORP·Filed 2001·Application pending·0 cites
- 2031US2004108063A1Method and polishing pad design enabling improved wafer removal from a polishing pad in a CMP processEBARA TECHNOLOGIES·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →