Inventor · disambiguated record
Tsukasa Ichikawa
Also filed as: ICHIKAWA TSUKASA
2 granted patents·1 pending application·0 citations·filing 2021–2022
22Inventor score
Technology areasH10W
Files withTANAKA ELECTRONICS IND3
Top patents by PatentIndex Score
3 records- 0150US11876066B2Palladium-coated copper bonding wire, wire bonding structure, semiconductor device, and manufacturing method of semiconductor deviceTANAKA ELECTRONICS IND·Filed 2021·Granted Jan 16, 2024·0 cites·13 claims
- 0249US12237293B2Palladium-coated copper bonding wire, manufacturing method of palladium-coated copper bonding wire, wire bonding structure using the same, semiconductor device and manufacturing method thereofTANAKA ELECTRONICS IND·Filed 2021·Granted Feb 25, 2025·0 cites·13 claims
- 0343US2024105667A1Aluminum bonding wire for power semiconductorTANAKA ELECTRONICS IND·Filed 2022·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Tsukasa Ichikawa files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →