Assignee
TANAKA ELECTRONICS IND
JP·27 granted patents·7 pending applications·248 citations·filing 1980–2022
Top patents by PatentIndex Score
34 records- 0181US5514912AMethod for connecting semiconductor material and semiconductor device used in connecting methodTANAKA ELECTRONICS IND·Filed 1994·Granted May 7, 1996·33 cites·24 claims
- 0271US4330329AGold bonding wire for semiconductor elements and the semiconductor elementTANAKA ELECTRONICS IND·Filed 1980·Granted May 18, 1982·37 cites·15 claims
- 0370US5550407ASemiconductor device having an aluminum alloy wiring lineTANAKA ELECTRONICS IND·Filed 1994·Granted Aug 27, 1996·23 cites·17 claims
- 0470US5384090AFine wire for forming bump electrodes using a wire bonderTANAKA ELECTRONICS IND·Filed 1992·Granted Jan 24, 1995·20 cites·28 claims
- 0569US6492593B2Gold wire for semiconductor element connection and semiconductor element connection methodTANAKA ELECTRONICS IND·Filed 2001·Granted Dec 10, 2002·18 cites·12 claims
- 0668US5366692AAlloy connecting materials for semiconductorsTANAKA ELECTRONICS IND·Filed 1990·Granted Nov 22, 1994·21 cites·6 claims
- 0765US11251153B2Noble metal-coated silver wire for ball bonding, and semiconductor device using noble metal-coated silver wire for ball bondingTANAKA ELECTRONICS IND·Filed 2018·Granted Feb 15, 2022·1 cites·10 claims
- 0860US11996382B2Palladium-coated copper bonding wire, manufacturing method of palladium-coated copper bonding wire, semiconductor device using the same, and manufacturing method thereofTANAKA ELECTRONICS IND·Filed 2021·Granted May 28, 2024·0 cites·15 claims
- 0955US9972595B2Bonding wire for high-speed signal lineTANAKA ELECTRONICS IND·Filed 2013·Granted May 15, 2018·1 cites·9 claims
- 1054US12087724B2Palladium-coated copper bonding wire and method for manufacturing sameTANAKA ELECTRONICS IND·Filed 2021·Granted Sep 10, 2024·0 cites·12 claims
- 1152US5364706AClad bonding wire for semiconductor deviceTANAKA ELECTRONICS IND·Filed 1991·Granted Nov 15, 1994·24 cites·10 claims
- 1250US11876066B2Palladium-coated copper bonding wire, wire bonding structure, semiconductor device, and manufacturing method of semiconductor deviceTANAKA ELECTRONICS IND·Filed 2021·Granted Jan 16, 2024·0 cites·13 claims
- 1349US12237293B2Palladium-coated copper bonding wire, manufacturing method of palladium-coated copper bonding wire, wire bonding structure using the same, semiconductor device and manufacturing method thereofTANAKA ELECTRONICS IND·Filed 2021·Granted Feb 25, 2025·0 cites·13 claims
- 1447US11289442B2Gold-coated silver bonding wire and manufacturing method thereof, and semiconductor device and manufacturing method thereofTANAKA ELECTRONICS IND·Filed 2020·Granted Mar 29, 2022·0 cites·6 claims
- 1547US7678999B2Gold alloy wire for bonding wire having high bonding reliability, high roundness of compression ball, high straightness and high resin flowability resistanceTANAKA ELECTRONICS IND·Filed 2006·Granted Mar 16, 2010·0 cites·7 claims
- 1647US2011058979A1Bonding wireTANAKA ELECTRONICS IND·Filed 2008·Application pending·0 cites
- 1745US7857189B2Gold alloy wire for bonding wire having high initial bondability, high bonding reliability, high roundness of compression ball, high straightness, and high resin flowability resistanceTANAKA ELECTRONICS IND·Filed 2006·Granted Dec 28, 2010·0 cites·2 claims
- 1845US5538685APalladium bonding wire for semiconductor deviceTANAKA ELECTRONICS IND·Filed 1995·Granted Jul 23, 1996·13 cites·13 claims
- 1944US11456271B2Noble metal-coated silver wire for ball bonding and method for producing the same, and semiconductor device using noble metal-coated silver wire for ball bonding and method for producing the sameTANAKA ELECTRONICS IND·Filed 2018·Granted Sep 27, 2022·0 cites·10 claims
- 2044US6159420AGold alloy wire and method for making a bumpTANAKA ELECTRONICS IND·Filed 1997·Granted Dec 12, 2000·10 cites·10 claims
- 2144US2010171222A1HIGH RELIABILITY Au ALLOY BONDING WIRE AND SEMICONDUCTOR DEVICE OF SAMETANAKA ELECTRONICS IND·Filed 2008·Application pending·0 cites
- 2243US6213382B1Method for making a bumpTANAKA ELECTRONICS IND·Filed 1999·Granted Apr 10, 2001·10 cites·12 claims
- 2343US2010314156A1Au alloy wire for ball bondingTANAKA ELECTRONICS IND·Filed 2008·Application pending·0 cites
- 2443US2024105667A1Aluminum bonding wire for power semiconductorTANAKA ELECTRONICS IND·Filed 2022·Application pending·0 cites
- 2542US10195697B2Palladium (Pd)-coated copper wire for ball bondingTANAKA ELECTRONICS IND·Filed 2016·Granted Feb 5, 2019·0 cites·7 claims
- 2637US9362249B2Silver—gold alloy bonding wireTANAKA ELECTRONICS IND·Filed 2015·Granted Jun 7, 2016·0 cites·5 claims
- 2737US5702814AGold wire for bondingTANAKA ELECTRONICS IND·Filed 1996·Granted Dec 30, 1997·12 cites·8 claims
- 2835US6241094B1Spool case of bonding wireTANAKA ELECTRONICS IND·Filed 1998·Granted Jun 5, 2001·8 cites·29 claims
- 2935US5298219AHigh purity gold bonding wire for semiconductor deviceTANAKA ELECTRONICS IND·Filed 1991·Granted Mar 29, 1994·8 cites·6 claims
- 3034US5514334AFine lead alloy wire for forming bump electrodesTANAKA ELECTRONICS IND·Filed 1994·Granted May 7, 1996·3 cites·14 claims
- 3134US2008075626A1Wire Bump MaterialTANAKA ELECTRONICS IND·Filed 2005·Application pending·0 cites
- 3233US4775512AGold line for bonding semiconductor elementTANAKA ELECTRONICS IND·Filed 1986·Granted Oct 4, 1988·6 cites·3 claims
- 3333US2011236697A1Aluminum for ultrasonic bondingTANAKA ELECTRONICS IND·Filed 2010·Application pending·0 cites
- 3431US2017125135A1Noble metal-coated copper wire for ball bondingTANAKA ELECTRONICS IND·Filed 2016·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →