Inventor · disambiguated record
Pui Chung Simon Law
Also filed as: LAW PUI CHUNG · LAW PUI CHUNG SIMON
6 granted patents·1 pending application·23 citations·filing 2010–2012
74Inventor score
Top patents by PatentIndex Score
7 records- 0188US8212297B1High optical efficiency CMOS image sensorLAW PUI CHUNG SIMON·Filed 2011·Granted Jul 3, 2012·18 cites·15 claims
- 0266US8791578B2Through-silicon via structure with patterned surface, patterned sidewall and local isolationHK APPLIED SCIENCE & TECH RES·Filed 2012·Granted Jul 29, 2014·2 cites·20 claims
- 0366US8754507B2Forming through-silicon-vias for multi-wafer integrated circuitsXIE BIN·Filed 2011·Granted Jun 17, 2014·3 cites·20 claims
- 0453US8823126B2Low cost backside illuminated CMOS image sensor package with high integrationYANG DAN·Filed 2012·Granted Sep 2, 2014·0 cites·14 claims
- 0535US9117715B2Wafer-level device packagingTSUI YAT KIT·Filed 2012·Granted Aug 25, 2015·0 cites·12 claims
- 0635US8772930B2Increased surface area electrical contacts for microelectronic packagesLAW PUI CHUNG SIMON·Filed 2012·Granted Jul 8, 2014·0 cites·20 claims
- 0733US2011221018A1Electronic Device Package and Methods of Manufacturing an Electronic Device PackageSHI XUNQING·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →