Inventor · disambiguated record
Hyo-Seok Lee
Also filed as: LEE HYO-SEOK
24 granted patents·3 pending applications·140 citations·filing 2007–2020
95Inventor score
Top patents by PatentIndex Score
27 records- 0195US9466603B2Semiconductor device with air gap and method for fabricating the sameSK HYNIX INC·Filed 2015·Granted Oct 11, 2016·11 cites·18 claims
- 0295US9337202B2Semiconductor device with air gap and method for fabricating the sameSK HYNIX INC·Filed 2015·Granted May 10, 2016·11 cites·17 claims
- 0395US9293362B2Semiconductor device including air gaps and method of fabricating the sameSK HYNIX INC·Filed 2013·Granted Mar 22, 2016·21 cites·14 claims
- 0494US9202774B2Semiconductor device with air gap and method for fabricating the sameSK HYNIX INC·Filed 2013·Granted Dec 1, 2015·15 cites·19 claims
- 0594US9159609B2Semiconductor device with air gap spacer and capping barrier layer and method for fabricating the sameSK HYNIX INC·Filed 2013·Granted Oct 13, 2015·15 cites·8 claims
- 0693US9514980B2Semiconductor device with air gap and method for fabricating the sameSK HYNIX INC·Filed 2015·Granted Dec 6, 2016·8 cites·9 claims
- 0793US9165859B2Semiconductor device with air gap and method for fabricating the sameSK HYNIX INC·Filed 2013·Granted Oct 20, 2015·13 cites·20 claims
- 0889US9373681B2Method for fabricating capacitor of semiconductor deviceSK HYNIX INC·Filed 2015·Granted Jun 21, 2016·5 cites·9 claims
- 0989US8822335B2Semiconductor device with air gap and method for fabricating the sameSK HYNIX INC·Filed 2013·Granted Sep 2, 2014·10 cites·18 claims
- 1088US11967847B2Battery bank control device and methodLG ENERGY SOLUTION LTD·Filed 2020·Granted Apr 23, 2024·3 cites·11 claims
- 1187US9240442B2Method for fabricating capacitor of semiconductor deviceLIM SUNG-WON·Filed 2012·Granted Jan 19, 2016·9 cites·9 claims
- 1279US9746191B2System for producing heat source for heating or electricity using medium/low temperature waste heat, and method for controlling the samePOSCO ENERGY CO LTD·Filed 2014·Granted Aug 29, 2017·5 cites·13 claims
- 1378US9312210B2Semiconductor device with air gap and method for fabricating the sameLEE HYO-SEOK·Filed 2012·Granted Apr 12, 2016·6 cites·14 claims
- 1476US8737016B1Motor and hard disk drive including the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted May 27, 2014·3 cites·10 claims
- 1574US9029973B2Image sensor and method for fabricating the sameLIM SUNG-WON·Filed 2010·Granted May 12, 2015·1 cites·11 claims
- 1669US7846843B2Method for manufacturing a semiconductor device using a spacer as an etch mask for forming a fine patternHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Dec 7, 2010·3 cites·16 claims
- 1768US11600593B2Die bonding apparatus and method and substrate bonding apparatus and methodSEMES CO LTD·Filed 2019·Granted Mar 7, 2023·1 cites·16 claims
- 1855US9245946B2Semiconductor device and method of fabricating the sameSK HYNIX INC·Filed 2014·Granted Jan 26, 2016·0 cites·4 claims
- 1953US8354350B2Template derivative for forming ultra-low dielectric layer and method of forming ultra-low dielectric layer using the sameHYNIX SEMICONDUCTOR INC·Filed 2012·Granted Jan 15, 2013·0 cites·7 claims
- 2052US8921216B2Semiconductor device and method of fabricating the sameSK HYNIX INC·Filed 2012·Granted Dec 30, 2014·0 cites·13 claims
- 2150US8202807B2Template derivative for forming ultra-low dielectric layer and method of forming ultra-low dielectric layer using the sameMIN SUNG KYU·Filed 2007·Granted Jun 19, 2012·0 cites·4 claims
- 2249US8507665B2Template derivative for forming ultra-low dielectric layer and method of forming ultra-low dielectric layer using the sameMIN SUNG KYU·Filed 2012·Granted Aug 13, 2013·0 cites·10 claims
- 2347US2016172304A1Semiconductor device including air gaps and method of fabricating the sameSK HYNIX INC·Filed 2016·Application pending·0 cites
- 2445US9030069B2Hydrodynamic bearing assembly and spindle motor having the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted May 12, 2015·0 cites·7 claims
- 2541US7838414B2Method for manufacturing semiconductor device utilizing low dielectric layer filling gaps between metal linesHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Nov 23, 2010·0 cites·12 claims
- 2638US2009115019A1Semiconductor device having air gap and method for manufacturing the sameLEE HYO SEOK·Filed 2008·Application pending·0 cites
- 2738US2017365881A1Nanicl battery and module using samePOSCO ENERGY CO LTD·Filed 2015·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Hyo-Seok Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →