Inventor · disambiguated record
Fumiteru Asai
Also filed as: ASAI FUMITERU
29 granted patents·43 pending applications·116 citations·filing 2000–2018
95Inventor score
Top patents by PatentIndex Score
72 records- 0192US8722517B2Dicing tape-integrated film for semiconductor back surfaceTAKAMOTO NAOHIDE·Filed 2011·Granted May 13, 2014·7 cites·1 claims
- 0287US8986486B2Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device productionTAKAMOTO NAOHIDE·Filed 2011·Granted Mar 24, 2015·8 cites·3 claims
- 0383US8048690B2Pressure-sensitive adhesive sheet and process for producing semiconductor device having sameNITTO DENKO CORP·Filed 2008·Granted Nov 1, 2011·11 cites·23 claims
- 0482US8513816B2Film for flip chip type semiconductor back surface containing thermoconductive fillerTAKAMOTO NAOHIDE·Filed 2011·Granted Aug 20, 2013·5 cites·8 claims
- 0581US9478454B2Dicing tape-integrated film for semiconductor back surfaceNITTO DENKO CORP·Filed 2014·Granted Oct 25, 2016·2 cites·1 claims
- 0675US8643194B2Dicing tape-integrated film for semiconductor back surfaceTAKAMOTO NAOHIDE·Filed 2011·Granted Feb 4, 2014·4 cites·10 claims
- 0774US7156669B2Anisotropic conductive filmNITTO DENKO CORP·Filed 2004·Granted Jan 2, 2007·25 cites·9 claims
- 0873US8492907B2Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor deviceTAKAMOTO NAOHIDE·Filed 2011·Granted Jul 23, 2013·3 cites·8 claims
- 0972US7943235B2Adhesive sheet for processing semiconductor substratesNITTO DENKO CORP·Filed 2008·Granted May 17, 2011·4 cites·5 claims
- 1071US8278151B2Tape for holding chip, method of holding chip-shaped workpiece, method of manufacturing semiconductor device using tape for holding chip, and method of manufacturing tape for holding chipMURATA SHUHEI·Filed 2010·Granted Oct 2, 2012·3 cites·4 claims
- 1169US8652938B2Thermally releasable sheet-integrated film for semiconductor back surface, method of collecting semiconductor element, and method of producing semiconductor deviceTAKAMOTO NAOHIDE·Filed 2011·Granted Feb 18, 2014·2 cites·9 claims
- 1269US7727811B2Pressure-sensitive adhesive sheet for processing semiconductor wafer or semiconductor substrateNITTO DENKO CORP·Filed 2007·Granted Jun 1, 2010·3 cites·9 claims
- 1368US9074113B2Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor deviceTAKAMOTO NAOHIDE·Filed 2011·Granted Jul 7, 2015·2 cites·5 claims
- 1468US8679931B2Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor deviceASAI FUMITERU·Filed 2011·Granted Mar 25, 2014·3 cites·8 claims
- 1566US8450189B2Film for flip chip type semiconductor back surfaceSHIGA GOJI·Filed 2011·Granted May 28, 2013·2 cites·8 claims
- 1666US6613608B1Semiconductor wafer with anisotropic conductor film, and method of manufacture thereofNITTO DENKO CORP·Filed 2000·Granted Sep 2, 2003·13 cites·14 claims
- 1765US6566608B2Production method of anisotropic conductive film and anisotropic conductive film produced by this methodNITTO DENKO CORP·Filed 2001·Granted May 20, 2003·9 cites·5 claims
- 1864US9761475B2Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device productionNITTO DENKO CORP·Filed 2015·Granted Sep 12, 2017·1 cites·3 claims
- 1963US6811927B1Battery containing a polycarbodiimide polymerNITTO DENKO CORP·Filed 2001·Granted Nov 2, 2004·5 cites·13 claims
- 2062US9324616B2Method of manufacturing flip-chip type semiconductor deviceNITTO DENKO CORP·Filed 2013·Granted Apr 26, 2016·1 cites·3 claims
- 2154US10211083B2Film for flip chip type semiconductor back surface and its useNITTO DENKO CORP·Filed 2014·Granted Feb 19, 2019·0 cites·4 claims
- 2254US9293387B2Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor deviceKOMOTO YUSUKE·Filed 2011·Granted Mar 22, 2016·1 cites·6 claims
- 2354US9050773B2Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor deviceNITTO DENKO CORP·Filed 2013·Granted Jun 9, 2015·0 cites·4 claims
- 2453US2012028050A1Film for flip chip type semiconductor back surface, process for producing strip film for semiconductor back surface, and flip chip type semiconductor deviceSHIGA GOJI·Filed 2011·Application pending·0 cites
- 2552US8146438B2Pressure-sensitive adhesive sheet for testingTERADA YOSHIO·Filed 2008·Granted Apr 3, 2012·0 cites·15 claims
- 2652US2010028669A1Re-releasable adhesive agent and re-releasable adhesive sheetNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 2752US2018346640A1Film for flip chip type semiconductor back surface, process for producing strip film for semiconductor back surface, and flip chip type semiconductor deviceNITTO DENKO CORP·Filed 2018·Application pending·0 cites
- 2848US2016172230A1Dicing tape-integrated film for semiconductor back surface and method for producing the film, and method for producing semiconductor deviceNITTO DENKO CORP·Filed 2016·Application pending·0 cites
- 2948US2008057306A1Adhesive sheet for laser processingNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 3048US2012028380A1Dicing tape-integrated film for semiconductor back surface and method for producing the film, and method for producing semiconductor deviceTAKAMOTO NAOHIDE·Filed 2011·Application pending·0 cites
- 3148US2010032087A1Pressure-sensitive adhesive sheet for laser processing and laser processing methodNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 3248US2009221215A1Adhesive sheet for grinding back surface of semiconductor wafer and method for grinding back surface of semiconductor wafer using the sameNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 3347US8455302B2Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor deviceSHIGA GOJI·Filed 2012·Granted Jun 4, 2013·0 cites·4 claims
- 3447US8404522B2Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor deviceSHIGA GOJI·Filed 2011·Granted Mar 26, 2013·0 cites·5 claims
- 3547US7231706B2Method of manufacturing an anisotropic conductive filmNITTO DENKO CORP·Filed 2003·Granted Jun 19, 2007·2 cites·14 claims
- 3647US2012028416A1Film for flip chip type semiconductor back surface and its useTAKAMOTO NAOHIDE·Filed 2011·Application pending·0 cites
- 3746US2011008949A1Adhesive sheet for dicing semiconductor wafer and method for dicing semiconductor wafer using the sameNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 3846US2010080989A1Pressure-sensitive adhesive sheet for laser processing and method for laser processingNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 3945US2010028662A1Adhesive sheet for processing semiconductor substratesNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 4045US2012107576A1Tape for holding chip, method of holding chip-shaped workpiece, method of manufacturing semiconductor device using tape for holding chip, and method of manufacturing tape for holding chipMURATA SHUHEI·Filed 2012·Application pending·0 cites
- 4145US2009314417A1Method of grinding back side of semiconductor wafer and adhesive sheet for use in the method of grinding back side of semiconductor waferNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 4245US2011244229A1Rolled adhesive tape or sheetNITTO DENKO CORP·Filed 2011·Application pending·0 cites
- 4344US2008118764A1Adhesive sheet for processing semiconductor wafers and/or substratesNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 4444US2011097576A1Re-peelable adhesive sheetNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 4544US2008248296A1Pressure-sensitive adhesive sheet for processingNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 4643US2007190318A1Pressure-sensitive adhesive tape or sheet for application to active surface in dicing and method of picking up chips of workNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 4743US2008085397A1Adhesive sheet for laser processingNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 4843US2008138618A1Removable pressure-sensitive adhesive composition and pressure-sensitive adhesive tape or sheetNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 4941US2008057253A1Adhesive sheet for water jet laser dicingNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 5041US2013017396A1Adhesive film for semiconductor device, film for backside of flip-chip semiconductor, and dicing tape-integrated film for backside of semiconductorNITTO DENKO CORP·Filed 2012·Application pending·0 cites
Showing the top 50 of 72 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →