Inventor · disambiguated record
Lisa Yang
Also filed as: YANG LISA · YANG LISA L
6 granted patents·2 pending applications·166 citations·filing 1998–2007
85Inventor score
Top patents by PatentIndex Score
8 records- 0189US6149784ASputtering chamber shield promoting reliable plasma ignitionAPPLIED MATERIALS INC·Filed 1999·Granted Nov 21, 2000·66 cites·25 claims
- 0282US7321140B2Magnetron sputtered metallization of a nickel silicon alloy, especially useful as solder bump barrierAPPLIED MATERIALS INC·Filed 2005·Granted Jan 22, 2008·11 cites·24 claims
- 0377US6426282B1Method of forming solder bumps on a semiconductor waferAPPLIED MATERIALS INC·Filed 2000·Granted Jul 30, 2002·28 cites·25 claims
- 0476US6297147B1Plasma treatment for ex-situ contact fillAPPLIED MATERIALS INC·Filed 1998·Granted Oct 2, 2001·50 cites·25 claims
- 0561US7485556B2Forming metal silicide on silicon-containing features of a substrateAPPLIED MATERIALS INC·Filed 2005·Granted Feb 3, 2009·1 cites·28 claims
- 0653USD436815SPivotal coupling for a shear deviceFiled 2000·Granted Jan 30, 2001·10 cites·1 claims
- 0747US2008138974A1Method of sputtering a nickel silicon alloy, especially useful for forming a solder bump barrierAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 0840US2008014732A1Application of PVD W/WN bilayer barrier to aluminum bondpad in wire bondingLI YANPING·Filed 2006·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Lisa Yang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →