Inventor · disambiguated record
In Sang Yoon
Also filed as: YOON IN SANG · YOON JR IN SANG
34 granted patents·2 pending applications·208 citations·filing 2004–2020
97Inventor score
Top patents by PatentIndex Score
36 records- 0196US8299595B2Integrated circuit package system with package stacking and method of manufacture thereofYOON IN SANG·Filed 2010·Granted Oct 30, 2012·38 cites·18 claims
- 0294US8409917B2Integrated circuit packaging system with an interposer substrate and method of manufacture thereofYOON IN SANG·Filed 2011·Granted Apr 2, 2013·19 cites·20 claims
- 0392US8035210B2Integrated circuit package system with interposerSTATS CHIPPAC LTD·Filed 2007·Granted Oct 11, 2011·27 cites·20 claims
- 0492US7800212B2Mountable integrated circuit package system with stacking interposerSTATS CHIPPAC LTD·Filed 2007·Granted Sep 21, 2010·24 cites·18 claims
- 0589US8765525B2Method of manufacturing an integrated circuit packaging system including lasering through encapsulant over interposerYOON IN SANG·Filed 2011·Granted Jul 1, 2014·8 cites·9 claims
- 0688US9997468B2Integrated circuit packaging system with shielding and method of manufacturing thereofSTATS CHIPPAC PTE LTD·Filed 2016·Granted Jun 12, 2018·5 cites·20 claims
- 0785US9202715B2Integrated circuit packaging system with connection structure and method of manufacture thereofKIM YOUNGCHUL·Filed 2011·Granted Dec 1, 2015·9 cites·10 claims
- 0885US8674516B2Integrated circuit packaging system with vertical interconnects and method of manufacture thereofHAN BYUNG JOON·Filed 2011·Granted Mar 18, 2014·8 cites·18 claims
- 0983US8698297B2Integrated circuit packaging system with stack deviceBAE JOHYUN·Filed 2011·Granted Apr 15, 2014·6 cites·4 claims
- 1082US9385066B1Integrated circuit packaging system with molded laser via interposer and method of manufacture thereofYOON IN SANG·Filed 2014·Granted Jul 5, 2016·4 cites·10 claims
- 1181US8633100B2Method of manufacturing integrated circuit packaging system with support structureYANG DEOKKYUNG·Filed 2011·Granted Jan 21, 2014·6 cites·18 claims
- 1281US8497575B2Semiconductor packaging system with an aligned interconnect and method of manufacture thereofYOON IN SANG·Filed 2010·Granted Jul 30, 2013·6 cites·20 claims
- 1381US8124459B2Bump chip carrier semiconductor package systemYOON IN SANG·Filed 2006·Granted Feb 28, 2012·11 cites·20 claims
- 1478US9905491B1Interposer substrate designs for semiconductor packagesYOON IN SANG·Filed 2013·Granted Feb 27, 2018·5 cites·6 claims
- 1577US8130512B2Integrated circuit package system and method of package stackingYOON IN SANG·Filed 2008·Granted Mar 6, 2012·6 cites·20 claims
- 1674US8247894B2Integrated circuit package system with step mold recessYOON IN SANG·Filed 2008·Granted Aug 21, 2012·6 cites·20 claims
- 1773US7667314B2Integrated circuit package system with mold lock subassemblySTATS CHIPPAC LTD·Filed 2007·Granted Feb 23, 2010·5 cites·20 claims
- 1871US9748203B2Integrated circuit packaging system with conductive pillars and method of manufacture thereofYANG DEOKKYUNG·Filed 2011·Granted Aug 29, 2017·3 cites·10 claims
- 1970US8080446B2Integrated circuit packaging system with interposer interconnections and method of manufacture thereofCHOI A LEAM·Filed 2009·Granted Dec 20, 2011·4 cites·20 claims
- 2068US10083903B1Integrated circuit packaging system with molded laser via interposer and method of manufacture thereofSTATS CHIPPAC PTE LTD·Filed 2016·Granted Sep 25, 2018·1 cites·20 claims
- 2165US8102666B2Integrated circuit package systemPARK HYUNGSANG·Filed 2008·Granted Jan 24, 2012·3 cites·10 claims
- 2263US7710735B2Multichip package systemSTATS CHIPPAC LTD·Filed 2006·Granted May 4, 2010·2 cites·20 claims
- 2361US8558366B2Integrated circuit packaging system with interposer interconnections and method of manufacture thereofCHOI A LEAM·Filed 2011·Granted Oct 15, 2013·1 cites·20 claims
- 2458US11145603B2Integrated circuit packaging system with shielding and method of manufacture thereofSTATS CHIPPAC PTE LTD·Filed 2018·Granted Oct 12, 2021·0 cites·16 claims
- 2558US11024585B2Integrated circuit packaging system with shielding and method of manufacture thereofSTATS CHIPPAC PTE LTD·Filed 2018·Granted Jun 1, 2021·0 cites·20 claims
- 2657US11466239B2Biological material manufacturing device and driving method thereofVIEA LOGIS CO LTD·Filed 2020·Granted Oct 11, 2022·0 cites·9 claims
- 2755US11753343B2Method for manufacturing synthetic gemstoneVIEA LOGIS CO LTD·Filed 2020·Granted Sep 12, 2023·0 cites·8 claims
- 2853US9349666B1Integrated circuit packaging system with package stackingBAE JOHYUN·Filed 2014·Granted May 24, 2016·0 cites·6 claims
- 2949US9142530B2Coreless integrated circuit packaging system and method of manufacture thereofDO BYUNG TAI·Filed 2014·Granted Sep 22, 2015·0 cites·5 claims
- 3048US7875967B2Integrated circuit with step molded inner stacking module package in package systemSTATS CHIPPAC LTD·Filed 2008·Granted Jan 25, 2011·0 cites·20 claims
- 3146US10844512B2Method for manufacturing synthetic gemstoneBORAM HOLDINGS CO LTD·Filed 2019·Granted Nov 24, 2020·0 cites·9 claims
- 3245US8129832B2Mountable integrated circuit package system with substrate having a conductor-free recessCARSON FLYNN·Filed 2007·Granted Mar 6, 2012·0 cites·18 claims
- 3344US7306971B2Semiconductor chip packaging method with individually placed film adhesive piecesCHIPPAC INC·Filed 2004·Granted Dec 11, 2007·1 cites·4 claims
- 3444US2009127715A1Mountable integrated circuit package system with protrusionSHIN HANGIL·Filed 2007·Application pending·0 cites
- 3543US8367465B2Integrated circuit package on package systemSTATS CHIPPAC LTD·Filed 2006·Granted Feb 5, 2013·0 cites·20 claims
- 3642US2006192275A1Encapsulation method for semiconductor device having center padCHIPPAC INC·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →