Inventor · disambiguated record
Hisashi Tanie
Also filed as: TANIE HISASHI
30 granted patents·15 pending applications·172 citations·filing 2004–2022
95Inventor score
Files withELPIDA MEMORY INC14HITACHI LTD14HITACHI METALS LTD4HITACHI ASTEMO LTD2HITACHI AUTOMOTIVE SYSTEMS LTD2
Top patents by PatentIndex Score
45 records- 0195US7119428B2Semiconductor deviceELPIDA MEMORY INC·Filed 2004·Granted Oct 10, 2006·109 cites·8 claims
- 0287US9013877B2Power semiconductor deviceHITACHI LTD·Filed 2012·Granted Apr 21, 2015·12 cites·10 claims
- 0383US8368195B2Semiconductor device including arrangement to control connection height and alignment between a plurity of stacked semiconductor chipsHITACHI METALS LTD·Filed 2010·Granted Feb 5, 2013·9 cites·6 claims
- 0478US8164186B2BGA semiconductor device having a dummy bumpWATANABE YUJI·Filed 2005·Granted Apr 24, 2012·8 cites·5 claims
- 0577US8222737B2BGA semiconductor device having a dummy bumpWATANABE YUJI·Filed 2010·Granted Jul 17, 2012·4 cites·7 claims
- 0672US8053908B2Semiconductor deviceHITACHI METALS LTD·Filed 2010·Granted Nov 8, 2011·4 cites·7 claims
- 0771US8816478B2Semiconductor device having penetration electrode penetrating through semiconductor substrateELPIDA MEMORY INC·Filed 2013·Granted Aug 26, 2014·3 cites·20 claims
- 0871US7659623B2Semiconductor device having improved wiringELPIDA MEMORY INC·Filed 2006·Granted Feb 9, 2010·5 cites·21 claims
- 0969US7518202B2Mechanical quantity measuring apparatusHITACHI LTD·Filed 2006·Granted Apr 14, 2009·6 cites·15 claims
- 1068US10064310B2Power-module device, power conversion device, and method for manufacturing power-module deviceHITACHI LTD·Filed 2014·Granted Aug 28, 2018·2 cites·6 claims
- 1167US11088042B2Semiconductor device and production method thereforHITACHI METALS LTD·Filed 2018·Granted Aug 10, 2021·1 cites·12 claims
- 1267US10080313B2Power module and method for manufacturing the sameHITACHI LTD·Filed 2014·Granted Sep 18, 2018·2 cites·14 claims
- 1367US8372693B2Semiconductor device including semiconductor chips with different thicknessELPIDA MEMORY INC·Filed 2012·Granted Feb 12, 2013·2 cites·20 claims
- 1466US7714425B2Semiconductor device, method for manufacturing the same, and flexible substrate for mounting semiconductorELPIDA MEMORY INC·Filed 2008·Granted May 11, 2010·3 cites·22 claims
- 1562US12146816B2Test jig and test methodHITACHI LTD·Filed 2021·Granted Nov 19, 2024·0 cites·12 claims
- 1661US9870974B2Power conversion apparatus including wedge insertsHITACHI LTD·Filed 2014·Granted Jan 16, 2018·1 cites·11 claims
- 1760US7960846B2Semiconductor device having improved solder joint and internal lead lifetimesELPIDA MEMORY INC·Filed 2009·Granted Jun 14, 2011·1 cites·5 claims
- 1858US11125665B2Test jig and test methodHITACHI LTD·Filed 2017·Granted Sep 21, 2021·0 cites·7 claims
- 1956US10566876B2Axial gap rotary electric machineHITACHI LTD·Filed 2016·Granted Feb 18, 2020·0 cites·15 claims
- 2055US12327808B2Semiconductor deviceHITACHI POWER SEMICONDUCTOR DEVICE LTD·Filed 2022·Granted Jun 10, 2025·0 cites·8 claims
- 2154US12283536B2Power semiconductor device and manufacturing method of power semiconductor deviceHITACHI ASTEMO LTD·Filed 2020·Granted Apr 22, 2025·0 cites·12 claims
- 2253US2010224984A1Semiconductor device and stacked semiconductor device in which circuit board and semiconductor chip are connected by leadsELPIDA MEMORY INC·Filed 2009·Application pending·0 cites
- 2352US8513803B2Semiconductor device and stacked semiconductor deviceELPIDA MEMORY INC·Filed 2012·Granted Aug 20, 2013·0 cites·20 claims
- 2450US11652023B2Semiconductor device including a semiconductor element with a gate electrode on only one surfaceHITACHI POWER SEMICONDUCTOR DEVICE LTD·Filed 2020·Granted May 16, 2023·0 cites·14 claims
- 2548US10804765B2Electromechanical integral motorHITACHI LTD·Filed 2016·Granted Oct 13, 2020·0 cites·7 claims
- 2648US7504734B2Semiconductor device having improved solder joint and internal lead lifetimesELPIDA MEMORY INC·Filed 2005·Granted Mar 17, 2009·0 cites·6 claims
- 2748US2022283889A1Failure probability evaluation device and failure probability evaluation methodHITACHI LTD·Filed 2020·Application pending·0 cites
- 2847US2007126095A1Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2006·Application pending·0 cites
- 2946US8237251B2Semiconductor device including semiconductor chips with different thicknessKATAGIRI MITSUAKI·Filed 2009·Granted Aug 7, 2012·0 cites·20 claims
- 3046US2005230829A1Semiconductor deviceELPIDA MEMORY INC·Filed 2005·Application pending·0 cites
- 3146US2009134498A1Semiconductor apparatusELPIDA MEMORY INC·Filed 2008·Application pending·0 cites
- 3246US2020296828A1Ceramic substrateHITACHI METALS LTD·Filed 2020·Application pending·0 cites
- 3345US11815141B2Disk brakeHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2019·Granted Nov 14, 2023·0 cites·4 claims
- 3445US7239010B2Semiconductor deviceHITACHI LTD·Filed 2005·Granted Jul 3, 2007·0 cites·8 claims
- 3544US2016108514A1Method and apparatus for producing nanostructures, and substrate structure including nanostructuresUNIV KYOTO·Filed 2015·Application pending·0 cites
- 3643US2010038767A1Semiconductor device and method of manufacturing the sameELPIDA MEMORY INC·Filed 2009·Application pending·0 cites
- 3743US2010052133A1Stack type semiconductor device with reinforcing resinELPIDA MEMORY INC·Filed 2009·Application pending·0 cites
- 3843US2013067424A1Life prediction method of electronic device and design method of electronic device using the methodYAMAMOTO KENICHI·Filed 2012·Application pending·0 cites
- 3942US2015333024A1Semiconductor device and method for manufacturing the sameHITACHI LTD·Filed 2013·Application pending·0 cites
- 4039US9912248B2Power moduleHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2015·Granted Mar 6, 2018·0 cites·7 claims
- 4139US2014252576A1Semiconductor Device and Manufacturing Method ThereofTANIE HISASHI·Filed 2011·Application pending·0 cites
- 4239US2022316540A1Disc Brake DeviceHITACHI ASTEMO LTD·Filed 2020·Application pending·0 cites
- 4338US2010295162A1Semiconductor deviceELPIDA MEMORY INC·Filed 2010·Application pending·0 cites
- 4437US7573128B2Semiconductor module in which a semiconductor package is bonded on a mount substrateHITACHI LTD·Filed 2004·Granted Aug 11, 2009·0 cites·6 claims
- 4537US2006249829A1Stacked type semiconductor deviceKATAGIRI MITSUAKI·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →