Inventor · disambiguated record
Ryo Nakagaki
Also filed as: NAKAGAKI RYO
47 granted patents·10 pending applications·560 citations·filing 1999–2017
98Inventor score
Top patents by PatentIndex Score
57 records- 0195US8452076B2Defect classifier using classification recipe based on connection between rule-based and example-based classifiersNAKAGAKI RYO·Filed 2012·Granted May 28, 2013·20 cites·4 claims
- 0295US7598490B2SEM-type reviewing apparatus and a method for reviewing defects using the sameHITACHI HIGH TECH CORP·Filed 2007·Granted Oct 6, 2009·29 cites·21 claims
- 0391US7873202B2Method and apparatus for reviewing defects of semiconductor deviceHITACHI HIGH TECH CORP·Filed 2006·Granted Jan 18, 2011·12 cites·11 claims
- 0491US7113628B1Defect image classifying method and apparatus and a semiconductor device manufacturing process based on the method and apparatusHITACHI LTD·Filed 2000·Granted Sep 26, 2006·54 cites·3 claims
- 0590US9401015B2Defect classification method, and defect classification systemMINEKAWA YOHEI·Filed 2012·Granted Jul 26, 2016·12 cites·14 claims
- 0690US8150141B2Defect classifier using classification recipe based on connection between rule-based and example-based classifiersNAKAGAKI RYO·Filed 2011·Granted Apr 3, 2012·10 cites·6 claims
- 0790US7408155B2Measuring method and its apparatusHITACHI HIGH TECH CORP·Filed 2005·Granted Aug 5, 2008·16 cites·10 claims
- 0889US6476388B1Scanning electron microscope having magnification switching controlHITACHI LTD·Filed 1999·Granted Nov 5, 2002·95 cites·9 claims
- 0988US7991217B2Defect classifier using classification recipe based on connection between rule-based and example-based classifiersHITACHI HIGH TECH CORP·Filed 2007·Granted Aug 2, 2011·15 cites·6 claims
- 1088US7154090B2Method for controlling charged particle beam, and charged particle beam apparatusHITACHI HIGH TECH CORP·Filed 2005·Granted Dec 26, 2006·9 cites·8 claims
- 1187US8581976B2Method and apparatus for reviewing defects of semiconductor deviceKURIHARA MASAKI·Filed 2011·Granted Nov 12, 2013·7 cites·3 claims
- 1287US7834317B2Scanning electron microscope and system for inspecting semiconductor deviceHITACHI HIGH TECH CORP·Filed 2005·Granted Nov 16, 2010·10 cites·15 claims
- 1387US7399964B2Electron microscope, measuring method using the same, electron microscope system, and method for controlling the systemHITACHI HIGH TECH CORP·Filed 2005·Granted Jul 15, 2008·11 cites·10 claims
- 1486US7932493B2Method and system for observing a specimen using a scanning electron microscopeHITACHI HIGH TECH CORP·Filed 2008·Granted Apr 26, 2011·11 cites·14 claims
- 1585US6913861B2Method of observing exposure condition for exposing semiconductor device and its apparatus and method of manufacturing semiconductor deviceHITACHI HIGH TECH CORP·Filed 2003·Granted Jul 5, 2005·24 cites·18 claims
- 1685US6657221B2Image classification method, observation method, and apparatus thereof with different stage moving velocitiesHITACHI LTD·Filed 2001·Granted Dec 2, 2003·24 cites·8 claims
- 1784US9390490B2Method and device for testing defect using SEMTAKAGI YUJI·Filed 2010·Granted Jul 12, 2016·7 cites·5 claims
- 1882US9311697B2Inspection method and device thereforHARADA MINORU·Filed 2011·Granted Apr 12, 2016·6 cites·17 claims
- 1981US9569836B2Defect observation method and defect observation deviceHITACHI HIGH TECH CORP·Filed 2013·Granted Feb 14, 2017·5 cites·13 claims
- 2081US8824773B2Defect observation method and defect observation deviceMINEKAWA YOHEI·Filed 2010·Granted Sep 2, 2014·6 cites·20 claims
- 2181US8355559B2Method and apparatus for reviewing defectsHITACHI HIGH TECH CORP·Filed 2009·Granted Jan 15, 2013·9 cites·16 claims
- 2280US7034299B2Transmission electron microscope system and method of inspecting a specimen using the sameHITACHI HIGH TECH CORP·Filed 2004·Granted Apr 25, 2006·15 cites·19 claims
- 2379US7164127B2Scanning electron microscope and a method for evaluating accuracy of repeated measurement using the sameHITACHI HIGH TECH CORP·Filed 2004·Granted Jan 16, 2007·16 cites·17 claims
- 2478US8121397B2Method and its apparatus for reviewing defectsHARADA MINORU·Filed 2009·Granted Feb 21, 2012·9 cites·12 claims
- 2578US6553323B1Method and its apparatus for inspecting a specimenHITACHI LTD·Filed 2000·Granted Apr 22, 2003·21 cites·24 claims
- 2676US8526710B2Defect review method and apparatusNAKAGAKI RYO·Filed 2008·Granted Sep 3, 2013·7 cites·16 claims
- 2776US8090190B2Method and apparatus for reviewing defectsNAKAGAKI RYO·Filed 2010·Granted Jan 3, 2012·4 cites·4 claims
- 2875US9335277B2Region-of-interest determination apparatus, observation tool or inspection tool, region-of-interest determination method, and observation method or inspection method using region-of-interest determination methodNAKAGAKI RYO·Filed 2012·Granted May 10, 2016·3 cites·15 claims
- 2972US10783625B2Method for measuring overlay and measuring apparatus, scanning electron microscope, and GUIHITACHI HIGH TECH CORP·Filed 2017·Granted Sep 22, 2020·1 cites·8 claims
- 3072US8428336B2Inspecting method, inspecting system, and method for manufacturing electronic devicesIKEDA YOKO·Filed 2006·Granted Apr 23, 2013·7 cites·13 claims
- 3172US7511272B2Method for controlling charged particle beam, and charged particle beam apparatusHITACHI HIGH TECH CORP·Filed 2006·Granted Mar 31, 2009·2 cites·9 claims
- 3272US7476856B2Sample dimension-measuring method and charged particle beam apparatusHITACHI HIGH TECH CORP·Filed 2004·Granted Jan 13, 2009·10 cites·2 claims
- 3371US9811897B2Defect observation method and defect observation deviceHITACHI HIGH TECH CORP·Filed 2013·Granted Nov 7, 2017·3 cites·12 claims
- 3471US9342879B2Method and apparatus for reviewing defectMINEKAWA YOHEI·Filed 2012·Granted May 17, 2016·3 cites·17 claims
- 3569US7657078B2Method and apparatus for reviewing defectsHITACHI HIGH TECH CORP·Filed 2005·Granted Feb 2, 2010·4 cites·22 claims
- 3668US7216311B2System and method for evaluating a semiconductor device pattern, method for controlling process of forming a semiconductor device pattern and method for monitoring a semiconductor device manufacturing processHITACHI HIGH TECH CORP·Filed 2003·Granted May 8, 2007·11 cites·16 claims
- 3766US9685301B2Charged-particle radiation apparatusHITACHI HIGH TECH CORP·Filed 2013·Granted Jun 20, 2017·1 cites·17 claims
- 3865US9799112B2Method for measuring overlay and measuring apparatus, scanning electron microscope, and GUIHITACHI HIGH TECH CORP·Filed 2013·Granted Oct 24, 2017·1 cites·19 claims
- 3965US9040937B2Charged particle beam apparatusHITACHI HIGH TECH CORP·Filed 2013·Granted May 26, 2015·1 cites·14 claims
- 4064US9582875B2Defect analysis assistance device, program executed by defect analysis assistance device, and defect analysis systemHITACHI HIGH TECH CORP·Filed 2013·Granted Feb 28, 2017·1 cites·12 claims
- 4162US9082585B2Defect observation method and device using SEMKOTAKI GO·Filed 2009·Granted Jul 14, 2015·2 cites·8 claims
- 4262US8731275B2Method and apparatus for reviewing defectsHARADA MINORU·Filed 2012·Granted May 20, 2014·1 cites·5 claims
- 4362US7483560B2Method for measuring three dimensional shape of a fine patternHITACHI HIGH TECH CORP·Filed 2003·Granted Jan 27, 2009·10 cites·14 claims
- 4462US7068834B1Inspecting method, inspecting system, and method for manufacturing electronic devicesHITACHI LTD·Filed 1999·Granted Jun 27, 2006·35 cites·34 claims
- 4552US2014037188A1Defect review method and apparatusHITACHI HIGH TECH CORP·Filed 2013·Application pending·0 cites
- 4649US8634634B2Defect observation method and defect observation apparatusHARADA MINORU·Filed 2009·Granted Jan 21, 2014·0 cites·10 claims
- 4749US2011261190A1Defect observation device and defect observation methodNAKAGAKI RYO·Filed 2009·Application pending·0 cites
- 4849US2008187212A1Defect Image Classifying Method and Apparatus and a Semiconductor Device Manufacturing Process Based on the Method and ApparatusHITACHI LTD·Filed 2008·Application pending·0 cites
- 4948US7356177B2Defect image classifying method and apparatus and a semiconductor device manufacturing process based on the method and apparatusHITACHI LTD·Filed 2006·Granted Apr 8, 2008·0 cites·3 claims
- 5045US2008298670A1Method and its apparatus for reviewing defectsHITACHI HIGH TECH CORP·Filed 2008·Application pending·0 cites
Showing the top 50 of 57 patent records by PatentIndex Score.
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