Inventor · disambiguated record
Kanae Nakagawa
Also filed as: NAKAGAWA KANAE
19 granted patents·8 pending applications·122 citations·filing 2002–2022
93Inventor score
Files withFUJITSU LTD22MIZUKOSHI MASATAKA2NAKAGAWA KANAE1SHIOGA TAKESHI1SONY SEMICONDUCTOR SOLUTIONS CORP1
Top patents by PatentIndex Score
27 records- 0194US7670940B2Plating method, semiconductor device fabrication method and circuit board fabrication methodFUJITSU LTD·Filed 2005·Granted Mar 2, 2010·26 cites·11 claims
- 0293US7863524B2Interposer and method for manufacturing the sameFUJITSU LTD·Filed 2007·Granted Jan 4, 2011·24 cites·12 claims
- 0392US7355290B2Interposer and method for fabricating the sameFUJITSU LTD·Filed 2006·Granted Apr 8, 2008·20 cites·9 claims
- 0488US7247524B2Manufacturing method of wiring substrateFUJITSU LTD·Filed 2005·Granted Jul 24, 2007·14 cites·18 claims
- 0583US7614142B2Method for fabricating an interposerFUJITSU LTD·Filed 2008·Granted Nov 10, 2009·11 cites·12 claims
- 0679US8479386B2Method for manufacturing interposerSHIOGA TAKESHI·Filed 2010·Granted Jul 9, 2013·5 cites·4 claims
- 0777US7485962B2Semiconductor device, wiring substrate forming method, and substrate processing apparatusFUJITSU LTD·Filed 2005·Granted Feb 3, 2009·4 cites·15 claims
- 0869US6893681B2Surface conductive resin, a coaxial cable, a wiring board, and process for manufacturing the sameFUJITSU LTD·Filed 2002·Granted May 17, 2005·10 cites·22 claims
- 0965US8318599B2Resin layer formation method and semiconductor device fabrication methodNAKAGAWA KANAE·Filed 2006·Granted Nov 27, 2012·5 cites·16 claims
- 1064US10537044B2Heat dissipating component, manufacturing method for heat dissipating component, electronic device, manufacturing method for electronic device, integrated module, and information processing systemFUJITSU LTD·Filed 2016·Granted Jan 14, 2020·1 cites·15 claims
- 1158US8962470B2Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatusMIZUKOSHI MASATAKA·Filed 2009·Granted Feb 24, 2015·1 cites·5 claims
- 1255US7704856B2Semiconductor device, wiring substrate forming method, and substrate processing apparatusFUJITSU LTD·Filed 2007·Granted Apr 27, 2010·0 cites·5 claims
- 1355US7648907B2Semiconductor device, wiring substrate forming method, and substrate processing apparatusFUJITSU LTD·Filed 2007·Granted Jan 19, 2010·0 cites·12 claims
- 1453US2009291525A1Method for fabricating electronic device having first substrate with first resin layer and second substrate with second resin layer adhered to the first resin layerFUJITSU LTD·Filed 2009·Application pending·0 cites
- 1552US10777726B2Thermoelectric conversion module, sensor module, and information processing systemFUJITSU LTD·Filed 2019·Granted Sep 15, 2020·0 cites·13 claims
- 1652US2025255028A1Imaging device, electronic device, and method for manufacturing imaging deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Application pending·0 cites
- 1750US8058110B2Plating method, semiconductor device fabrication method and circuit board fabrication methodMIZUKOSHI MASATAKA·Filed 2011·Granted Nov 15, 2011·0 cites·3 claims
- 1850US7927998B2Plating method, semiconductor device fabrication method and circuit board fabrication methodFUJITSU LTD·Filed 2010·Granted Apr 19, 2011·0 cites·2 claims
- 1948US2015132865A1Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatusFUJITSU LTD·Filed 2015·Application pending·0 cites
- 2047US2005161814A1Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatusFUJITSU LTD·Filed 2005·Application pending·0 cites
- 2146US7081304B2Surface conductive resin, process for forming the same and wiring boardFUJITSU LTD·Filed 2003·Granted Jul 25, 2006·1 cites·27 claims
- 2246US2006220220A1Electronic device and method for fabricating the sameFUJITSU LTD·Filed 2005·Application pending·0 cites
- 2344US11709718B2Barrier synchronization circuit, barrier synchronization method, and parallel information processing apparatusFUJITSU LTD·Filed 2020·Granted Jul 25, 2023·0 cites·11 claims
- 2444US11487593B2Barrier synchronization system and parallel information processing apparatusFUJITSU LTD·Filed 2020·Granted Nov 1, 2022·0 cites·12 claims
- 2541US2017338393A1Thermoelectric conversion module, sensor module, and information processing systemFUJITSU LTD·Filed 2017·Application pending·0 cites
- 2641US2006084251A1Plating method, semiconductor device fabrication method and circuit board fabrication methodFUJITSU LTD·Filed 2005·Application pending·0 cites
- 2737US2017110386A1Heat dissipating component, manufacturing method for heat dissipating component, electronic device, manufacturing method for electronic device, integrated module, and information processing systemFUJITSU LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →