Inventor · disambiguated record
Holger Doepke
Also filed as: Doepke Holger
5 granted patents·1 pending application·7 citations·filing 2016–2021
68Inventor score
Files withINFINEON TECHNOLOGIES AG6
Top patents by PatentIndex Score
6 records- 0187US10043782B2Electronic device package having a dielectric layer and an encapsulantINFINEON TECHNOLOGIES AG·Filed 2017·Granted Aug 7, 2018·5 cites·12 claims
- 0268US10332814B2Bonded system and a method for adhesively bonding a hygroscopic materialINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jun 25, 2019·2 cites·18 claims
- 0356US10600690B2Method for handling a product substrate and a bonded substrate systemINFINEON TECHNOLOGIES AG·Filed 2018·Granted Mar 24, 2020·0 cites·17 claims
- 0450US11804432B2Semiconductor device with polymer-based insulating material and method of producing thereofINFINEON TECHNOLOGIES AG·Filed 2021·Granted Oct 31, 2023·0 cites·20 claims
- 0549US2018350780A1An Electronic Device PackageINFINEON TECHNOLOGIES AG·Filed 2018·Application pending·0 cites
- 0648US10056295B2Method for handling a product substrate, a bonded substrate system and a temporary adhesiveINFINEON TECHNOLOGIES AG·Filed 2016·Granted Aug 21, 2018·0 cites·11 claims
Join the waitlist — get patent alerts
Get an alert when Holger Doepke files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →