Inventor · disambiguated record
Francois Leverd
Also filed as: LEVERD FRANCOIS · LEVERD FRANÇOIS
14 granted patents·3 pending applications·175 citations·filing 1999–2022
90Inventor score
Files withST MICROELECTRONICS SA6ST MICROELECTRONICS CROLLES 2 SAS4IBM2LEVERD FRANÇOIS1MARTY MICHEL1
Top patents by PatentIndex Score
17 records- 0194US6828646B2Isolating trench and manufacturing processST MICROELECTRONICS SA·Filed 2002·Granted Dec 7, 2004·96 cites·21 claims
- 0279US8436440B2Method for forming a back-side illuminated image sensorMARTY MICHEL·Filed 2010·Granted May 7, 2013·6 cites·20 claims
- 0377US7456071B2Method for forming a strongly-conductive buried layer in a semiconductor substrateST MICROELECTRONICS SA·Filed 2005·Granted Nov 25, 2008·6 cites·31 claims
- 0475US8847344B2Process for fabricating a backside-illuminated imaging device and corresponding deviceROY FRANCOIS·Filed 2012·Granted Sep 30, 2014·1 cites·15 claims
- 0574US6689655B2Method for production process for the local interconnection level using a dielectric conducting pair on pairST MICROELECTRONICS SA·Filed 2002·Granted Feb 10, 2004·22 cites·8 claims
- 0670US12347670B2Etching methodST MICROELECTRONICS CROLLES 2 SAS·Filed 2022·Granted Jul 1, 2025·0 cites·20 claims
- 0764US6281068B1Method for buried plate formation in deep trench capacitorsIBM·Filed 1999·Granted Aug 28, 2001·36 cites·6 claims
- 0860US8796148B2Method for producing a deep trench in a microelectronic component substrateLEVERD FRANÇOIS·Filed 2012·Granted Aug 5, 2014·2 cites·15 claims
- 0957US11469095B2Etching methodST MICROELECTRONICS CROLLES 2 SAS·Filed 2019·Granted Oct 11, 2022·0 cites·29 claims
- 1050US6653182B2Process for forming deep and shallow insulative regions of an integrated circuitST MICROELECTRONICS SA·Filed 2001·Granted Nov 25, 2003·3 cites·16 claims
- 1144US10770306B2Method of etching a cavity in a stack of layersST MICROELECTRONICS CROLLES 2 SAS·Filed 2019·Granted Sep 8, 2020·0 cites·16 claims
- 1242US2022028726A1Method for forming a capacitive isolation trench and substrate comprising such a trenchST MICROELECTRONICS CROLLES 2 SAS·Filed 2021·Application pending·0 cites
- 1339US7214597B2Electronic components and method of fabricating the sameST MICROELECTRONICS SA·Filed 2003·Granted May 8, 2007·0 cites·22 claims
- 1439US6759304B2DRAM memory integration methodST MICROELECTRONICS SA·Filed 2002·Granted Jul 6, 2004·1 cites·25 claims
- 1538US6344422B1Method of depositing a BSG layerIBM·Filed 2000·Granted Feb 5, 2002·2 cites·7 claims
- 1638US2004104448A1Integrated circuit with a strongly-conductive buried layerFiled 2003·Application pending·0 cites
- 1738US2004145058A1Buried connections in an integrated circuit substrateFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →