Inventor · disambiguated record
Jerry Hwang
Also filed as: HWANG JERRY
5 granted patents·7 pending applications·142 citations·filing 2002–2013
81Inventor score
Files withTAIWAN SEMICONDUCTOR MFG5HEWLETT PACKARD DEVELOPMENT CO2HEWLETT PACKARD ENTPR DEV LP2DOW GLOBAL TECHNOLOGIES LLC1HEWLETT- PACKARD DEV COMPANY L P1
Top patents by PatentIndex Score
12 records- 0190US7335088B1CMP system with temperature-controlled polishing headTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Feb 26, 2008·23 cites·16 claims
- 0287US7590937B2Graphical user interface for procurement risk management systemHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Sep 15, 2009·84 cites·49 claims
- 0381US7747500B2Managing and evaluating procurement riskHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Jun 29, 2010·28 cites·48 claims
- 0477US7267600B1Polishing apparatusTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Sep 11, 2007·7 cites·14 claims
- 0553US2016300180A1Product data analysisHEWLETT PACKARD ENTPR DEV LP·Filed 2013·Application pending·0 cites
- 0652US2016283897A1Days of inventory determination based on constraintsHEWLETT PACKARD ENTPR DEV LP·Filed 2013·Application pending·0 cites
- 0751US8795486B2PVD target with end of service life detection capabilityHSIAO YI-LI·Filed 2006·Granted Aug 5, 2014·0 cites·20 claims
- 0842US2008305725A1Chemical mechanical polish system having multiple slurry-dispensing systemsTAIWAN SEMICONDUCTOR MFG·Filed 2006·Application pending·0 cites
- 0940US2016292624A1Optimization of Inventory Through Prioritization and CategorizationDOW GLOBAL TECHNOLOGIES LLC·Filed 2013·Application pending·0 cites
- 1039US2006023395A1Systems and methods for temperature control of semiconductor wafersTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
- 1137US2006242967A1Termoelectric heating and cooling apparatus for semiconductor processingTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
- 1234US2016292625A1Product data analysisHEWLETT- PACKARD DEV COMPANY L P·Filed 2013·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →