Inventor · disambiguated record
Naftali E. Lustig
Also filed as: LUSTIG NAFTALI · LUSTIG NAFTALI E · LUSTIG NAFTALI ELIAHU
68 granted patents·6 pending applications·2,523 citations·filing 1991–2020
99Inventor score
Top patents by PatentIndex Score
74 records- 0199US9502350B1Interconnect scaling method including forming dielectric layer over subtractively etched first conductive layer and forming second conductive material on dielectric layerIBM·Filed 2016·Granted Nov 22, 2016·49 cites·14 claims
- 0299US5433651AIn-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishingIBM·Filed 1993·Granted Jul 18, 1995·758 cites·51 claims
- 0398US9601426B1Interconnect structure having subtractive etch feature and damascene featureIBM·Filed 2016·Granted Mar 21, 2017·26 cites·5 claims
- 0497US6573606B2Chip to wiring interface with single metal alloy layer applied to surface of copper interconnectIBM·Filed 2001·Granted Jun 3, 2003·307 cites·8 claims
- 0597US5470661ADiamond-like carbon films from a hydrocarbon helium plasmaIBM·Filed 1993·Granted Nov 28, 1995·362 cites·7 claims
- 0695US10256186B2Interconnect structure having subtractive etch feature and damascene featureIBM·Filed 2017·Granted Apr 9, 2019·9 cites·16 claims
- 0795US10177031B2Subtractive etch interconnectsIBM·Filed 2014·Granted Jan 8, 2019·22 cites·10 claims
- 0895US5337015AIn-situ endpoint detection method and apparatus for chemical-mechanical polishing using low amplitude input voltageIBM·Filed 1993·Granted Aug 9, 1994·171 cites·21 claims
- 0994US9171801B2E-fuse with hybrid metallizationIBM·Filed 2014·Granted Oct 27, 2015·19 cites·16 claims
- 1094US8633707B2Stacked via structure for metal fuse applicationsFILIPPI RONALD G·Filed 2011·Granted Jan 21, 2014·15 cites·17 claims
- 1194US8129269B1Method of improving mechanical properties of semiconductor interconnects with nanoparticlesBAO JUNJING·Filed 2010·Granted Mar 6, 2012·15 cites·14 claims
- 1293US9852980B2Interconnect structure having substractive etch feature and damascene featureIBM·Filed 2017·Granted Dec 26, 2017·7 cites·20 claims
- 1393US9685404B2Back-end electrically programmable fuseBAO JUNJING·Filed 2012·Granted Jun 20, 2017·14 cites·11 claims
- 1493US8232646B2Interconnect structure for integrated circuits having enhanced electromigration resistanceBONILLA GRISELDA·Filed 2010·Granted Jul 31, 2012·17 cites·15 claims
- 1592US9536830B2High performance refractory metal / copper interconnects to eliminate electromigrationIBM·Filed 2013·Granted Jan 3, 2017·14 cites·12 claims
- 1692US6375693B1Chemical-mechanical planarization of barriers or liners for copper metallurgyIBM·Filed 1999·Granted Apr 23, 2002·98 cites·20 claims
- 1792US6153043AElimination of photo-induced electrochemical dissolution in chemical mechanical polishingIBM·Filed 1998·Granted Nov 28, 2000·122 cites·20 claims
- 1892US6020264AMethod and apparatus for in-line oxide thickness determination in chemical-mechanical polishingIBM·Filed 1997·Granted Feb 1, 2000·141 cites·22 claims
- 1991US9431292B1Alternate dual damascene method for forming interconnectsGLOBALFOUNDRIES INC·Filed 2015·Granted Aug 30, 2016·8 cites·20 claims
- 2091US9059170B2Electronic fuse having a damaged regionIBM·Filed 2013·Granted Jun 16, 2015·12 cites·24 claims
- 2189US10998263B2Back end of line (BEOL) time dependent dielectric breakdown (TDDB) mitigation within a vertical interconnect access (VIA) level of an integrated circuit (IC) deviceIBM·Filed 2019·Granted May 4, 2021·6 cites·12 claims
- 2288US9293412B2Graphene and metal interconnects with reduced contact resistanceIBM·Filed 2014·Granted Mar 22, 2016·9 cites·18 claims
- 2388US8916461B2Electronic fuse vias in interconnect structuresIBM·Filed 2012·Granted Dec 23, 2014·8 cites·9 claims
- 2488US8736020B2Electronic anti-fuseBAO JUNJING·Filed 2012·Granted May 27, 2014·10 cites·18 claims
- 2588US5569501ADiamond-like carbon films from a hydrocarbon helium plasmaIBM·Filed 1995·Granted Oct 29, 1996·82 cites·28 claims
- 2687US9455186B2Selective local metal cap layer formation for improved electromigration behaviorIBM·Filed 2015·Granted Sep 27, 2016·4 cites·1 claims
- 2787US9142506B2E-fuse structures and methods of manufactureIBM·Filed 2013·Granted Sep 22, 2015·7 cites·11 claims
- 2887US8030707B2Semiconductor structureIBM·Filed 2009·Granted Oct 4, 2011·13 cites·8 claims
- 2985US9202743B2Graphene and metal interconnectsIBM·Filed 2012·Granted Dec 1, 2015·7 cites·18 claims
- 3085US8962467B2Metal fuse structure for improved programming capabilityBONILLA GRISELDA·Filed 2012·Granted Feb 24, 2015·6 cites·9 claims
- 3183US7488679B2Interconnect structure and process of making the sameIBM·Filed 2006·Granted Feb 10, 2009·13 cites·30 claims
- 3282US9105637B2Anti-fuse structure and fabricationFILIPPI RONALD G·Filed 2012·Granted Aug 11, 2015·6 cites·10 claims
- 3382US6632377B1Chemical-mechanical planarization of metallurgyIBM·Filed 1999·Granted Oct 14, 2003·70 cites·10 claims
- 3480US8742766B2Stacked via structure for metal fuse applicationsIBM·Filed 2013·Granted Jun 3, 2014·3 cites·3 claims
- 3579US9385038B2Selective local metal cap layer formation for improved electromigration behaviorIBM·Filed 2015·Granted Jul 5, 2016·2 cites·6 claims
- 3678US10796949B2Airgap vias in electrical interconnectsIBM·Filed 2018·Granted Oct 6, 2020·2 cites·20 claims
- 3778US9536842B2Structure with air gap crack stopGLOBALFOUNDRIES INC·Filed 2014·Granted Jan 3, 2017·4 cites·18 claims
- 3877US9425144B2Metal fuse structure for improved programming capabilityGLOBALFOUNDRIES INC·Filed 2014·Granted Aug 23, 2016·3 cites·15 claims
- 3976US9893011B2Back-end electrically programmable fuseIBM·Filed 2015·Granted Feb 13, 2018·2 cites·4 claims
- 4075US9859208B1Bottom self-aligned viaIBM·Filed 2016·Granted Jan 2, 2018·2 cites·20 claims
- 4174US11133268B2Crack bifurcation in back-end-of-lineIBM·Filed 2019·Granted Sep 28, 2021·1 cites·20 claims
- 4273US9034664B2Method to resolve hollow metal defects in interconnectsBONILLA GRISELDA·Filed 2012·Granted May 19, 2015·3 cites·8 claims
- 4372US9324655B2Modified via bottom for beol via efuseIBM·Filed 2014·Granted Apr 26, 2016·2 cites·18 claims
- 4470US9431346B2Graphene-metal E-fuseGLOBALFOUNDRIES INC·Filed 2014·Granted Aug 30, 2016·2 cites·13 claims
- 4568US8836124B2Fuse and integrated conductorBONILLA GRISELDA·Filed 2012·Granted Sep 16, 2014·2 cites·13 claims
- 4667US9076847B2Selective local metal cap layer formation for improved electromigration behaviorIBM·Filed 2013·Granted Jul 7, 2015·1 cites·6 claims
- 4767US6743268B2Chemical-mechanical planarization of barriers or liners for copper metallurgyIBM·Filed 2002·Granted Jun 1, 2004·9 cites·8 claims
- 4866US6933191B2Two-mask process for metal-insulator-metal capacitors and single mask process for thin film resistorsIBM·Filed 2003·Granted Aug 23, 2005·10 cites·21 claims
- 4964US8921167B2Modified via bottom for BEOL via efuseIBM·Filed 2013·Granted Dec 30, 2014·1 cites·7 claims
- 5063US9257391B2Hybrid graphene-metal interconnect structuresGLOBALFOUNDRIES INC·Filed 2013·Granted Feb 9, 2016·1 cites·7 claims
Showing the top 50 of 74 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →