Inventor · disambiguated record
Samuel S. Choi
Also filed as: CHOI SAMUEL S · CHOI SAMUEL S S · CHOI SAMUEL SUNG SHIK
53 granted patents·4 pending applications·349 citations·filing 2004–2022
98Inventor score
Top patents by PatentIndex Score
57 records- 0199US9502350B1Interconnect scaling method including forming dielectric layer over subtractively etched first conductive layer and forming second conductive material on dielectric layerIBM·Filed 2016·Granted Nov 22, 2016·49 cites·14 claims
- 0298US9601426B1Interconnect structure having subtractive etch feature and damascene featureIBM·Filed 2016·Granted Mar 21, 2017·26 cites·5 claims
- 0395US10256186B2Interconnect structure having subtractive etch feature and damascene featureIBM·Filed 2017·Granted Apr 9, 2019·9 cites·16 claims
- 0495US10177031B2Subtractive etch interconnectsIBM·Filed 2014·Granted Jan 8, 2019·22 cites·10 claims
- 0594US9171801B2E-fuse with hybrid metallizationIBM·Filed 2014·Granted Oct 27, 2015·19 cites·16 claims
- 0694US7790601B1Forming interconnects with air gapsIBM·Filed 2009·Granted Sep 7, 2010·26 cites·18 claims
- 0793US9852980B2Interconnect structure having substractive etch feature and damascene featureIBM·Filed 2017·Granted Dec 26, 2017·7 cites·20 claims
- 0893US9685404B2Back-end electrically programmable fuseBAO JUNJING·Filed 2012·Granted Jun 20, 2017·14 cites·11 claims
- 0992US9536830B2High performance refractory metal / copper interconnects to eliminate electromigrationIBM·Filed 2013·Granted Jan 3, 2017·14 cites·12 claims
- 1092US8835305B2Method of fabricating a profile control in interconnect structuresYANG CHIH-CHAO·Filed 2012·Granted Sep 16, 2014·12 cites·13 claims
- 1191US9431292B1Alternate dual damascene method for forming interconnectsGLOBALFOUNDRIES INC·Filed 2015·Granted Aug 30, 2016·8 cites·20 claims
- 1291US9059170B2Electronic fuse having a damaged regionIBM·Filed 2013·Granted Jun 16, 2015·12 cites·24 claims
- 1388US9293412B2Graphene and metal interconnects with reduced contact resistanceIBM·Filed 2014·Granted Mar 22, 2016·9 cites·18 claims
- 1488US8916461B2Electronic fuse vias in interconnect structuresIBM·Filed 2012·Granted Dec 23, 2014·8 cites·9 claims
- 1588US8736020B2Electronic anti-fuseBAO JUNJING·Filed 2012·Granted May 27, 2014·10 cites·18 claims
- 1687US9455186B2Selective local metal cap layer formation for improved electromigration behaviorIBM·Filed 2015·Granted Sep 27, 2016·4 cites·1 claims
- 1787US9324634B2Semiconductor interconnect structure having a graphene-based barrier metal layerBAO JUNJING·Filed 2011·Granted Apr 26, 2016·9 cites·10 claims
- 1887US9142506B2E-fuse structures and methods of manufactureIBM·Filed 2013·Granted Sep 22, 2015·7 cites·11 claims
- 1985US9755016B2Integration process to form microelectronic or micromechanical structuresGLOBALFOUNDRIES INC·Filed 2016·Granted Sep 5, 2017·3 cites·20 claims
- 2085US9202743B2Graphene and metal interconnectsIBM·Filed 2012·Granted Dec 1, 2015·7 cites·18 claims
- 2185US8962467B2Metal fuse structure for improved programming capabilityBONILLA GRISELDA·Filed 2012·Granted Feb 24, 2015·6 cites·9 claims
- 2284US9324635B2Semiconductor interconnect structure having a graphene-based barrier metal layerIBM·Filed 2014·Granted Apr 26, 2016·6 cites·10 claims
- 2382US8796150B2Bilayer trench first hardmask structure and process for reduced defectivityAKINMADE-YUSUFF HAKEEM B S·Filed 2011·Granted Aug 5, 2014·8 cites·11 claims
- 2480US10832946B1Recessed interconnet line having a low-oxygen cap for facilitating a robust planarization process and protecting the interconnect line from downstream etch operationsIBM·Filed 2019·Granted Nov 10, 2020·3 cites·20 claims
- 2579US9385038B2Selective local metal cap layer formation for improved electromigration behaviorIBM·Filed 2015·Granted Jul 5, 2016·2 cites·6 claims
- 2678US9536842B2Structure with air gap crack stopGLOBALFOUNDRIES INC·Filed 2014·Granted Jan 3, 2017·4 cites·18 claims
- 2777US9425144B2Metal fuse structure for improved programming capabilityGLOBALFOUNDRIES INC·Filed 2014·Granted Aug 23, 2016·3 cites·15 claims
- 2876US9893011B2Back-end electrically programmable fuseIBM·Filed 2015·Granted Feb 13, 2018·2 cites·4 claims
- 2976US9059250B2Lateral-dimension-reducing metallic hard mask etchCHOI SAMUEL S·Filed 2012·Granted Jun 16, 2015·4 cites·20 claims
- 3075US8138093B2Method for forming trenches having different widths and the same depthAKINMADE-YUSUFF HAKEEM B S·Filed 2009·Granted Mar 20, 2012·6 cites·20 claims
- 3173US9034664B2Method to resolve hollow metal defects in interconnectsBONILLA GRISELDA·Filed 2012·Granted May 19, 2015·3 cites·8 claims
- 3272US9324655B2Modified via bottom for beol via efuseIBM·Filed 2014·Granted Apr 26, 2016·2 cites·18 claims
- 3372US7442650B2Methods of manufacturing semiconductor structures using RIE processIBM·Filed 2007·Granted Oct 28, 2008·3 cites·1 claims
- 3471US9105641B2Profile control in interconnect structuresIBM·Filed 2014·Granted Aug 11, 2015·2 cites·12 claims
- 3570US12150393B2Heater for phase change material memory cellIBM·Filed 2022·Granted Nov 19, 2024·0 cites·19 claims
- 3670US9431346B2Graphene-metal E-fuseGLOBALFOUNDRIES INC·Filed 2014·Granted Aug 30, 2016·2 cites·13 claims
- 3770US7045464B1Via reactive ion etching processIBM·Filed 2004·Granted May 16, 2006·13 cites·25 claims
- 3868US8836124B2Fuse and integrated conductorBONILLA GRISELDA·Filed 2012·Granted Sep 16, 2014·2 cites·13 claims
- 3967US9076847B2Selective local metal cap layer formation for improved electromigration behaviorIBM·Filed 2013·Granted Jul 7, 2015·1 cites·6 claims
- 4064US8921167B2Modified via bottom for BEOL via efuseIBM·Filed 2013·Granted Dec 30, 2014·1 cites·7 claims
- 4163US9257391B2Hybrid graphene-metal interconnect structuresGLOBALFOUNDRIES INC·Filed 2013·Granted Feb 9, 2016·1 cites·7 claims
- 4257US2024090353A1Sub-euv patterning heaters for bar mushroom cell pcmIBM·Filed 2022·Application pending·0 cites
- 4356US9099468B2Electronic fuse vias in interconnect structuresIBM·Filed 2014·Granted Aug 4, 2015·0 cites·19 claims
- 4455US11908944B2Contact formation for vertical field effect transistorsIBM·Filed 2021·Granted Feb 20, 2024·0 cites·8 claims
- 4555US10224236B2Forming air gapGLOBALFOUNDRIES INC·Filed 2017·Granted Mar 5, 2019·0 cites·18 claims
- 4654US9406560B2Selective local metal cap layer formation for improved electromigration behaviorIBM·Filed 2015·Granted Aug 2, 2016·0 cites·5 claims
- 4754US9240376B2Self-aligned via fuseGLOBALFOUNDRIES INC·Filed 2013·Granted Jan 19, 2016·0 cites·13 claims
- 4852US10186482B2Self aligned via fuseGLOBALFOUNDRIES INC·Filed 2015·Granted Jan 22, 2019·0 cites·20 claims
- 4952US9093452B2Electronic fuse with resistive heaterIBM·Filed 2013·Granted Jul 28, 2015·0 cites·17 claims
- 5050US9059169B2E-fuse structures and methods of manufactureBONILLA GRISELDA·Filed 2011·Granted Jun 16, 2015·0 cites·18 claims
Showing the top 50 of 57 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →