Inventor · disambiguated record
Steven Towle
Also filed as: BRAUNISCH HENNING · GEORGE ANNA M · GEORGE LEGAL REPRESENTATIVE AN · HU CHUAN
42 granted patents·12 pending applications·3,067 citations·filing 1998–2008
99Inventor score
Top patents by PatentIndex Score
54 records- 0199US6762435B2Semiconductor device with boron containing carbon doped silicon oxide layerINTEL CORP·Filed 2003·Granted Jul 13, 2004·229 cites·2 claims
- 0298US7420273B2Thinned die integrated circuit packageINTEL CORP·Filed 2005·Granted Sep 2, 2008·63 cites·16 claims
- 0398US7078788B2Microelectronic substrates with integrated devicesINTEL CORP·Filed 2004·Granted Jul 18, 2006·223 cites·9 claims
- 0498US6841413B2Thinned die integrated circuit packageINTEL CORP·Filed 2002·Granted Jan 11, 2005·196 cites·30 claims
- 0598US6734534B1Microelectronic substrate with integrated devicesINTEL CORP·Filed 2000·Granted May 11, 2004·183 cites·4 claims
- 0698US6555906B2Microelectronic package having a bumpless laminated interconnection layerINTEL CORP·Filed 2000·Granted Apr 29, 2003·273 cites·14 claims
- 0797US7189596B1Process for forming a direct build-up layer on an encapsulated die packages utilizing intermediate structuresINTEL CORP·Filed 2000·Granted Mar 13, 2007·151 cites·24 claims
- 0897US6943440B2Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flowINTEL CORP·Filed 2003·Granted Sep 13, 2005·151 cites·14 claims
- 0996US6709898B1Die-in-heat spreader microelectronic packageINTEL CORP·Filed 2000·Granted Mar 23, 2004·221 cites·17 claims
- 1095US6586276B2Method for fabricating a microelectronic device using wafer-level adhesion layer depositionINTEL CORP·Filed 2001·Granted Jul 1, 2003·122 cites·31 claims
- 1194US7067356B2Method of fabricating microelectronic package having a bumpless laminated interconnection layerINTEL CORP·Filed 2003·Granted Jun 27, 2006·79 cites·20 claims
- 1294US6888240B2High performance, low cost microelectronic circuit package with interposerINTEL CORP·Filed 2001·Granted May 3, 2005·146 cites·38 claims
- 1393US7226812B2Wafer support and release in wafer processingINTEL CORP·Filed 2004·Granted Jun 5, 2007·63 cites·26 claims
- 1493US6894399B2Microelectronic device having signal distribution functionality on an interfacial layer thereofINTEL CORP·Filed 2001·Granted May 17, 2005·130 cites·26 claims
- 1593US6489185B1Protective film for the fabrication of direct build-up layers on an encapsulated die packageINTEL CORP·Filed 2000·Granted Dec 3, 2002·81 cites·24 claims
- 1692US7183658B2Low cost microelectronic circuit packageINTEL CORP·Filed 2001·Granted Feb 27, 2007·84 cites·47 claims
- 1792US6977435B2Thick metal layer integrated process flow to improve power delivery and mechanical bufferingINTEL CORP·Filed 2003·Granted Dec 20, 2005·82 cites·28 claims
- 1891US7888183B2Thinned die integrated circuit packageINTEL CORP·Filed 2008·Granted Feb 15, 2011·17 cites·14 claims
- 1991US7071024B2Method for packaging a microelectronic device using on-die bond pad expansionINTEL CORP·Filed 2001·Granted Jul 4, 2006·93 cites·27 claims
- 2091US6610362B1Method of forming a carbon doped oxide layer on a substrateINTEL CORP·Filed 2000·Granted Aug 26, 2003·39 cites·8 claims
- 2190US6834133B1Optoelectronic packages and methods to simultaneously couple an optoelectronic chip to a waveguide and substrateINTEL CORP·Filed 2003·Granted Dec 21, 2004·41 cites·31 claims
- 2289US6706553B2Dispensing process for fabrication of microelectronic packagesINTEL CORP·Filed 2001·Granted Mar 16, 2004·83 cites·30 claims
- 2388US6792179B2Optical thumbtackINTEL CORP·Filed 2002·Granted Sep 14, 2004·35 cites·31 claims
- 2488US6436822B1Method for making a carbon doped oxide dielectric materialINTEL CORP·Filed 2000·Granted Aug 20, 2002·39 cites·17 claims
- 2587US6806168B2Healing of micro-cracks in an on-chip dielectricINTEL CORP·Filed 2002·Granted Oct 19, 2004·34 cites·15 claims
- 2685US7256059B2Underfill integration for optical packagesINTEL CORP·Filed 2005·Granted Aug 14, 2007·11 cites·20 claims
- 2783US6846737B1Plasma induced depletion of fluorine from surfaces of fluorinated low-k dielectric materialsINTEL CORP·Filed 2000·Granted Jan 25, 2005·24 cites·36 claims
- 2881US6838299B2Forming defect prevention trenches in dicing streetsINTEL CORP·Filed 2001·Granted Jan 4, 2005·27 cites·20 claims
- 2980US7039263B2Electrooptic assemblyINTEL CORP·Filed 2002·Granted May 2, 2006·27 cites·22 claims
- 3079US7236666B2On-substrate microlens to couple an off-substrate light emitter and/or receiver with an on-substrate optical deviceINTEL CORP·Filed 2004·Granted Jun 26, 2007·19 cites·16 claims
- 3178US7177504B2Manufacturable connectorization process for optical chip-to-chip interconnectsINTEL CORP·Filed 2004·Granted Feb 13, 2007·18 cites·32 claims
- 3277US7372120B1Methods and apparatus to optically couple an optoelectronic chip to a waveguideINTEL CORP·Filed 2003·Granted May 13, 2008·16 cites·31 claims
- 3373US7042106B2Underfill integration for optical packagesINTEL CORP·Filed 2003·Granted May 9, 2006·16 cites·26 claims
- 3468US6975017B2Healing of micro-cracks in an on-chip dielectricINTEL CORP·Filed 2004·Granted Dec 13, 2005·10 cites·10 claims
- 3567US6518171B1Dual damascene process using a low k interlayer for forming vias and trenchesINTEL CORP·Filed 2001·Granted Feb 11, 2003·13 cites·21 claims
- 3666US7369718B2Package substrate pattern to accommodate optical waveguideINTEL CORP·Filed 2004·Granted May 6, 2008·11 cites·28 claims
- 3760US7012015B2Wafer-level thick film standing-wave clockingINTEL CORP·Filed 2005·Granted Mar 14, 2006·1 cites·10 claims
- 3858US6593650B2Plasma induced depletion of fluorine from surfaces of fluorinated low-k dielectric materialsINTEL CORP·Filed 2002·Granted Jul 15, 2003·5 cites·7 claims
- 3955US7589417B2Microelectronic assembly having thermoelectric elements to cool a die and a method of making the sameINTEL CORP·Filed 2004·Granted Sep 15, 2009·8 cites·11 claims
- 4055US6770575B2Method for improving thermal stability of fluorinated amorphous carbon low dielectric constant materialsINTEL CORP·Filed 2002·Granted Aug 3, 2004·3 cites·7 claims
- 4149US2007190776A1Methods of Processing Thick ILD Layers Using Spray Coating or Lamination for C4 Wafer Level Thick Metal Integrated FlowINTEL CORP·Filed 2007·Application pending·0 cites
- 4246US2006076678A1Thick metal layer integrated process flow to improve power delivery and mechanical bufferingKIM SARAH E·Filed 2005·Application pending·0 cites
- 4346US2006012039A1Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flowKIM SARAH E·Filed 2005·Application pending·0 cites
- 4445US7085449B2Waveguide coupling mechanismINTEL CORP·Filed 2004·Granted Aug 1, 2006·0 cites·22 claims
- 4540US6927496B2Wafer-level thick film standing-wave clockingINTEL CORP·Filed 2003·Granted Aug 9, 2005·0 cites·20 claims
- 4639US2003068852A1Protective film for the fabrication of direct build-up layers on an encapsulated die packageINTEL CORP·Filed 2002·Application pending·0 cites
- 4739US2004155325A1Die-in heat spreader microelectronic packageINTEL CORP·Filed 2004·Application pending·0 cites
- 4838US2005136640A1Die exhibiting an effective coefficient of thermal expansion equivalent to a substrate mounted thereon, and processes of making sameFiled 2004·Application pending·0 cites
- 4938US2002020898A1Microelectronic substrates with integrated devicesFiled 2001·Application pending·0 cites
- 5037US2004126064A1Optical assemblyFiled 2002·Application pending·0 cites
Showing the top 50 of 54 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →