Inventor · disambiguated record
Richard S. Graf
Also filed as: GRAF RICHARD · GRAF RICHARD S · GRAF RICHARD STEPHEN
51 granted patents·9 pending applications·115 citations·filing 2009–2025
97Inventor score
Top patents by PatentIndex Score
60 records- 0196US10083891B1Memory having thermoelectric heat pump and related IC chip package and methodGLOBALFOUNDRIES INC·Filed 2017·Granted Sep 25, 2018·23 cites·14 claims
- 0294US9184112B1Cooling apparatus for an integrated circuitIBM·Filed 2014·Granted Nov 10, 2015·18 cites·20 claims
- 0392US9536732B2Low temperature fabrication of lateral thin film varistorIBM·Filed 2015·Granted Jan 3, 2017·5 cites·20 claims
- 0489US9356089B1Low temperature fabrication of lateral thin film varistorIBM·Filed 2015·Granted May 31, 2016·4 cites·3 claims
- 0586US10476227B2Dual bond pad structure for photonicsIBM·Filed 2017·Granted Nov 12, 2019·3 cites·20 claims
- 0686US10340241B2Chip-on-chip structure and methods of manufactureIBM·Filed 2015·Granted Jul 2, 2019·4 cites·17 claims
- 0785US9741695B2Three-dimensional hybrid packaging with through-silicon-vias and tape-automated-bondingGLOBALFOUNDRIES INC·Filed 2016·Granted Aug 22, 2017·4 cites·13 claims
- 0884US11682646B2IC chip package with dummy solder structure under corner, and related methodMARVELL ASIA PTE LTD·Filed 2021·Granted Jun 20, 2023·1 cites·7 claims
- 0984US11171104B2IC chip package with dummy solder structure under corner, and related methodMARVELL INT LTD·Filed 2019·Granted Nov 9, 2021·4 cites·18 claims
- 1084US9368425B2Embedded heat spreader with electrical propertiesGLOBALFOUNDRIES INC·Filed 2013·Granted Jun 14, 2016·7 cites·20 claims
- 1181US11810832B2Heat sink configuration for multi-chip moduleMARVELL ASIA PTE LTD·Filed 2021·Granted Nov 7, 2023·1 cites·12 claims
- 1280US8988140B2Real-time adaptive voltage control of logic blocksIBM·Filed 2013·Granted Mar 24, 2015·5 cites·19 claims
- 1379US10651135B2Tamper detection for a chip packageMARVELL INT LTD·Filed 2016·Granted May 12, 2020·2 cites·19 claims
- 1478US9472483B2Integrated circuit cooling apparatusIBM·Filed 2015·Granted Oct 18, 2016·3 cites·13 claims
- 1575US9608403B2Dual bond pad structure for photonicsIBM·Filed 2014·Granted Mar 28, 2017·2 cites·9 claims
- 1674US10734346B2Method of manufacturing chip-on-chip structure comprising sinterted pillarsIBM·Filed 2019·Granted Aug 4, 2020·1 cites·15 claims
- 1774US9721852B2Semiconductor TSV device package to which other semiconductor device package can be later attachedIBM·Filed 2014·Granted Aug 1, 2017·3 cites·6 claims
- 1874US9659835B1Techniques for integrating thermal via structures in integrated circuitsGLOBALFOUNDRIES INC·Filed 2016·Granted May 23, 2017·3 cites·22 claims
- 1973US9913405B2Glass interposer with embedded thermoelectric devicesIBM·Filed 2015·Granted Mar 6, 2018·2 cites·8 claims
- 2073US8907470B2Millimeter wave wafer level chip scale packaging (WLCSP) device and related methodIBM·Filed 2013·Granted Dec 9, 2014·2 cites·9 claims
- 2172US8756549B2Integrated circuit chip incorporating embedded thermal radiators for localized, on-demand, heating and a system and method for designing such an integrated circuit chipGRAF RICHARD S·Filed 2011·Granted Jun 17, 2014·6 cites·14 claims
- 2271US9882369B2Multi-layer heat shrinkable tubular sleeveTYCO ELECTRONICS RAYCHEM GMBH·Filed 2013·Granted Jan 30, 2018·1 cites·19 claims
- 2368US10249590B2Stacked dies using one or more interposersGLOBALFOUNDRIES INC·Filed 2017·Granted Apr 2, 2019·1 cites·20 claims
- 2467US9478453B2Sacrificial carrier dicing of semiconductor wafersIBM·Filed 2014·Granted Oct 25, 2016·1 cites·16 claims
- 2564US10978416B2Dual bond pad structure for photonicsIBM·Filed 2019·Granted Apr 13, 2021·0 cites·19 claims
- 2664US9559283B2Integrated circuit cooling using embedded peltier micro-vias in substrateIBM·Filed 2015·Granted Jan 31, 2017·1 cites·10 claims
- 2764US9508690B2Semiconductor TSV device package for circuit board connectionIBM·Filed 2015·Granted Nov 29, 2016·1 cites·17 claims
- 2864US8304290B2Overcoming laminate warpage and misalignment in flip-chip packagesGRAF RICHARD S·Filed 2009·Granted Nov 6, 2012·3 cites·25 claims
- 2963US10043962B2Thermoelectric cooling using through-silicon viasGLOBALFOUNDRIES INC·Filed 2016·Granted Aug 7, 2018·1 cites·19 claims
- 3063US9570422B2Semiconductor TSV device package for circuit board connectionIBM·Filed 2014·Granted Feb 14, 2017·1 cites·17 claims
- 3162US11366154B2Enabling of functional logic in IC using thermal sequence enabling testGLOBALFOUNDRIES US INC·Filed 2019·Granted Jun 21, 2022·0 cites·20 claims
- 3262US10170224B2Low temperature fabrication of lateral thin film varistorIBM·Filed 2017·Granted Jan 1, 2019·0 cites·20 claims
- 3362US8448118B2Determining intra-die wirebond pad placement locations in integrated circuitGRAF RICHARD S·Filed 2011·Granted May 21, 2013·2 cites·20 claims
- 3460US9870851B2Low temperature fabrication of lateral thin film varistorIBM·Filed 2016·Granted Jan 16, 2018·0 cites·20 claims
- 3560US9865674B2Low temperature fabrication of lateral thin film varistorIBM·Filed 2016·Granted Jan 9, 2018·0 cites·17 claims
- 3659US2019244926A1Chip-on-chip structure and methods of manufactureIBM·Filed 2019·Application pending·0 cites
- 3758US9236361B2Millimeter wave wafer level chip scale packaging (WLCSP) deviceIBM·Filed 2014·Granted Jan 12, 2016·0 cites·11 claims
- 3858US9159692B2Millimeter wave wafer level chip scale packaging (WLCSP) device and related methodIBM·Filed 2014·Granted Oct 13, 2015·0 cites·4 claims
- 3958US2024250068A1Mechanical stiffener for integrated circuit package with varying heat dissipation modesMARVELL ASIA PTE LTD·Filed 2024·Application pending·0 cites
- 4057US10833038B2Dual bond pad structure for photonicsIBM·Filed 2017·Granted Nov 10, 2020·0 cites·19 claims
- 4154US10304763B2Producing wafer level packaging using leadframe strip and related deviceGLOBALFOUNDRIES INC·Filed 2017·Granted May 28, 2019·0 cites·20 claims
- 4254US2025343161A1Warpage mitigation in a cluster of multiple high bandwidth memory stacksMARVELL ASIA PTE LTD·Filed 2025·Application pending·0 cites
- 4352US2023260871A1Three-Dimensional Device Package with Vertical Heat PipesMARVELL ASIA PTE LTD·Filed 2023·Application pending·0 cites
- 4452US2023197635A1Stiffener ring for packages with micro-cable/optical connectorsMARVELL ASIA PTE LTD·Filed 2022·Application pending·0 cites
- 4552US2016365329A1Chip-on-chip structure and methods of manufactureIBM·Filed 2016·Application pending·0 cites
- 4651US9892999B2Producing wafer level packaging using leadframe strip and related deviceGLOBALFOUNDRIES INC·Filed 2016·Granted Feb 13, 2018·0 cites·14 claims
- 4751US2023035100A1heat dissipation and electrical robustness in a three-dimensional package of stacked integrated circuitsMARVELL ASIA PTE LTD·Filed 2022·Application pending·0 cites
- 4850US9972606B2Three-dimensional hybrid packaging with through-silicon-vias and tape-automated-bondingGLOBALFOUNDRIES INC·Filed 2017·Granted May 15, 2018·0 cites·20 claims
- 4950US9484239B2Sacrificial carrier dicing of semiconductor wafersIBM·Filed 2015·Granted Nov 1, 2016·0 cites·9 claims
- 5048US12199003B2Packaging stacked substrates and an integrated circuit die using a lid and a stiffening structureMARVELL ASIA PTE LTD·Filed 2021·Granted Jan 14, 2025·0 cites·17 claims
Showing the top 50 of 60 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →