Inventor · disambiguated record
Shuo-Che Chang
Also filed as: CHANG SHUO-CHE
10 granted patents·5 pending applications·43 citations·filing 2008–2024
85Inventor score
Top patents by PatentIndex Score
15 records- 0191US10685883B1Method of wafer dicing and dieWINBOND ELECTRONICS CORP·Filed 2019·Granted Jun 16, 2020·9 cites·12 claims
- 0287US9691979B2Resistive random access memory and method of fabricating the sameWINBOND ELECTRONICS CORP·Filed 2014·Granted Jun 27, 2017·6 cites·9 claims
- 0386US9224947B1Resistive RAM and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2014·Granted Dec 29, 2015·14 cites·12 claims
- 0484US10515853B1Method of wafer dicingWINBOND ELECTRONICS CORP·Filed 2018·Granted Dec 24, 2019·4 cites·10 claims
- 0583US8043884B1Methods of seamless gap fillingNANYA TECHNOLOGY CORP·Filed 2010·Granted Oct 25, 2011·9 cites·16 claims
- 0664US10305033B2Resistive random access memoryWINBOND ELECTRONICS CORP·Filed 2015·Granted May 28, 2019·1 cites·8 claims
- 0759US2025338523A1Semiconductor device and method for forming the sameWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0856US2010310790A1Method of forming carbon-containing layerNANYA TECHNOLOGY CORP·Filed 2009·Application pending·0 cites
- 0953US12029049B2Memory structures and methods for forming the sameWINBOND ELECTRONICS CORP·Filed 2020·Granted Jul 2, 2024·0 cites·20 claims
- 1052US10636967B2Method for manufacturing electrode and resistive random access memoryWINBOND ELECTRONICS CORP·Filed 2019·Granted Apr 28, 2020·0 cites·8 claims
- 1152US9356235B2Structure and formation method of memory deviceWINBOND ELECTRONICS CORP·Filed 2014·Granted May 31, 2016·0 cites·14 claims
- 1252US9166160B1Resistive random access memory and method of fabricating the sameWINBOND ELECTRONICS CORP·Filed 2014·Granted Oct 20, 2015·0 cites·10 claims
- 1346US2010051578A1Method for fabricating an integrated circuitCHANG SHUO-CHE·Filed 2009·Application pending·0 cites
- 1444US2017256712A1Method for manufacturing electrode and resistive random access memoryWINBOND ELECTRONICS CORP·Filed 2016·Application pending·0 cites
- 1542US2010055898A1Method for fabricating an integrated circuitCHANG SHUO-CHE·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →