Inventor · disambiguated record
Sung Yun Lee
Also filed as: LEE SUNG-YUN
12 granted patents·3 pending applications·16 citations·filing 2009–2022
85Inventor score
Files withSAMSUNG ELECTRONICS CO LTD9HYUN CHUNG IL1KOREA INST IND TECH1POSTECH RES & BUSINESS DEV FOUND1SNU R&DB FOUNDATION1
Top patents by PatentIndex Score
15 records- 0188US11910614B2Three dimensional semiconductor device and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 20, 2024·1 cites·20 claims
- 0288US10355010B2Memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 16, 2019·7 cites·20 claims
- 0380US11296104B2Three dimensional semiconductor device and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 5, 2022·1 cites·15 claims
- 0479US10629609B2Three dimensional semiconductor device and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 21, 2020·2 cites·20 claims
- 0574US10770473B2Vertical type semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 8, 2020·1 cites·20 claims
- 0673US10312138B2Semiconductor devicesHYUN CHUNG IL·Filed 2017·Granted Jun 4, 2019·3 cites·19 claims
- 0769US10658230B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 19, 2020·1 cites·20 claims
- 0864US11411024B2Vertical type semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 9, 2022·0 cites·20 claims
- 0956US2020235003A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
- 1053US10854623B2Memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 1, 2020·0 cites·20 claims
- 1151US2010317502A1Sintered material for dielectric substance and process for preparing the sameSNU R&DB FOUNDATION·Filed 2009·Application pending·0 cites
- 1250US11036904B2Apparatus and method for ternary logic synthesis with modified Quine-McCluskey algorithmPOSTECH RES & BUSINESS DEV FOUND·Filed 2019·Granted Jun 15, 2021·0 cites·5 claims
- 1346US12186792B2Hot-stamping molding method enabling molding of components having various levels of strength by part through cooling control by positionKOREA INST IND TECH·Filed 2020·Granted Jan 7, 2025·0 cites·2 claims
- 1445US11020705B2Porous outflow pipe for forward osmosis or pressure-retarded osmosis, and forward osmosis or pressure-retarded osmosis module comprising sameTORAY ADVANCED MAT KOREA INC·Filed 2014·Granted Jun 1, 2021·0 cites·11 claims
- 1530US2012040187A1Precursor powder for sintering used for preparing dielectric material and process for preparing the sameYOO SANG-IM·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →