Inventor · disambiguated record
Franz-Peter Kalz
Also filed as: KALZ FRANZ-PETER
20 granted patents·3 pending applications·49 citations·filing 2011–2019
92Inventor score
Top patents by PatentIndex Score
23 records- 0193US9728652B2Sensor device and methodELIAN KLAUS·Filed 2012·Granted Aug 8, 2017·14 cites·18 claims
- 0291US9741677B1Semiconductor device including antistatic die attach materialINFINEON TECHNOLOGIES AG·Filed 2016·Granted Aug 22, 2017·7 cites·11 claims
- 0390US9048338B2Device including two power semiconductor chips and manufacturing thereofHOSSEINI KHALIL·Filed 2011·Granted Jun 2, 2015·12 cites·5 claims
- 0486US10818805B2Semiconductor sensor device and method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2018·Granted Oct 27, 2020·2 cites·20 claims
- 0583US9021887B2Micromechanical semiconductor sensing deviceKALZ FRANZ-PETER·Filed 2011·Granted May 5, 2015·6 cites·3 claims
- 0677US10438878B2Package with component connected with carrier via spacer particlesINFINEON TECHNOLOGIES AG·Filed 2018·Granted Oct 8, 2019·2 cites·15 claims
- 0777US9159701B2Method of manufacturing a chip package, chip package, method of manufacturing a chip assembly and chip assemblyINFINEON TECHNOLOGIES AG·Filed 2013·Granted Oct 13, 2015·4 cites·10 claims
- 0869US9790086B2Micromechanical semiconductor sensing deviceINFINEON TECHNOLOGIES AG·Filed 2016·Granted Oct 17, 2017·1 cites·2 claims
- 0964US9313897B2Method for electrophoretically depositing a film on an electronic assemblyMAHLER JOACHIM·Filed 2012·Granted Apr 12, 2016·1 cites·14 claims
- 1056US11094619B2Package with component connected with carrier via spacer particlesINFINEON TECHNOLOGIES AG·Filed 2019·Granted Aug 17, 2021·0 cites·20 claims
- 1156US10858245B2Deposition of protective material at wafer level in front end for early stage particle and moisture protectionINFINEON TECHNOLOGIES AG·Filed 2019·Granted Dec 8, 2020·0 cites·26 claims
- 1256US9559078B2Electronic componentINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jan 31, 2017·0 cites·9 claims
- 1355US10304795B2Semiconductor device including antistatic die attach materialINFINEON TECHNOLOGIES AG·Filed 2017·Granted May 28, 2019·0 cites·20 claims
- 1455US9984897B2Method for manufacturing a chip arrangement including a ceramic layerINFINEON TECHNOLOGIES AG·Filed 2016·Granted May 29, 2018·0 cites·19 claims
- 1553US9567211B2Micromechanical semiconductor sensing deviceINFINEON TECHNOLOGIES AG·Filed 2015·Granted Feb 14, 2017·0 cites·7 claims
- 1652US10370244B2Deposition of protective material at wafer level in front end for early stage particle and moisture protectionINFINEON TECHNOLOGIES AG·Filed 2017·Granted Aug 6, 2019·0 cites·19 claims
- 1750US8947886B2Electronic componentMAHLER JOACHIM·Filed 2011·Granted Feb 3, 2015·0 cites·26 claims
- 1849US8564026B2Chip, method for producing a chip and device for laser ablationKALZ FRANZ-PETER·Filed 2011·Granted Oct 22, 2013·0 cites·17 claims
- 1948US9530754B2Chip package and chip assemblyINFINEON TECHNOLOGIES AG·Filed 2015·Granted Dec 27, 2016·0 cites·13 claims
- 2048US2014197527A1Chip arrangement and a method for manufacturing a chip arrangementINFINEON TECHNOLOGIES AG·Filed 2013·Application pending·0 cites
- 2147US8912450B2Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a chip-packaging module and a packaging moduleMAHLER JOACHIM·Filed 2011·Granted Dec 16, 2014·0 cites·6 claims
- 2247US2016240449A1Method for Electrophoretically Depositing a Film on an Electronic AssemblyINFINEON TECHNOLOGIES AG·Filed 2016·Application pending·0 cites
- 2340US2014116149A1Sensor with maskingINFINEON TECHNOLOGIES AG·Filed 2013·Application pending·0 cites
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