Method for Electrophoretically Depositing a Film on an Electronic Assembly

Abstract

A packaged component and a method for making a packaged component are disclosed. In an embodiment the packaged component includes a component carrier having a component carrier contact and a component disposed on the component carrier, the component having a component contact. The packaged component further includes a conductive connection element connecting the component carrier contact with the component contact, an insulating film disposed directly at least on one of a top surface of the component or the conductive connection element, and an encapsulant encapsulating the component carrier, the component and the enclosed conductive connection elements.

What is claimed is: 
     
         1 . A system comprising:
 a component carrier comprising a component carrier contact;   a component disposed on the component carrier, the component comprising a component contact;   a conductive connection element connecting the component carrier contact with the component contact;   an insulating film disposed directly on at least one of the component, the conductive connection element, and the component carrier; and   an encapsulant encapsulating the component carrier, the component and the conductive connection elements.   
     
     
         2 . The system according to  claim 1 , wherein the insulating film comprises a thickness of ≦50 μm. 
     
     
         3 . The system according to  claim 1 , wherein the conductive connection elements are wire bonds, wherein the component carrier is a leadframe, and wherein encapsulation material comprises a molding compound or a laminate material. 
     
     
         4 . The system according to  claim 1 , wherein the insulating film is disposed directly on metallic surfaces of the component carrier, the component and the conductive connection element. 
     
     
         5 . The system according to  claim 1 , wherein the insulating film is a polymer film. 
     
     
         6 . The system according to  claim 5 , wherein the polymer film comprises a polyurethane resin. 
     
     
         7 . The system according to  claim 5 , wherein the polymer film comprises a polar high performance thermoplastic. 
     
     
         8 . The system according to  claim 5 , wherein the polymer film comprises an epoxy. 
     
     
         9 . The system according to  claim 8 , wherein the polymer film comprises the epoxy with an anime type hardener. 
     
     
         10 . The system according to  claim 1 , wherein the insulating film is based on a monomer and wherein the monomer comprises an acid-structure, a carbonyl-structure, a sulfonate-structure, an isocyanate-structure or a hydroxyl-structure. 
     
     
         11 . A method for manufacturing a system, the method comprising:
 electrophoretic depositing an insulating film on a component carrier;   attaching a component to the component carrier by placing an adhesive layer of the component to the insulating film of the component carrier; and   encapsulating the component and the component carrier.   
     
     
         12 . The method according to  claim 11 , wherein the component carrier is a leadframe. 
     
     
         13 . The method according to  claim 12 , further comprising removing portions from the insulating film from leads, and wire bonding component contact pads to the component to the leads. 
     
     
         14 . The method according to  claim 12 , further comprising removing portions from the insulating film from leads, and clip bonding component contact pads of the component to the leads. 
     
     
         15 . The method according to  claim 11 , wherein attaching the component to the component carrier comprising forming an interleaved polymer to polymer interface. 
     
     
         16 . The method according to  claim 11 , wherein the adhesive layer and the insulating film comprise complementary materials. 
     
     
         17 . A method for manufacturing a system, the method comprising:
 placing a component on a component carrier;   connecting a conductive connection element with a component contact of the component and a component carrier contact of the component carrier; and   electrophoretic depositing an encapsulation material thereby encapsulating the conductive connection element, the component and the component carrier.   
     
     
         18 . The method according to  claim 17 , wherein the component comprises a thickness of less than about 20 μm, and wherein a thickness of the encapsulation material comprises a thickness of less than about 50 μm. 
     
     
         19 . The method according to  claim 17 , wherein the component comprises a thickness of about 20 μm to about 50 μm, and wherein a thickness of the encapsulation material comprises a thickness of about 20 μm to about 50 μm. 
     
     
         20 . The method according to  claim 17 , wherein the encapsulation material comprises a polymer.