Inventor · disambiguated record
Atsushi Miyanari
Also filed as: MIYANARI ATSUSHI
25 granted patents·8 pending applications·233 citations·filing 2004–2013
94Inventor score
Top patents by PatentIndex Score
33 records- 0195USD552565SSupporting plateTOKYO OHKA KOGYO CO LTD·Filed 2006·Granted Oct 9, 2007·69 cites·1 claims
- 0292USD544452SSupporting plateTOKYO OHKA KOGYO CO LTD·Filed 2006·Granted Jun 12, 2007·50 cites·1 claims
- 0391US7211168B2Substrate supporting plate and stripping method for supporting plateTOKYO OHKA KOGYO CO LTD·Filed 2004·Granted May 1, 2007·49 cites·7 claims
- 0488US8882096B2Perforated support plateTOKYO OHKA KOGYO CO LTD·Filed 2013·Granted Nov 11, 2014·7 cites·16 claims
- 0586US7919394B2Method for thinning substrate and method for manufacturing circuit deviceTOKYO OHKA KOGYO CO LTD·Filed 2006·Granted Apr 5, 2011·11 cites·12 claims
- 0682US8080123B2Supporting plate, apparatus and method for stripping supporting plateNAKAMURA AKIHIKO·Filed 2011·Granted Dec 20, 2011·5 cites·11 claims
- 0781US7268061B2Substrate attaching methodTOKYO OHKA KOGYO CO LTD·Filed 2004·Granted Sep 11, 2007·25 cites·11 claims
- 0878US8136564B2Attaching device and attaching apparatus for supporting plate, and attaching method for supporting plateNAKAMURA AKIHIKO·Filed 2006·Granted Mar 20, 2012·5 cites·14 claims
- 0976US8357750B2Adhesive composition and film adhesiveTOKYO OHKA KOGYO CO LTD·Filed 2010·Granted Jan 22, 2013·1 cites·4 claims
- 1072US8148457B2Adhesive composition and film adhesiveASAI TAKAHIRO·Filed 2007·Granted Apr 3, 2012·2 cites·16 claims
- 1170US8167687B2Method of thinning wafer and support plateNAKAMURA AKIHIKO·Filed 2007·Granted May 1, 2012·3 cites·3 claims
- 1265US8186410B2Separating deviceNAKAMURA AKIHIKO·Filed 2008·Granted May 29, 2012·2 cites·16 claims
- 1362US7849905B2Stripping device and stripping apparatusTOKYO OHKA KOGYO CO LTD·Filed 2006·Granted Dec 14, 2010·1 cites·20 claims
- 1461US9010343B2Cleaning device, cleaning method, and compositionMIYANARI ATSUSHI·Filed 2011·Granted Apr 21, 2015·1 cites·7 claims
- 1561US8449691B2Liquid solvent abutment unitNAKAMURA AKIHIKO·Filed 2008·Granted May 28, 2013·1 cites·6 claims
- 1659US8720456B2Processing apparatus fluid-processing a process target bodyMIYANARI ATSUSHI·Filed 2007·Granted May 13, 2014·1 cites·10 claims
- 1757US2010178497A1Adhesive composition, film adhesive, and process for production of the compositionASAI TAKAHIRO·Filed 2007·Application pending·0 cites
- 1852US7999052B2Process for producing an adhesive compositionTOKYO OHKA KOGYO CO LTD·Filed 2007·Granted Aug 16, 2011·0 cites·1 claims
- 1952US2009288780A1Perforated support plateNAKAMURA AKIHIKO·Filed 2007·Application pending·0 cites
- 2051US2007151674A1Substrate supporting plateTOKYO OHKA KOGYO CO LTD·Filed 2007·Application pending·0 cites
- 2150US8931535B2Attaching device and attaching apparatus for supporting plate, and attaching method for supporting plateNAKAMURA AKIHIKO·Filed 2012·Granted Jan 13, 2015·0 cites·4 claims
- 2250US2007062644A1Supporting plate, apparatus, and method for stripping supporting plateTOKYO OHKA KOGYO CO LTD·Filed 2006·Application pending·0 cites
- 2348US2009197070A1Support plateTOKYO OHKA KOGYO CO LTD·Filed 2009·Application pending·0 cites
- 2446US8426543B2Adhesive composition and adhesive filmASAI TAKAHIRO·Filed 2007·Granted Apr 23, 2013·0 cites·11 claims
- 2545US2009305617A1Support plate, carrier device, releasing device, and releasing methodTOKYO OHKA KOGYO CO LTD·Filed 2007·Application pending·0 cites
- 2644US8425713B2Bonding apparatus, method for preventing dissolving of adhesive agent, and bonding methodOHYA SATOSHI·Filed 2008·Granted Apr 23, 2013·0 cites·3 claims
- 2744US2007128832A1Supporting plate, and method for attaching supporting plateTOKYO OHKA KOGYO CO LTD·Filed 2006·Application pending·0 cites
- 2843US9406542B2Retention device and retention methodMIYANARI ATSUSHI·Filed 2012·Granted Aug 2, 2016·0 cites·17 claims
- 2943US8163836B2Adhesive composition and adhesive filmMISUMI KOICHI·Filed 2006·Granted Apr 24, 2012·0 cites·7 claims
- 3043US2014151328A1Method for forming laminateTOKYO OHKA KOGYO CO LTD·Filed 2013·Application pending·0 cites
- 3140US9962915B2Bonding method and bonding apparatusTOKYO OHKA KOGYO CO LTD·Filed 2013·Granted May 8, 2018·0 cites·10 claims
- 3240US8097087B2Method of cleaning support plateMITAKE TATSUHIRO·Filed 2010·Granted Jan 17, 2012·0 cites·3 claims
- 3338US8882930B2Method for processing process-target objectMIYANARI ATSUSHI·Filed 2011·Granted Nov 11, 2014·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →