Inventor · disambiguated record
Jaim Nulman
Also filed as: NULMAN JAIM
45 granted patents·8 pending applications·2,954 citations·filing 1987–2020
99Inventor score
Files withAPPLIED MATERIALS INC43PROCESSING TECHNOLOGIES INC AG3NANO DIMENSION TECH LTD2NULMAN JAIM2APPLIED MATERILAS INC1
Top patents by PatentIndex Score
53 records- 0198US6217721B1Filling narrow apertures and forming interconnects with a metal utilizing a crystallographically oriented liner layerAPPLIED MATERIALS INC·Filed 1996·Granted Apr 17, 2001·206 cites·59 claims
- 0297US6506009B1Apparatus for storing and moving a cassetteAPPLIED MATERIALS INC·Filed 2000·Granted Jan 14, 2003·525 cites·20 claims
- 0397US5754297AMethod and apparatus for monitoring the deposition rate of films during physical vapor depositionAPPLIED MATERIALS INC·Filed 1997·Granted May 19, 1998·146 cites·30 claims
- 0495US7234908B2Apparatus for storing and moving a cassetteAPPLIED MATERIALS INC·Filed 2005·Granted Jun 26, 2007·34 cites·16 claims
- 0595US4919542AEmissivity correction apparatus and methodPROCESSING TECHNOLOGIES INC AG·Filed 1988·Granted Apr 24, 1990·158 cites·6 claims
- 0694US6303395B1Semiconductor processing techniquesAPPLIED MATERIALS INC·Filed 1999·Granted Oct 16, 2001·142 cites·21 claims
- 0794US5250467AMethod for forming low resistance and low defect density tungsten contacts to silicon semiconductor waferAPPLIED MATERIALS INC·Filed 1991·Granted Oct 5, 1993·116 cites·18 claims
- 0892US6955517B2Apparatus for storing and moving a cassetteAPPLIED MATERIALS INC·Filed 2002·Granted Oct 18, 2005·59 cites·42 claims
- 0991US5242860AMethod for the formation of tin barrier layer with preferential (111) crystallographic orientationAPPLIED MATERIALS INC·Filed 1991·Granted Sep 7, 1993·91 cites·17 claims
- 1090US5236868AFormation of titanium nitride on semiconductor wafer by reaction of titanium with nitrogen-bearing gas in an integrated processing systemAPPLIED MATERIALS INC·Filed 1990·Granted Aug 17, 1993·133 cites·14 claims
- 1189US6368469B1Coils for generating a plasma and for sputteringAPPLIED MATERIALS INC·Filed 1997·Granted Apr 9, 2002·48 cites·54 claims
- 1289US5043300ASingle anneal step process for forming titanium silicide on semiconductor waferAPPLIED MATERIALS INC·Filed 1990·Granted Aug 27, 1991·126 cites·19 claims
- 1388US6572321B1Loader conveyor for substrate processing systemAPPLIED MATERIALS INC·Filed 2000·Granted Jun 3, 2003·40 cites·10 claims
- 1487US6783639B2Coils for generating a plasma and for sputteringAPPLIED MATERIALS INC·Filed 2002·Granted Aug 31, 2004·21 cites·32 claims
- 1586US5098198AWafer heating and monitor module and method of operationAPPLIED MATERIALS INC·Filed 1991·Granted Mar 24, 1992·92 cites·20 claims
- 1685US8398832B2Coils for generating a plasma and for sputteringNULMAN JAIM·Filed 2005·Granted Mar 19, 2013·10 cites·25 claims
- 1785US5460703ALow thermal expansion clamping mechanismAPPLIED MATERIALS INC·Filed 1994·Granted Oct 24, 1995·55 cites·5 claims
- 1884US6514390B1Method to eliminate coil sputtering in an ICP sourceAPPLIED MATERIALS INC·Filed 1996·Granted Feb 4, 2003·42 cites·21 claims
- 1984US5698989AFilm sheet resistance measurementAPPLIED MATERILAS INC·Filed 1996·Granted Dec 16, 1997·83 cites·31 claims
- 2083US6408220B1Semiconductor processing techniquesAPPLIED MATERIALS INC·Filed 1999·Granted Jun 18, 2002·66 cites·17 claims
- 2182US6654698B2Systems and methods for calibrating integrated inspection toolsAPPLIED MATERIALS INC·Filed 2001·Granted Nov 25, 2003·26 cites·35 claims
- 2282US6001227ATarget for use in magnetron sputtering of aluminum for forming metallization films having low defect densities and methods for manufacturing and using such targetAPPLIED MATERIALS INC·Filed 1997·Granted Dec 14, 1999·40 cites·30 claims
- 2380US6456894B1Semiconductor processing techniquesAPPLIED MATERIALS INC·Filed 1999·Granted Sep 24, 2002·57 cites·14 claims
- 2480US4854727AEmissivity calibration apparatus and methodPROCESSING TECHNOLOGIES INC AG·Filed 1987·Granted Aug 8, 1989·40 cites·7 claims
- 2579US5460689AHigh pressure plasma treatment method and apparatusAPPLIED MATERIALS INC·Filed 1994·Granted Oct 24, 1995·66 cites·19 claims
- 2678US5759360AWafer clean sputtering processAPPLIED MATERIALS INC·Filed 1995·Granted Jun 2, 1998·51 cites·4 claims
- 2778US5521120AMethod for the formation of tin barrier layer with preferential (111) crystallographic orientationAPPLIED MATERIALS INC·Filed 1995·Granted May 28, 1996·40 cites·12 claims
- 2878US5434044AMethod for the formation of tin barrier layer with preferential (111) crystallographic orientationAPPLIED MATERIALS INC·Filed 1994·Granted Jul 18, 1995·41 cites·19 claims
- 2977US5288665AProcess for forming low resistance aluminum plug in via electrically connected to overlying patterned metal layer for integrated circuit structuresAPPLIED MATERIALS INC·Filed 1992·Granted Feb 22, 1994·55 cites·17 claims
- 3076US5747360AMethod of metalizing a semiconductor waferAPPLIED MATERIALS INC·Filed 1995·Granted May 5, 1998·43 cites·27 claims
- 3175US6231725B1Apparatus for sputtering material onto a workpiece with the aid of a plasmaAPPLIED MATERIALS INC·Filed 1998·Granted May 15, 2001·41 cites·40 claims
- 3272US6583509B2Semiconductor processing techniquesAPPLIED MATERIALS INC·Filed 2001·Granted Jun 24, 2003·12 cites·17 claims
- 3372US5443995AMethod for metallizing a semiconductor waferAPPLIED MATERIALS INC·Filed 1993·Granted Aug 22, 1995·45 cites·18 claims
- 3471US7042558B1Eddy-optic sensor for object inspectionAPPLIED MATERIALS INC·Filed 2003·Granted May 9, 2006·9 cites·24 claims
- 3571US6608495B2Eddy-optic sensor for object inspectionAPPLIED MATERIALS INC·Filed 2001·Granted Aug 19, 2003·15 cites·24 claims
- 3669US5360996ATitanium nitride/titanium silicide multiple layer barrier with preferential (111) crystallographic orientation on titanium nitride surfaceAPPLIED MATERIALS INC·Filed 1993·Granted Nov 1, 1994·29 cites·18 claims
- 3767US6228186B1Method for manufacturing metal sputtering target for use in DC magnetron so that target has reduced number of conduction anomaliesAPPLIED MATERIALS INC·Filed 1999·Granted May 8, 2001·23 cites·37 claims
- 3865US6046100AMethod of fabricating a fabricating plug and near-zero overlap interconnect lineAPPLIED MATERIALS INC·Filed 1996·Granted Apr 4, 2000·27 cites·17 claims
- 3961US6361618B1Methods and apparatus for forming and maintaining high vacuum environmentsAPPLIED MATERIALS INC·Filed 1999·Granted Mar 26, 2002·21 cites·17 claims
- 4060US5356835AMethod for forming low resistance and low defect density tungsten contacts to silicon semiconductor waferAPPLIED MATERIALS INC·Filed 1993·Granted Oct 18, 1994·17 cites·17 claims
- 4158US6171455B1Target for use in magnetron sputtering of aluminum for forming metallization films having low defect densities and methods for manufacturing and using such targetAPPLIED MATERIALS INC·Filed 1999·Granted Jan 9, 2001·15 cites·24 claims
- 4258US4989991AEmissivity calibration apparatus and methodPROCESSING TECHNOLOGIES INC AG·Filed 1989·Granted Feb 5, 1991·17 cites·4 claims
- 4355US6126791ATarget for use in magnetron sputtering of aluminum for forming metallization films having low defect densities and methods for manufacturing and using such targetAPPLIED MATERIALS INC·Filed 1999·Granted Oct 3, 2000·12 cites·25 claims
- 4454US2007237609A1Apparatus for storing and moving a cassetteAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 4553US6455921B1Fabricating plug and near-zero overlap interconnect lineAPPLIED MATERIALS INC·Filed 2000·Granted Sep 24, 2002·4 cites·23 claims
- 4652US5904562AMethod of metallizing a semiconductor waferAPPLIED MATERIALS INC·Filed 1997·Granted May 18, 1999·15 cites·16 claims
- 4750US2013168232A1Coils for generating a plasma and for sputteringNULMAN JAIM·Filed 2013·Application pending·0 cites
- 4847US2022104344A1Integrated printed circuit boards and methods of fabricationNANO DIMENSION TECH LTD·Filed 2020·Application pending·0 cites
- 4947US2018301743A1Method and apparatus for manufacturing energy storage devicesTUBZ LLC·Filed 2018·Application pending·0 cites
- 5046US2004256217A1Coils for generating a plasma and for sputteringFiled 2004·Application pending·0 cites
Showing the top 50 of 53 patent records by PatentIndex Score.
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