Inventor · disambiguated record
Alain Duboust
Also filed as: DUBOUST ALAIN
47 granted patents·37 pending applications·1,085 citations·filing 2001–2024
98Inventor score
Top patents by PatentIndex Score
84 records- 0198US6776693B2Method and apparatus for face-up substrate polishingAPPLIED MATERIALS INC·Filed 2002·Granted Aug 17, 2004·101 cites·46 claims
- 0296US7422516B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2007·Granted Sep 9, 2008·42 cites·18 claims
- 0396US7278911B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Granted Oct 9, 2007·33 cites·18 claims
- 0496US6899804B2Electrolyte composition and treatment for electrolytic chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2001·Granted May 31, 2005·77 cites·37 claims
- 0596US6811680B2Planarization of substrates using electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2002·Granted Nov 2, 2004·102 cites·36 claims
- 0696US6773507B2Apparatus and method for fast-cycle atomic layer depositionAPPLIED MATERIALS INC·Filed 2002·Granted Aug 10, 2004·124 cites·39 claims
- 0795US6962524B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2003·Granted Nov 8, 2005·80 cites·32 claims
- 0893US7285036B2Pad assembly for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2006·Granted Oct 23, 2007·18 cites·20 claims
- 0993US6979248B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2002·Granted Dec 27, 2005·42 cites·61 claims
- 1092US6841057B2Method and apparatus for substrate polishingAPPLIED MATERIALS INC·Filed 2002·Granted Jan 11, 2005·21 cites·38 claims
- 1191US7323416B2Method and composition for polishing a substrateAPPLIED MATERIALS INC·Filed 2005·Granted Jan 29, 2008·20 cites·20 claims
- 1291US6991528B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2003·Granted Jan 31, 2006·45 cites·27 claims
- 1390US7137868B2Pad assembly for electrochemical mechanical processingAPPLIED MATERIALS INC·Filed 2006·Granted Nov 21, 2006·12 cites·32 claims
- 1490US6988942B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2004·Granted Jan 24, 2006·41 cites·18 claims
- 1588US7207878B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Granted Apr 24, 2007·11 cites·19 claims
- 1687US7059948B2Articles for polishing semiconductor substratesAPPLIED MATERIALS INC·Filed 2001·Granted Jun 13, 2006·25 cites·31 claims
- 1787US7029365B2Pad assembly for electrochemical mechanical processingAPPLIED MATERIALS INC·Filed 2003·Granted Apr 18, 2006·29 cites·31 claims
- 1886US7276743B2Retaining ring with conductive portionAPPLIED MATERIALS INC·Filed 2005·Granted Oct 2, 2007·11 cites·28 claims
- 1986US7229535B2Hydrogen bubble reduction on the cathode using double-cell designsAPPLIED MATERIALS INC·Filed 2003·Granted Jun 12, 2007·25 cites·20 claims
- 2086US7066800B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2001·Granted Jun 27, 2006·31 cites·67 claims
- 2186US6837983B2Endpoint detection for electro chemical mechanical polishing and electropolishing processesAPPLIED MATERIALS INC·Filed 2002·Granted Jan 4, 2005·32 cites·39 claims
- 2284US8157614B2Method of making and apparatus having windowless polishing pad and protected fiberZHANG JIMIN·Filed 2009·Granted Apr 17, 2012·8 cites·21 claims
- 2384US7790015B2Endpoint for electroprocessingAPPLIED MATERIALS INC·Filed 2007·Granted Sep 7, 2010·8 cites·15 claims
- 2484US7655565B2Electroprocessing profile controlAPPLIED MATERIALS INC·Filed 2005·Granted Feb 2, 2010·8 cites·32 claims
- 2583US8066552B2Multi-layer polishing pad for low-pressure polishingDUBOUST ALAIN·Filed 2005·Granted Nov 29, 2011·10 cites·31 claims
- 2682US7137879B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2006·Granted Nov 21, 2006·7 cites·20 claims
- 2781US9076827B2Transfer chamber metrology for improved device yieldBOUR DAVID P·Filed 2011·Granted Jul 7, 2015·4 cites·15 claims
- 2881US7160432B2Method and composition for polishing a substrateAPPLIED MATERIALS INC·Filed 2003·Granted Jan 9, 2007·21 cites·34 claims
- 2978US7520795B2Grooved retaining ringAPPLIED MATERIALS INC·Filed 2006·Granted Apr 21, 2009·8 cites·15 claims
- 3078US7128825B2Method and composition for polishing a substrateAPPLIED MATERIALS INC·Filed 2003·Granted Oct 31, 2006·20 cites·29 claims
- 3176US7628905B2Algorithm for real-time process control of electro-polishingAPPLIED MATERIALS INC·Filed 2006·Granted Dec 8, 2009·2 cites·3 claims
- 3274US7303462B2Edge bead removal by an electro polishing processAPPLIED MATERIALS INC·Filed 2005·Granted Dec 4, 2007·5 cites·17 claims
- 3373US10589397B2Endpoint control of multiple substrate zones of varying thickness in chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2017·Granted Mar 17, 2020·1 cites·16 claims
- 3473US7232514B2Method and composition for polishing a substrateAPPLIED MATERIALS INC·Filed 2003·Granted Jun 19, 2007·15 cites·63 claims
- 3572US6991526B2Control of removal profile in electrochemically assisted CMPAPPLIED MATERIALS INC·Filed 2002·Granted Jan 31, 2006·14 cites·14 claims
- 3671US8694144B2Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishingDUBOUST ALAIN·Filed 2010·Granted Apr 8, 2014·2 cites·13 claims
- 3770US7608173B2Biased retaining ringAPPLIED MATERIALS INC·Filed 2004·Granted Oct 27, 2009·12 cites·23 claims
- 3869US6977036B2Method and apparatus for substrate polishingAPPLIED MATERIALS INC·Filed 2004·Granted Dec 20, 2005·6 cites·35 claims
- 3968US7709382B2Electroprocessing profile controlAPPLIED MATERIALS INC·Filed 2007·Granted May 4, 2010·2 cites·11 claims
- 4066US7344432B2Conductive pad with ion exchange membrane for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2006·Granted Mar 18, 2008·3 cites·30 claims
- 4164US7390429B2Method and composition for electrochemical mechanical polishing processingAPPLIED MATERIALS INC·Filed 2005·Granted Jun 24, 2008·3 cites·13 claims
- 4263US2025129509A1Auxiliary flow plate for thickness and concentration uniformity adjustabilityAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4360US7311592B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2006·Granted Dec 25, 2007·1 cites·17 claims
- 4460US2025006523A1Apparatus and methods for adjusting plate temperatureAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 4556US8465342B2Method of making and apparatus having windowless polishing pad and protected fiberZHANG JIMIN·Filed 2012·Granted Jun 18, 2013·0 cites·11 claims
- 4656US2010130013A1Slurry composition for gst phase change memory materials polishingAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 4755US2008038999A1Retaining ring with conductive portionAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 4855US2014222188A1Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 4952US2007215488A1Methods and apparatus for electroprocessing with recessed bias contactAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 5051US2008108288A1Conductive Polishing Article for Electrochemical Mechanical PolishingHU YONGQI·Filed 2007·Application pending·0 cites
Showing the top 50 of 84 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →