Inventor · disambiguated record
Vivian W. Ryan
Also filed as: RYAN VIVIAN · RYAN VIVIAN W · RYAN VIVIAN WANDA
49 granted patents·6 pending applications·905 citations·filing 1988–2023
98Inventor score
Files withAGERE SYSTEMS INC17GLOBALFOUNDRIES INC9LUCENT TECHNOLOGIES INC7RYAN VIVIAN W7NORTHROP GRUMMAN SYSTEMS CORP4
Top patents by PatentIndex Score
55 records- 0198US8441131B2Strain-compensating fill patterns for controlling semiconductor chip package interactionsRYAN VIVIAN W·Filed 2011·Granted May 14, 2013·224 cites·25 claims
- 0293US6620720B1Interconnections to copper IC'sAGERE SYSTEMS INC·Filed 2000·Granted Sep 16, 2003·93 cites·16 claims
- 0393US5986343ABond pad design for integrated circuitsLUCENT TECHNOLOGIES INC·Filed 1998·Granted Nov 16, 1999·126 cites·12 claims
- 0491US7429502B2Integrated circuit device incorporating metallurgical bond to enhance thermal conduction to a heat sinkAGERE SYSTEMS INC·Filed 2007·Granted Sep 30, 2008·23 cites·10 claims
- 0590US6410435B1Process for fabricating copper interconnect for ULSI integrated circuitsAGERE SYST GUARDIAN CORP·Filed 1999·Granted Jun 25, 2002·92 cites·15 claims
- 0689US6747445B2Stress migration test structure and method thereforAGERE SYSTEMS INC·Filed 2001·Granted Jun 8, 2004·51 cites·41 claims
- 0787US8623758B1Subtractive metal multi-layer barrier layer for interconnect structureGLOBALFOUNDRIES INC·Filed 2012·Granted Jan 7, 2014·8 cites·20 claims
- 0886US8623754B1Repairing anomalous stiff pillar bumpsRYAN VIVIAN W·Filed 2012·Granted Jan 7, 2014·8 cites·24 claims
- 0983US8772158B2Multi-layer barrier layer stacks for interconnect structuresGLOBALFOUNDRIES INC·Filed 2013·Granted Jul 8, 2014·5 cites·30 claims
- 1080US6207547B1Bond pad design for integrated circuitsLUCENT TECHNOLOGIES INC·Filed 1999·Granted Mar 27, 2001·48 cites·8 claims
- 1178US6187658B1Bond pad for a flip chip package, and method of forming the sameLUCENT TECHNOLOGIES INC·Filed 2000·Granted Feb 13, 2001·22 cites·8 claims
- 1277US10755827B1Radiation shieldNORTHROP GRUMMAN SYSTEMS CORP·Filed 2019·Granted Aug 25, 2020·1 cites·20 claims
- 1377US9297775B2Combinatorial screening of metallic diffusion barriersINTERMOLECULAR INC·Filed 2014·Granted Mar 29, 2016·1 cites·20 claims
- 1477US7504728B2Integrated circuit having bond pad with improved thermal and mechanical propertiesAGERE SYSTEMS INC·Filed 2005·Granted Mar 17, 2009·7 cites·20 claims
- 1576US2023411134A1Tapered magnetic ion transport tunnel for particle collectionNORTHROP GRUMMAN SYSTEMS CORP·Filed 2023·Application pending·0 cites
- 1675US8829675B2Repairing anomalous stiff pillar bumpsGLOBALFOUNDRIES INC·Filed 2013·Granted Sep 9, 2014·3 cites·22 claims
- 1775US8664759B2Integrated circuit with heat conducting structures for localized thermal controlRYAN VIVIAN·Filed 2005·Granted Mar 4, 2014·9 cites·21 claims
- 1874US8877633B2Methods of forming a barrier system containing an alloy of metals introduced into the barrier system, and an integrated circuit product containing such a barrier systemGLOBALFOUNDRIES INC·Filed 2013·Granted Nov 4, 2014·3 cites·27 claims
- 1973US6683465B2Integrated circuit having stress migration test structure and method thereforAGERE SYSTEMS INC·Filed 2001·Granted Jan 27, 2004·21 cites·36 claims
- 2070US9021894B2Detecting anomalous weak BEOL sites in a metallization systemRYAN VIVIAN W·Filed 2012·Granted May 5, 2015·3 cites·20 claims
- 2169US11749515B2Tapered magnetic ion transport tunnel for particle collectionNORTHROP GRUMMAN SYSTEMS CORP·Filed 2020·Granted Sep 5, 2023·0 cites·6 claims
- 2267US9269615B2Multi-layer barrier layer for interconnect structureRYAN VIVIAN W·Filed 2012·Granted Feb 23, 2016·2 cites·20 claims
- 2367US6087732ABond pad for a flip-chip packageLUCENT TECHNOLOGIES INC·Filed 1998·Granted Jul 11, 2000·27 cites·14 claims
- 2466US7800879B2On-chip sensor array for temperature management in integrated circuitsAGERE SYSTEMS INC·Filed 2006·Granted Sep 21, 2010·6 cites·20 claims
- 2566US7327029B2Integrated circuit device incorporating metallurigical bond to enhance thermal conduction to a heat sinkAGERE SYSTEMS INC·Filed 2005·Granted Feb 5, 2008·3 cites·10 claims
- 2664US9209135B2Method for reducing wettability of interconnect material at corner interface and device incorporating sameGLOBALFOUNDRIES INC·Filed 2014·Granted Dec 8, 2015·1 cites·20 claims
- 2763US8680681B2Bond pad configurations for controlling semiconductor chip package interactionsRYAN VIVIAN W·Filed 2011·Granted Mar 25, 2014·1 cites·25 claims
- 2863US5930587AStress migration evaluation methodLUCENT TECHNOLOGIES INC·Filed 1997·Granted Jul 27, 1999·27 cites·20 claims
- 2962US9059255B2Methods of forming non-continuous conductive layers for conductive structures on an integrated circuit productGLOBALFOUNDRIES INC·Filed 2013·Granted Jun 16, 2015·1 cites·22 claims
- 3062US8722534B2Method for reducing wettability of interconnect material at corner interface and device incorporating sameZHANG XUNYUAN·Filed 2012·Granted May 13, 2014·1 cites·15 claims
- 3157US5243221AAluminum metallization doped with iron and copper to prevent electromigrationAT & T BELL LAB·Filed 1993·Granted Sep 7, 1993·25 cites·3 claims
- 3257US4826709ADevices involving silicon glassesAMERICAN TELEPHONE & TELEGRAPH·Filed 1988·Granted May 2, 1989·22 cites·13 claims
- 3357US2020152437A1Tapered magnetic ion transport tunnel for particle collectionNORTHROP GRUMMAN SYSTEMS CORP·Filed 2018·Application pending·0 cites
- 3456US9076792B2Multi-layer barrier layer stacks for interconnect structuresGLOBALFOUNDRIES INC·Filed 2014·Granted Jul 7, 2015·0 cites·20 claims
- 3556US6621280B1Method of testing an integrated circuitAGERE SYSTEMS INC·Filed 2000·Granted Sep 16, 2003·5 cites·10 claims
- 3655US8928146B2Bond pad configurations for controlling semiconductor chip package interactionsGLOBALFOUNDRIES INC·Filed 2014·Granted Jan 6, 2015·0 cites·23 claims
- 3753US7973544B2Thermal monitoring and management of integrated circuitsAGERE SYSTEMS INC·Filed 2008·Granted Jul 5, 2011·0 cites·20 claims
- 3852US8728931B2Multi-layer barrier layer for interconnect structureRYAN VIVIAN W·Filed 2012·Granted May 20, 2014·0 cites·21 claims
- 3952US7157365B2Semiconductor device having a dummy conductive via and a method of manufacture thereforAGERE SYSTEMS INC·Filed 2004·Granted Jan 2, 2007·4 cites·9 claims
- 4052US2014217591A1Multi-layer barrier layer for interconnect structureGLOBALFOUNDRIES INC·Filed 2014·Application pending·0 cites
- 4150US7745927B2Heat sink formed of multiple metal layers on backside of integrated circuit dieAGERE SYSTEMS INC·Filed 2004·Granted Jun 29, 2010·5 cites·7 claims
- 4250US7339274B2Metallization performance in electronic devicesAGERE SYSTEMS INC·Filed 2004·Granted Mar 4, 2008·4 cites·27 claims
- 4349US7573097B2Lateral double diffused MOS transistorsAGERE SYSTEMS INC·Filed 2004·Granted Aug 11, 2009·3 cites·20 claims
- 4449US4975389AAluminum metallization for semiconductor devicesAT & T BELL LAB·Filed 1989·Granted Dec 4, 1990·15 cites·3 claims
- 4548US2013334532A1Stress gauge comprised of a piezoelectric material for use with integrated circuit productsZHANG XUNYUAN·Filed 2012·Application pending·0 cites
- 4647US7705473B2Methods and apparatus for determining pad height for a wire-bonding operation in an integrated circuitAGERE SYSTEMS INC·Filed 2006·Granted Apr 27, 2010·0 cites·13 claims
- 4746US6833557B1Integrated circuit and a method of manufacturing an integrated circuitAGERE SYSTEMS INC·Filed 2000·Granted Dec 21, 2004·1 cites·11 claims
- 4844US8950269B2Detecting anomalous stiff pillar bumps formed above a metallization systemRYAN VIVIAN W·Filed 2012·Granted Feb 10, 2015·0 cites·20 claims
- 4941US2015021772A1Mixed-metal barrier films optimized by high-productivity combinatorial PVDINTERMOLECULAR INC·Filed 2013·Application pending·0 cites
- 5039US7056819B2Methods and apparatus for determining pad height for a wire-bonding operation in an integrated circuitAGERE SYSTEMS INC·Filed 2003·Granted Jun 6, 2006·0 cites·19 claims
Showing the top 50 of 55 patent records by PatentIndex Score.
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