Inventor · disambiguated record
Toshinori Kiyohara
Also filed as: KIYOHARA TOSHINORI
9 granted patents·5 pending applications·23 citations·filing 2002–2019
82Inventor score
Technology areasH10W
Top patents by PatentIndex Score
14 records- 0180US9754865B2Semiconductor device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2014·Granted Sep 5, 2017·5 cites·20 claims
- 0276US10515877B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2018·Granted Dec 24, 2019·2 cites·16 claims
- 0374US10910337B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2019·Granted Feb 2, 2021·2 cites·5 claims
- 0457US6894370B2Lead frame and semiconductor device having the same as well as method of resin-molding the sameNEC ELECTRONICS CORP·Filed 2002·Granted May 17, 2005·8 cites·4 claims
- 0556US10777490B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2019·Granted Sep 15, 2020·0 cites·16 claims
- 0654US7239009B2Lead frame and semiconductor device having the same as well as method of resin-molding the sameNEC CORP·Filed 2004·Granted Jul 3, 2007·6 cites·4 claims
- 0749US9257400B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Feb 9, 2016·0 cites·15 claims
- 0848US2017323848A1Semiconductor device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2017·Application pending·0 cites
- 0945US2018122766A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Application pending·0 cites
- 1043US8048718B2Semiconductor device comprising an excess resin portion, manufacturing method thereof, and apparatus for manufacturing semiconductor device comprising a excess resin portionRENESAS ELECTRONICS CORP·Filed 2007·Granted Nov 1, 2011·0 cites·8 claims
- 1142US2016111357A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 1242US2010078803A1Semiconductor flat package device and method for manufacturing the sameNEC ELECTRONICS CORP·Filed 2009·Application pending·0 cites
- 1341US7473990B2Semiconductor device featuring electrode terminals forming superior heat-radiation systemNEC ELECTRONICS CORP·Filed 2006·Granted Jan 6, 2009·0 cites·11 claims
- 1432US2016093561A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →