Inventor · disambiguated record
Manohar S. Konchady
Also filed as: KONCHADY MANOHAR · KONCHADY MANOHAR S
6 granted patents·5 pending applications·35 citations·filing 2013–2024
80Inventor score
Top patents by PatentIndex Score
11 records- 0193US9704735B2Dual side solder resist layers for coreless packages and packages with an embedded interconnect bridge and their methods of fabricationKONCHADY MANOHAR S·Filed 2014·Granted Jul 11, 2017·21 cites·25 claims
- 0287US10629469B2Solder resist layers for coreless packages and methods of fabricationINTEL CORP·Filed 2017·Granted Apr 21, 2020·4 cites·4 claims
- 0380US11443970B2Methods of forming a package substrateINTEL CORP·Filed 2020·Granted Sep 13, 2022·1 cites·7 claims
- 0480US8952532B2Integrated circuit package with spatially varied solder resist opening dimensionZHENG TIEYU·Filed 2013·Granted Feb 10, 2015·7 cites·18 claims
- 0567US9312237B2Integrated circuit package with spatially varied solder resist opening dimensionINTEL CORP·Filed 2014·Granted Apr 12, 2016·2 cites·6 claims
- 0657US2025089156A1Low stress through glass vias (tgvs)INTEL CORP·Filed 2023·Application pending·0 cites
- 0756US2025391717A1Microelectronic assemblies with stacks of glass layersINTEL CORP·Filed 2024·Application pending·0 cites
- 0856US2025391715A1Microelectronic assemblies with glass cores with outer frames and metal pillarsINTEL CORP·Filed 2024·Application pending·0 cites
- 0955US2025374426A1Automated manufacturing of hybrid panelsINTEL CORP·Filed 2024·Application pending·0 cites
- 1053US2025391720A1Integrated circuit packages including substrates with encapsulated glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 1143US8907461B1Heat dissipation device embedded within a microelectronic dieKONCHADY MANOHAR S·Filed 2013·Granted Dec 9, 2014·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →