Assignee
ZHENG TIEYU
US·2 granted patents·2 pending applications·11 citations·filing 2004–2013
Top patents by PatentIndex Score
4 records- 0180US8952532B2Integrated circuit package with spatially varied solder resist opening dimensionZHENG TIEYU·Filed 2013·Granted Feb 10, 2015·7 cites·18 claims
- 0271US8074354B2Method of making a self-balanced dual L-shaped socketZHENG TIEYU·Filed 2008·Granted Dec 13, 2011·4 cites·7 claims
- 0345US2014168909A1Gapped attachment structuresZHENG TIEYU·Filed 2012·Application pending·0 cites
- 0438US2005207458A1Optoelectronic module with integrated coolerZHENG TIEYU·Filed 2004·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →