Inventor · disambiguated record
Ryoichi Ikezawa
Also filed as: IKEZAWA RYOICHI
4 granted patents·8 pending applications·72 citations·filing 1989–2017
76Inventor score
Top patents by PatentIndex Score
12 records- 0192US7544727B2Encapsulant of epoxy resin, curing agent, and secondary aminosilane coupling agent or phosphateHITACHI CHEMICAL CO LTD·Filed 2005·Granted Jun 9, 2009·31 cites·26 claims
- 0277US7397139B2Epoxy resin molding material for sealing use and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2004·Granted Jul 8, 2008·33 cites·25 claims
- 0362US10662315B2Epoxy resin molding material for sealing and electronic component deviceHITACHI CHEMICAL CO LTD·Filed 2017·Granted May 26, 2020·0 cites·4 claims
- 0444US2008039556A1Encapsulated Epoxy-Resin Molding Compound, And Electronic Component DeviceHITACHI CHEMICAL CO LTD·Filed 2005·Application pending·0 cites
- 0539US2014128505A1Epoxy resin molding material for sealing and electronic component deviceHAMADA MITSUYOSHI·Filed 2012·Application pending·0 cites
- 0637US2009062430A1Epoxy Resin Composition for Sealing and Electronic Component DeviceIKEZAWA RYOICHI·Filed 2006·Application pending·0 cites
- 0736US2003201548A1Epoxy resin molding material for sealingFiled 2001·Application pending·0 cites
- 0836US2005222300A1Encapsulating epoxy resin composition, and electronic parts device using the sameIKEZAWA RYOICHI·Filed 2003·Application pending·0 cites
- 0936US2009143511A1Encapsulated epoxy-resin molding compound, and electronic component deviceHITACHI CHEMICAL CO LTD·Filed 2005·Application pending·0 cites
- 1036US2009137717A1Encapsulated epoxy resin composition and electronic component deviceIKEZAWA RYOICHI·Filed 2006·Application pending·0 cites
- 1135US2006014873A1Encapsulating epoxy resin composition, and electronic parts device using the sameIKEZAWA RYOICHI·Filed 2003·Application pending·0 cites
- 1232US5066691AAdhesive composition for metal-clad laminatesHITACHI CHEMICAL CO LTD·Filed 1989·Granted Nov 19, 1991·8 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →