Inventor · disambiguated record
Yuuko Tanaka
Also filed as: TANAKA YUUKO
3 granted patents·7 pending applications·51 citations·filing 2001–2014
71Inventor score
Top patents by PatentIndex Score
10 records- 0185US8119737B2Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2011·Granted Feb 21, 2012·2 cites·10 claims
- 0284US7070670B2Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2001·Granted Jul 4, 2006·46 cites·42 claims
- 0379US7947779B2Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymerHITACHI CHEMICAL CO LTD·Filed 2010·Granted May 24, 2011·3 cites·8 claims
- 0457US2014332984A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2014·Application pending·0 cites
- 0553US2009186955A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2009·Application pending·0 cites
- 0650US2012080808A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2011·Application pending·0 cites
- 0748US2007036971A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2006·Application pending·0 cites
- 0847US2006106166A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2005·Application pending·0 cites
- 0947US2006100315A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2005·Application pending·0 cites
- 1037US2003069331A1Adhesive composition , process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor deviceFiled 2001·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yuuko Tanaka files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →