Inventor · disambiguated record
Michio Uruno
Also filed as: URUNO MICHIO
11 granted patents·9 pending applications·175 citations·filing 2001–2015
92Inventor score
Top patents by PatentIndex Score
20 records- 0195US7875500B2Bonding semiconductor wafer stuck on dicing tape laminated adhesive sheet onto mounting supportHITACHI CHEMICAL CO LTD·Filed 2008·Granted Jan 25, 2011·25 cites·16 claims
- 0294US8617930B2Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor deviceINADA TEIICHI·Filed 2012·Granted Dec 31, 2013·19 cites·13 claims
- 0393US7968195B2Dicing tape laminated with adhesive sheet of polymer, epoxy resin and fillerHITACHI CHEMICAL CO LTD·Filed 2008·Granted Jun 28, 2011·18 cites·15 claims
- 0493US7968194B2Dicing tape laminated with adhesive sheet of polymer, thermosetting resin and fillerHITACHI CHEMICAL CO LTD·Filed 2008·Granted Jun 28, 2011·19 cites·15 claims
- 0588US7517724B2Dicing/die bonding sheetHITACHI CHEMICAL CO LTD·Filed 2005·Granted Apr 14, 2009·22 cites·15 claims
- 0687US8470115B2Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor deviceTANAKA MAIKO·Filed 2011·Granted Jun 25, 2013·8 cites·3 claims
- 0787US8465615B2Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor deviceTANAKA MAIKO·Filed 2011·Granted Jun 18, 2013·8 cites·9 claims
- 0884US7070670B2Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2001·Granted Jul 4, 2006·46 cites·42 claims
- 0978US8017444B2Adhesive sheet, semiconductor device, and process for producing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2005·Granted Sep 13, 2011·8 cites·15 claims
- 1064US9034449B2Adhesive filmHORIUCHI KOUHEI·Filed 2012·Granted May 19, 2015·1 cites·9 claims
- 1154US2013295314A1Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2013·Application pending·0 cites
- 1254US2013302570A1Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2013·Application pending·0 cites
- 1352US9327418B2Adhesive filmHORIUCHI KOUHEI·Filed 2012·Granted May 3, 2016·1 cites·8 claims
- 1452US2008171187A1Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor deviceINADA TEIICHI·Filed 2008·Application pending·0 cites
- 1550US2012135176A1Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor deviceTANAKA MAIKO·Filed 2012·Application pending·0 cites
- 1647US2015239220A1Adhesive filmHITACHI CHEMICAL CO LTD·Filed 2015·Application pending·0 cites
- 1746US2008261039A1Adhesive Sheet and Method for Manufacturing the Same, Semiconductor Device Manufacturing Method and Semiconductor DeviceTANAKA MAIKO·Filed 2005·Application pending·0 cites
- 1843US2011287250A1Adhesive sheet, semiconductor device, and process for producing semiconductor deviceINADA TEIICHI·Filed 2011·Application pending·0 cites
- 1940US2006128065A1Adhesive sheet, dicing tape intergrated type adhesive sheet, and semiconductor device producing methodINADA TEIICHI·Filed 2004·Application pending·0 cites
- 2037US2013048921A1Conductive materialTSURUOKA YASUO·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →