Inventor · disambiguated record
Yehiel Gotkis
Also filed as: GOTKIS YEHIEL
63 granted patents·8 pending applications·802 citations·filing 1998–2014
99Inventor score
Top patents by PatentIndex Score
71 records- 0194US6340326B1System and method for controlled polishing and planarization of semiconductor wafersLAM RES CORP·Filed 2000·Granted Jan 22, 2002·48 cites·13 claims
- 0291US6527870B2Wafer cleaning module and method for cleaning the surface of a substrateLAM RES CORP·Filed 2001·Granted Mar 4, 2003·46 cites·5 claims
- 0390US7010468B2Method and apparatus for slope to threshold conversion for process state monitoring and endpoint detectionLAM RES CORP·Filed 2005·Granted Mar 7, 2006·16 cites·23 claims
- 0489US7528349B1Temperature stabilization for substrate processingKLA TENCOR TECH CORP·Filed 2006·Granted May 5, 2009·16 cites·21 claims
- 0589US6935938B1Multiple-conditioning member device for chemical mechanical planarization conditioningLAM RES CORP·Filed 2004·Granted Aug 30, 2005·34 cites·17 claims
- 0687US6808590B1Method and apparatus of arrayed sensors for metrological controlLAM RES CORP·Filed 2002·Granted Oct 26, 2004·31 cites·18 claims
- 0786US7649365B1Inline inspection of photovoltaics for electrical defectsKLA TENCOR CORP·Filed 2007·Granted Jan 19, 2010·11 cites·1 claims
- 0883US7128803B2Integration of sensor based metrology into semiconductor processing toolsLAM RES CORP·Filed 2002·Granted Oct 31, 2006·28 cites·11 claims
- 0982US6579157B1Polishing pad ironing system and method for implementing the sameLAM RES CORP·Filed 2001·Granted Jun 17, 2003·19 cites·10 claims
- 1082US6386962B1Wafer carrier with groove for decoupling retainer ring from waterLAM RES CORP·Filed 2000·Granted May 14, 2002·27 cites·18 claims
- 1181US7204639B1Method and apparatus for thin metal film thickness measurementLAM RES CORP·Filed 2003·Granted Apr 17, 2007·19 cites·10 claims
- 1281US6705930B2System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniquesLAM RES CORP·Filed 2001·Granted Mar 16, 2004·23 cites·14 claims
- 1381US6375540B1End-point detection system for chemical mechanical posing applicationsLAM RES CORP·Filed 2000·Granted Apr 23, 2002·17 cites·12 claims
- 1480US6984892B2Semiconductor structure implementing low-K dielectric materials and supporting stubsLAM RES CORP·Filed 2001·Granted Jan 10, 2006·23 cites·8 claims
- 1580US6929531B2System and method for metal residue detection and mapping within a multi-step sequenceLAM RES CORP·Filed 2002·Granted Aug 16, 2005·23 cites·24 claims
- 1680US6454637B1Edge instability suppressing device and systemLAM RES CORP·Filed 2000·Granted Sep 24, 2002·24 cites·28 claims
- 1779US7755061B2Dynamic pattern generator with cup-shaped structureKLA TENCOR TECH CORP·Filed 2007·Granted Jul 13, 2010·8 cites·16 claims
- 1879US6468134B1Method and apparatus for slurry distributionLAM RES CORP·Filed 2000·Granted Oct 22, 2002·19 cites·17 claims
- 1978US9214344B1Pillar-supported array of micro electron lensesKLA TENCOR CORP·Filed 2014·Granted Dec 15, 2015·4 cites·20 claims
- 2076US7425501B2Semiconductor structure implementing sacrificial material and methods for making and implementing the sameLAM RES CORP·Filed 2005·Granted Sep 16, 2008·5 cites·6 claims
- 2176US6585572B1Subaperture chemical mechanical polishing systemLAM RES CORP·Filed 2000·Granted Jul 1, 2003·18 cites·22 claims
- 2274US6869337B2System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniquesLAM RES CORP·Filed 2004·Granted Mar 22, 2005·14 cites·10 claims
- 2374US6653224B1Methods for fabricating interconnect structures having Low K dielectric propertiesLAM RES CORP·Filed 2001·Granted Nov 25, 2003·26 cites·19 claims
- 2474US6261158B1Multi-step chemical mechanical polishingSPEEDFAM IPEC·Filed 1998·Granted Jul 17, 2001·57 cites·42 claims
- 2573US7084621B2Enhancement of eddy current based measurement capabilitiesLAM RES CORP·Filed 2002·Granted Aug 1, 2006·10 cites·27 claims
- 2673US6540587B1Infrared end-point detection systemLAM RES CORP·Filed 2000·Granted Apr 1, 2003·15 cites·25 claims
- 2772US8128278B2Methods and apparatus for thin metal film thickness measurementGOTKIS YEHIEL·Filed 2009·Granted Mar 6, 2012·5 cites·7 claims
- 2872US6951503B1System and method for in-situ measuring and monitoring CMP polishing pad thicknessLAM RES CORP·Filed 2004·Granted Oct 4, 2005·19 cites·19 claims
- 2970US6937915B1Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and controlLAM RES CORP·Filed 2002·Granted Aug 30, 2005·11 cites·16 claims
- 3069US6808442B1Apparatus for removal/remaining thickness profile manipulationLAM RES CORP·Filed 2001·Granted Oct 26, 2004·12 cites·22 claims
- 3168US6749491B1CMP belt stretch compensation apparatus and methods for using the sameLAM RES CORP·Filed 2001·Granted Jun 15, 2004·12 cites·16 claims
- 3268US6676493B1Integrated planarization and clean wafer processing systemLAM RES CORP·Filed 2001·Granted Jan 13, 2004·13 cites·22 claims
- 3367US7906972B2Inline inspection of photovoltaics for electrical defectsKLA TENCOR CORP·Filed 2009·Granted Mar 15, 2011·2 cites·12 claims
- 3467US7309618B2Method and apparatus for real time metal film thickness measurementLAM RES CORP·Filed 2003·Granted Dec 18, 2007·10 cites·16 claims
- 3567US7029369B2End-point detection apparatusLAM RES CORP·Filed 2003·Granted Apr 18, 2006·8 cites·16 claims
- 3667US6925348B2Methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and controlLAM RES CORP·Filed 2004·Granted Aug 2, 2005·9 cites·17 claims
- 3767US6866567B2Activated slurry CMP system and methods for implementing the sameLAM RES CORP·Filed 2002·Granted Mar 15, 2005·9 cites·20 claims
- 3866US7945086B2Tungsten plug deposition quality evaluation method by EBACE technologyKLA TENCOR TECH CORP·Filed 2007·Granted May 17, 2011·2 cites·19 claims
- 3963US6767428B1Method and apparatus for chemical mechanical planarizationLAM RES CORP·Filed 2001·Granted Jul 27, 2004·8 cites·13 claims
- 4062US8206508B2Wet surface treatment by usage of a liquid bath containing energy limited bubblesGOTKIS YEHIEL·Filed 2008·Granted Jun 26, 2012·1 cites·22 claims
- 4162US6994609B1Chemical mechanical planarization system with replaceable pad assemblyLAM RES CORP·Filed 2003·Granted Feb 7, 2006·8 cites·13 claims
- 4262US6859765B2Method and apparatus for slope to threshold conversion for process state monitoring and endpoint detectionLAM RES CORP·Filed 2002·Granted Feb 22, 2005·7 cites·23 claims
- 4361US8890066B1Sharp scattering angle trap for electron beam apparatusGOTKIS YEHIEL·Filed 2005·Granted Nov 18, 2014·1 cites·17 claims
- 4461US7875548B2Method for making semiconductor structures implementing sacrificial materialLAM RES CORP·Filed 2008·Granted Jan 25, 2011·1 cites·12 claims
- 4561US6726530B2End-point detection system for chemical mechanical polishing applicationsLAM RES CORP·Filed 2002·Granted Apr 27, 2004·6 cites·13 claims
- 4661US6503129B1Activated slurry CMP system and methods for implementing the sameLAM RES CORP·Filed 2000·Granted Jan 7, 2003·6 cites·14 claims
- 4759US6328042B1Wafer cleaning module and method for cleaning the surface of a substrateLAM RES CORP·Filed 2000·Granted Dec 11, 2001·5 cites·13 claims
- 4858US6788050B2System, method and apparatus for thin-film substrate signal separation using eddy currentLAM RES CORP·Filed 2002·Granted Sep 7, 2004·8 cites·20 claims
- 4958US6719874B1Active retaining ring supportLAM RES CORP·Filed 2001·Granted Apr 13, 2004·7 cites·16 claims
- 5057US7205166B2Method and apparatus of arrayed, clustered or coupled eddy current sensor configuration for measuring conductive film propertiesLAM RES CORP·Filed 2003·Granted Apr 17, 2007·8 cites·8 claims
Showing the top 50 of 71 patent records by PatentIndex Score.
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