Inventor · disambiguated record
James G. Maveety
Also filed as: MAVEETY JAMES · MAVEETY JAMES G
38 granted patents·3 pending applications·683 citations·filing 1996–2016
98Inventor score
Top patents by PatentIndex Score
41 records- 0196US9869714B2Integrated circuit test temperature control mechanismINTEL CORP·Filed 2016·Granted Jan 16, 2018·9 cites·12 claims
- 0296US7428138B2Forming carbon nanotube capacitorsINTEL CORP·Filed 2005·Granted Sep 23, 2008·31 cites·10 claims
- 0396US6650542B1Piezoelectric actuated jet impingement coolingINTEL CORP·Filed 2003·Granted Nov 18, 2003·116 cites·16 claims
- 0495US9400291B2Integrated circuit test temperature control mechanismJOHNSON JOHN C·Filed 2012·Granted Jul 26, 2016·15 cites·18 claims
- 0593US7886813B2Thermal interface material with carbon nanotubes and particlesINTEL CORP·Filed 2005·Granted Feb 15, 2011·29 cites·22 claims
- 0692US7696015B2Method of forming a stack of heat generating integrated circuit chips with intervening cooling integrated circuit chipsINTEL CORP·Filed 2006·Granted Apr 13, 2010·15 cites·9 claims
- 0791US6410982B1Heatpipesink having integrated heat pipe and heat sinkINTEL CORP·Filed 1999·Granted Jun 25, 2002·124 cites·5 claims
- 0889US6785134B2Embedded liquid pump and microchannel cooling systemINTEL CORP·Filed 2003·Granted Aug 31, 2004·54 cites·16 claims
- 0986US8891235B2Thermal interface for multi-chip packagesWALCZYK JOSEPH F·Filed 2012·Granted Nov 18, 2014·13 cites·30 claims
- 1086US6924170B2Diamond-silicon hybrid integrated heat spreaderINTEL CORP·Filed 2003·Granted Aug 2, 2005·34 cites·22 claims
- 1185US9448278B2Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming sameINTEL CORP·Filed 2015·Granted Sep 20, 2016·5 cites·18 claims
- 1285US7911052B2Nanotube based vapor chamber for die level coolingINTEL CORP·Filed 2007·Granted Mar 22, 2011·11 cites·20 claims
- 1384US7335983B2Carbon nanotube micro-chimney and thermo siphon die-level coolingINTEL CORP·Filed 2005·Granted Feb 26, 2008·10 cites·18 claims
- 1483US9347987B2Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming sameSCHROEDER CHRISTOPHER R·Filed 2009·Granted May 24, 2016·13 cites·20 claims
- 1583US7492041B2Diamond-silicon hybrid integrated heat spreaderINTEL CORP·Filed 2005·Granted Feb 17, 2009·9 cites·26 claims
- 1682US9046569B2Seal method for direct liquid cooling of probes used at first level interconnectKIRBY RONALD·Filed 2012·Granted Jun 2, 2015·9 cites·23 claims
- 1782US6906919B2Two-phase pumped liquid loop for mobile computer coolingINTEL CORP·Filed 2003·Granted Jun 14, 2005·34 cites·30 claims
- 1875US8006747B2Micro-chimney and thermosiphon die-level coolingINTEL CORP·Filed 2009·Granted Aug 30, 2011·4 cites·7 claims
- 1975US7545030B2Article having metal impregnated within carbon nanotube arrayINTEL CORP·Filed 2005·Granted Jun 9, 2009·10 cites·26 claims
- 2075US7487822B2Micro-chimney and thermosiphon die-level coolingINTEL CORP·Filed 2005·Granted Feb 10, 2009·4 cites·22 claims
- 2174US6992381B2Using external radiators with electroosmotic pumps for cooling integrated circuitsINTEL CORP·Filed 2003·Granted Jan 31, 2006·16 cites·18 claims
- 2274US6981849B2Electro-osmotic pumps and micro-channelsINTEL CORP·Filed 2002·Granted Jan 3, 2006·20 cites·16 claims
- 2367US8125075B2Carbon nanotube micro-chimney and thermo siphon die-level coolingMAVEETY JAMES G·Filed 2008·Granted Feb 28, 2012·4 cites·6 claims
- 2467US7449780B2Apparatus to minimize thermal impedance using copper on die backsideINTEL CORP·Filed 2003·Granted Nov 11, 2008·11 cites·17 claims
- 2567US7084495B2Electroosmotic pumps using porous frits for cooling integrated circuit stacksINTEL CORP·Filed 2003·Granted Aug 1, 2006·7 cites·24 claims
- 2667US5948204AWafer carrier ring method and apparatus for chemical-mechanical planarizationINTEL CORP·Filed 1996·Granted Sep 7, 1999·45 cites·14 claims
- 2766US8505613B2Die having a via filled with a heat-dissipating materialCHRYSLER GREGORY M·Filed 2011·Granted Aug 13, 2013·1 cites·6 claims
- 2866US6988531B2Micro-chimney and thermosiphon die-level coolingINTEL CORP·Filed 2002·Granted Jan 24, 2006·9 cites·27 claims
- 2961US8404519B2Process that includes assembling together first and second substrates the have respective first and second carbon nanotube arrays with geometrically complementary patternsCHRYSLER GREGORY M·Filed 2011·Granted Mar 26, 2013·2 cites·8 claims
- 3060US7576432B2Using external radiators with electroosmotic pumps for cooling integrated circuitsINTEL CORP·Filed 2005·Granted Aug 18, 2009·1 cites·15 claims
- 3157US7964447B2Process of making carbon nanotube array that includes impregnating the carbon nanotube array with metalINTEL CORP·Filed 2009·Granted Jun 21, 2011·3 cites·8 claims
- 3255US7021891B2Micro-impeller miniature centrifugal compressorINTEL CORP·Filed 2002·Granted Apr 4, 2006·8 cites·18 claims
- 3353US9406582B2Apparatus to minimize thermal impedance using copper on die backsideHUA FAY·Filed 2008·Granted Aug 2, 2016·0 cites·18 claims
- 3450US2007278668A1Packaged electroosmotic pumps using porous frits for cooling integrated circuitsKIM SARAH E·Filed 2007·Application pending·0 cites
- 3550US2008305603A1Forming carbon nanotube capacitorsMOSLEY LARRY E·Filed 2008·Application pending·0 cites
- 3648US7274106B2Packaged electroosmotic pumps using porous frits for cooling integrated circuitsINTEL CORP·Filed 2003·Granted Sep 25, 2007·2 cites·14 claims
- 3744US7723208B2Integrated re-combiner for electroosmotic pumps using porous fritsINTEL CORP·Filed 2003·Granted May 25, 2010·0 cites·3 claims
- 3843US8623705B2Nanotube based vapor chamber for die level coolingVADAKKANMARUVEEDU UNNIKRISHNAN·Filed 2011·Granted Jan 7, 2014·0 cites·14 claims
- 3943US2007297151A1Compliant conductive interconnectsMOSLEY LARRY E·Filed 2006·Application pending·0 cites
- 4032US6490167B1Semiconductor package ejectorINTEL CORP·Filed 1999·Granted Dec 3, 2002·4 cites·24 claims
- 4130US6350136B1Method and apparatus for a pin clampINTEL CORP·Filed 1998·Granted Feb 26, 2002·1 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →