Assignee
HUA FAY
US·3 granted patents·3 pending applications·42 citations·filing 2008–2017
Top patents by PatentIndex Score
6 records- 0194US8441118B2Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packagesHUA FAY·Filed 2009·Granted May 14, 2013·37 cites·3 claims
- 0274US7560373B1Low temperature solder metallurgy and process for packaging applications and structures formed therebyHUA FAY·Filed 2008·Granted Jul 14, 2009·5 cites·20 claims
- 0353US9406582B2Apparatus to minimize thermal impedance using copper on die backsideHUA FAY·Filed 2008·Granted Aug 2, 2016·0 cites·18 claims
- 0449US2008153210A1Electronic assembly having an indium wetting layer on a thermally conductive bodyHUA FAY·Filed 2008·Application pending·0 cites
- 0545US2008293188A1Reactive solder materialHUA FAY·Filed 2008·Application pending·0 cites
- 0640US2018233710A1Wearable device platform apparatus and methodHUA FAY·Filed 2017·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when HUA FAY files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →